Epoxy Technology EPO-TEK® N20E Electrically Conductive Paste

Category	Polymer , Thermoset , Epoxy , Epoxy, Electrically Conductive
Manufacturer	Epoxy Technology
Trade Name	EPO-TEK®
Port	Ningbo port,China
Trade Terms	FOB, CFR, CIF
Payment Terms	L/C, T/T, Western Union
Download PDF	Epoxy Technology EPO-TEK® N20E Electrically Conductive Paste.pdf
Price	EMAIL US sales@lookpolymers.com
	Online Service lookpolymers 27660005

Material Notes:

Product Description: EPO-TEK® N20E is a two component, electrically and thermally conductive, epoxy adhesive designed for semiconductor and electronics assembly. Its applications and field conditions include the optical, sensor, consumer, and industrial industries.Advantages & Application Notes: Pot life of more than one day allows for mass production and minimal waste.A convenient, simple 1:1 mix ratio allows for specialty packaging including double-barrel syringes, or BIPAX.Suggested applications:PCB / Electronics: EMI and Rf shielding of Rf and Microwave devices.Opto-electronics: IR, digital imaging, and sensor device interconnects.Versatility in cure allows for low temperature, box oven, SMT tunnel oven, hand held, or snap curing techniques to be realized.Thixotropic nature allows for deposition methods like dispensing, screen printing, stamping, or other patterning techniques.Information Provided by Epoxy Technology

Physical Properties	Metric	English	Comments
Specific Gravity	2.86 g/cc	2.86 g/cc	Part B
	2.93 g/cc	2.93 g/cc	Part A
Particle Size	<= 45 µm	<= 45 µm
Viscosity	5000 - 10000 cP @Temperature 23.0 °C	5000 - 10000 cP @Temperature 73.4 °F	20 rpm

Mechanical Properties	Metric	English	Comments
Hardness, Shore D	50	50
Tensile Modulus	7.874 GPa	1142 ksi	Storage
Shear Strength	>= 23.4 MPa	>= 3400 psi	Die

Thermal Properties	Metric	English	Comments
CTE, linear	27.0 µm/m-°C	15.0 µin/in-°F	Below Tg
	89.0 µm/m-°C	49.4 µin/in-°F	Above Tg
Thermal Conductivity	1.19 W/m-K	8.26 BTU-in/hr-ft²-°F
Maximum Service Temperature, Air	200 °C	392 °F	Continuous
	300 °C	572 °F	Intermittent
Minimum Service Temperature, Air	-55.0 °C	-67.0 °F	Continuous
	-55.0 °C	-67.0 °F	Intermittent
Glass Transition Temp, Tg	>= 70.0 °C	>= 158 °F	Dynamic Cure 20—200°C /ISO 25 Min; Ramp -10—200°C @ 20°C/Min
Decomposition Temperature	478 °C	892 °F	Degradation Temperature

Electrical Properties	Metric	English	Comments
Volume Resistivity	<= 0.070 ohm-cm	<= 0.070 ohm-cm

Chemical Properties	Metric	English
Ionic Impurities - Na (Sodium)	265 ppm	265 ppm
Ionic Impurities - K (Potassium)	10 ppm	10 ppm
Ionic Impurities - Cl (Chloride)	34 ppm	34 ppm

Processing Properties	Metric	English	Comments
Cure Time	5.00 min @Temperature 150 °C	0.0833 hour @Temperature 302 °F	Minimum Bond Line
	15.0 min @Temperature 120 °C	0.250 hour @Temperature 248 °F	Minimum Bond Line
Pot Life	2160 min	2160 min
Shelf Life	12.0 Month @Temperature 25.0 °C	12.0 Month @Temperature 77.0 °F

Descriptive Properties	Value	Comments
Color	Dark Grey	Part A
	Dark Grey	Part B
Consistency	Smooth Paste
Ionic Impurities NH4	16 ppm
Mix Ratio By Weight	1:1
Number of Components	Two
Thixotropic Index	1.9
Weight Loss	0.07%	200°C
	0.22%	250°C
	0.81%	300°C

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