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Master Bond EP30AN-1 Low Viscosity, NASA Low Outgassing Epoxy

Category Polymer , Adhesive , Thermoset , Epoxy , Epoxy Adhesive
Manufacturer Master Bond Inc.
Trade Name
Port Ningbo port,China
Trade Terms FOB, CFR, CIF
Payment Terms L/C, T/T, Western Union
Download PDF Master Bond EP30AN-1 Low Viscosity, NASA Low Outgassing Epoxy.pdf
Price EMAIL US    sales@lookpolymers.com
  Online Service   lookpolymers   27660005
Material Notes:
Description: Master Bond EP30AN-1 is a two part epoxy for high performance potting, sealing, coating and bonding featuring high thermal conductivity, excellent electrical insulation properties and NASA low outgassing approval. It will cure at room temperature or more rapidly at elevated temperatures. Other properties include dimensional stability and good physical strength properties. Its low viscosity and excellent flow characteristics make it an ideal thermally conductive potting epoxy. EP30AN-1 is also an excellent adhesive/sealant forming durable, rigid bonds that resist to thermal cycling and chemicals including water, oils, etc. over the wide temperature range of -60°F to +250°F. The coefficient of thermal expansion is desirably low. The color of Part A is gray and Part B is clear. Master Bond EP30AN-1 is widely used in applications where thermal conductivity, electrical isolation and low outgassing properties are required. It is particularly well suited to high vacuum environments. Product Advantages: Easy application: adhesive spreads or pours evenly and smoothly. Versatile cure schedules: ambient temperature cures or fast elevated temperature cures as required. High bond strength to a wide variety of substrates; excellent adhesive properties. Exceptionally high thermal conductivity with excellent electrical insulation properties. Good physical strength characteristics; especially high compressive strength. Meets NASA low outgassing specificationsKey Features Thermally conductive Electrically insulative Low thermal expansion coefficient NASA approved for low outgassing applications Low viscosity with excellent flowability Dimensional stabilityInformation provided by MasterBond®
Physical Properties Metric English Comments
Viscosity 300 - 400 cP
300 - 400 cP
Part B
10000 - 18000 cP
10000 - 18000 cP
Part A
Mechanical Properties Metric English Comments
Hardness, Shore D 85 - 90
85 - 90
Tensile Strength at Break >= 41.4 MPa
>= 6000 psi
Compressive Strength >= 103 MPa
>= 15000 psi
Shear Strength >= 6.21 MPa
>= 900 psi
Tensile lap, Al to Al
Thermal Properties Metric English Comments
CTE, linear 20.0 - 25.0 µm/m-°C
11.1 - 13.9 µin/in-°F
Thermal Conductivity 3.60 W/m-K
25.0 BTU-in/hr-ft²-°F
Maximum Service Temperature, Air 121 °C
250 °F
Minimum Service Temperature, Air -51.1 °C
-60.0 °F
Electrical Properties Metric English Comments
Volume Resistivity 4.80e+14 ohm-cm
4.80e+14 ohm-cm
Dielectric Constant 6.4

@Frequency 60.0 Hz,
Temperature 25.0 °C
6.4

@Frequency 60.0 Hz,
Temperature 77.0 °F
Dielectric Strength 16.5 kV/mm

@Thickness 3.17 mm
420 kV/in

@Thickness 0.125 in
Processing Properties Metric English Comments
Cure Time 120 - 180 min

@Temperature 93.3 °C
2.00 - 3.00 hour

@Temperature 200 °F
2880 - 4320 min

@Temperature 23.9 °C
48.0 - 72.0 hour

@Temperature 75.0 °F
Pot Life 30 - 45 min
30 - 45 min
100 gram batch
Shelf Life 6.00 Month

@Temperature 23.9 °C
6.00 Month

@Temperature 75.0 °F
in original unopened container
Descriptive Properties Value Comments
Mixing Ratio (A to B) 10:1
by weight
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