| Category | Polymer , Adhesive , Thermoset , Epoxy , Epoxy Adhesive |
| Manufacturer | Devcon |
| Trade Name | |
| Port | Shanghai port,China |
| Trade Terms | FOB, CFR, CIF |
| Payment Terms | L/C, T/T, Western Union |
| Download PDF | Devcon Zip Patch™ Epoxy.pdf |
| Price | EMAIL US sales@lookpolymers.com |
| Physical Properties | Metric | English | Comments |
|---|---|---|---|
| Density | 1.15 g/cc | 0.0415 lb/in³ | |
| Viscosity | 17000 cP | 17000 cP | with hardener |
| Mechanical Properties | Metric | English | Comments |
|---|---|---|---|
| Hardness, Shore D | 75 | 75 | ASTM D2240 |
| Tensile Strength, Ultimate | 69.6 MPa | 10100 psi | ASTM D638 |
| Modulus of Elasticity | 2.00 GPa | 290 ksi | In Tension; ASTM D638 |
| Flexural Yield Strength | 131 MPa | 19000 psi | ASTM D790 |
| Adhesive Bond Strength | 31.7 MPa | 4600 psi | Adhesive tensile shear strength; ASTM D1002 |
| Thermal Properties | Metric | English | Comments |
|---|---|---|---|
| CTE, linear | 115 µm/m-°C @Temperature 20.0 °C |
63.9 µin/in-°F @Temperature 68.0 °F |
ASTM D696 |
| Thermal Conductivity | 0.715 W/m-K | 4.96 BTU-in/hr-ft²-°F | ASTM C177 |
| Maximum Service Temperature, Air | 93.3 °C | 200 °F | Operating Temperature |
| Shrinkage | 0.10 % | 0.10 % | During Cure; ASTM D2566 |
| Electrical Properties | Metric | English | Comments |
|---|---|---|---|
| Dielectric Constant | 43.5 | 43.5 | ASTM D150 |
| Dielectric Strength | 9.84 kV/mm | 250 kV/in | ASTM D149 |
| Processing Properties | Metric | English | Comments |
|---|---|---|---|
| Processing Temperature | 21.1 °C | 70.0 °F | |
| Pot Life | 5.00 min @Temperature 23.9 °C |
5.00 min @Temperature 75.0 °F |