Master Bond Supreme 11AN Two Component, Heat Resistant Epoxy Adhesive

Description: Master Bond Polymer Adhesive System Supreme 11AN is a two component thermally conductive heat resistant epoxy adhesive with a one-to-one mix ratio, by weight or volume. It readily develops a high bond strength of 1580 psi at room temperature. Master Bond Polymer Adhesive Supreme 11AN can be applied without sagging or dripping even on vertical surfaces. It produces durable high strength and tough bonds which are resistant to thermal cycling and chemicals including water, oil and most organic solvents, over the wide temperature range of -100°F up to 250°F. Adhesion to metals, glass, ceramic, wood, vulcanized rubbers and many plastics is excellent. The hardened adhesive exhibits high thermal conductivity and is a superior electrical insulator. The thermal expansion coefficient is low. The color of the mixed compound is light gray. Master Bond Supreme 11AN adhesive is widely used in the electronic, electrical computer, metalworking, appliance, automotive and chemical industries due to its combination of high peel and high shear strength. A lower viscosity version with the same thermal conductivity called Supreme 11ANLV is also available. Product Advantages: Convenient mixing; non-critical mixing ratio (part A/part B: 100/100), by weight or volume. Easy application; contact pressure only required for cure; adhesive spreads evenly and smoothly; No-drip application feature. Versatile cure schedules; ambient temperature cure or faster elevated temperature cures as required.High bonding strength to similar and dissimilar substrates in both peel and shear. Superior durability, thermal shock and chemical resistance, high electrical insulation properties. Highest thermal conductivity plus thermal stability for service up to +250°F.Information provided by MasterBond®