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Resinlab® EP1300 Clear Unfilled Electronic Grade Epoxy Encapsulant

Category Polymer , Thermoset , Epoxy , Epoxy Encapsulant, Unreinforced
Manufacturer Resinlab®
Trade Name
Port Ningbo port,China
Trade Terms FOB, CFR, CIF
Payment Terms L/C, T/T, Western Union
Download PDF Resinlab® EP1300 Clear Unfilled Electronic Grade Epoxy Encapsulant.pdf
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Material Notes:
Resinlab™ EP1300 Clear (Formerly Lab Product W092602) is a two part unfilled electronic grade epoxy encapsulant designed for small to medium sized castings. It has a pot life of about one hour and cures quickly to a tack free handle strength at room temperature within 3 to 4 hours reaching a tough, semi-rigid state within 48 hours. Cure can be accelerated by the addition of heat. Times and temperatures from ½ hour at 100°C to 1 hour at 80°C or 4 hours at 50°C fill bring the product to full cure. It has good wetting and adhesion to most surfaces and is free flowing to penetrate voids and give good air release. It has very good resistance to water, acids and bases and most organic solvents.Information Provided by Resinlab L.L.C., an Ellsworth Adhesives Company.
Physical Properties Metric English Comments
Specific Gravity 0.960 g/cc
0.960 g/cc
Part B; TM R050-16
1.06 g/cc
1.06 g/cc
Mixed; TM R050-16
1.16 g/cc
1.16 g/cc
Part A; TM R050-16
Water Absorption 0.29 %

@Time 86400 sec
0.29 %

@Time 24.0 hour
TM R050-35
Viscosity 5000 cP
5000 cP
Part B, RVT, #5, 2.5 rpm; TM R050-12
10000 cP
10000 cP
Mixed; TM R050-12
16000 cP
16000 cP
Part A, RVT, #6, 2.5 rpm; TM R050-12
Mechanical Properties Metric English Comments
Hardness, Shore D 80
80
TM R050-17
Tensile Strength at Break 26.2 MPa
3800 psi
TM R050-36
Tensile Strength, Ultimate 27.6 MPa
4000 psi
TM R050-36
Tensile Strength, Yield 12.4 MPa
1800 psi
TM R050-36
Elongation at Break 6.0 - 12 %
6.0 - 12 %
TM R050-36
Tensile Modulus 1.38 GPa
200 ksi
TM R050-36
Compressive Yield Strength 44.8 MPa
6500 psi
TM R050-38
Compressive Strength 117 MPa
17000 psi
Ultimate; TM R050-38
117 MPa
17000 psi
Break; TM R050-38
Compressive Modulus 1.38 GPa
200 ksi
TM R050-38
Adhesive Bond Strength 6.89 MPa
1000 psi
Lap shear; 2024 T3 Al Abraded / MEK Wipe; TM R050-37
Peel Strength 0.351 kN/m
2.00 pli
Al to Al
Thermal Properties Metric English Comments
CTE, linear 80.0 µm/m-°C

@Temperature <=112 °C
44.4 µin/in-°F

@Temperature <=234 °F
below Tg
180 µm/m-°C

@Temperature >=112 °C
100 µin/in-°F

@Temperature >=234 °F
above Tg
Thermal Conductivity 0.180 W/m-K
1.25 BTU-in/hr-ft²-°F
Maximum Service Temperature, Air 150 °C
302 °F
Minimum Service Temperature, Air -40.0 °C
-40.0 °F
Glass Transition Temp, Tg 112 °C
234 °F
TM R050-25
Optical Properties Metric English Comments
Transmission, Visible 90 %
90 %
clear; thickness not quantified
Electrical Properties Metric English Comments
Volume Resistivity 4.10e+14 ohm-cm
4.10e+14 ohm-cm
Dielectric Constant 3.5

@Frequency 100 Hz,
Temperature 25.0 °C
3.5

@Frequency 100 Hz,
Temperature 77.0 °F
Dielectric Strength 33.5 kV/mm
850 kV/in
Processing Properties Metric English Comments
Pot Life 45 - 60 min
45 - 60 min
Mass: 100g; TM R050-19
Descriptive Properties Value Comments
Color Clear
Mix Ratio 1:1
Volume
100:85
Weight
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