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- Master Bond EP21NDLO Low Outgassing, Room Temperature Curing Two Component Epoxy
Master Bond EP21NDLO Low Outgassing, Room Temperature Curing Two Component Epoxy
| Category | Polymer , Adhesive , Thermoset , Epoxy , Epoxy Adhesive |
| Manufacturer | Master Bond Inc. |
| Trade Name | |
| Port | Shanghai port,China |
| Trade Terms | FOB, CFR, CIF |
| Payment Terms | L/C, T/T, Western Union |
| Download PDF | Master Bond EP21NDLO Low Outgassing, Room Temperature Curing Two Component Epoxy.pdf  |
| Price | EMAIL US sales@lookpolymers.com |
Material Notes:
Master Bond EP21ND-LO is a two component, room temperature curing epoxy system for bonding, sealing and coating featuring outstanding physical properties. EP21ND-LO has a convenient one to one mix ratio by weight. It has a paste-like viscosity after mixing. EP21ND-LO can be applied without sagging or dripping even on vertical surfaces. EP21ND-LO produces high strength, durable bonds which hold up well to thermal cycling and resist many chemicals.
| Mechanical Properties | Metric | English | Comments |
|---|---|---|---|
| Hardness, Shore D | >= 70 | >= 70 | |
| Tensile Strength | >= 51.7 MPa | >= 7500 psi | |
| Elongation at Break | >= 5.0 % | >= 5.0 % | |
| Tensile Modulus | >= 2.07 GPa | >= 300 ksi | |
| Compressive Strength | >= 68.9 MPa | >= 10000 psi | |
| Adhesive Bond Strength | >= 17.2 MPa | >= 2500 psi | shear, Al/Al |
| Thermal Properties | Metric | English | Comments |
|---|---|---|---|
| CTE, linear | 50.0 - 55.0 µm/m-°C | 27.8 - 30.6 µin/in-°F | |
| Maximum Service Temperature, Air | 121 °C | 250 °F | |
| Minimum Service Temperature, Air | -51.1 °C | -60.0 °F |
| Electrical Properties | Metric | English | Comments |
|---|---|---|---|
| Volume Resistivity | >= 1.00e+14 ohm-cm | >= 1.00e+14 ohm-cm | |
| Dielectric Constant | 2.92 @Frequency 60.0 Hz |
2.92 @Frequency 60.0 Hz |
| Processing Properties | Metric | English | Comments |
|---|---|---|---|
| Cure Time | 120 - 180 min @Temperature 93.3 °C |
2.00 - 3.00 hour @Temperature 200 °F |
|
| 720 - 1440 min @Temperature 23.9 °C |
12.0 - 24.0 hour @Temperature 75.0 °F |
plus 2 hrs at 150-200°F | |
| 2880 - 4320 min @Temperature 23.9 °C |
48.0 - 72.0 hour @Temperature 75.0 °F |
||
| Pot Life | 90 - 120 min | 90 - 120 min | 100 gram mass |
| Shelf Life | 12.0 Month @Temperature 23.9 °C |
12.0 Month @Temperature 75.0 °F |
in original unopened containers |
| Descriptive Properties | Value | Comments |
|---|---|---|
| Mixing Ratio (A to B) | 1:1 | |
| Viscosity | Paste | Mixed compound, 75°F |
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