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Epoxy Technology EPO-TEK® N20E Electrically Conductive Paste

Category Polymer , Thermoset , Epoxy , Epoxy, Electrically Conductive
Manufacturer Epoxy Technology
Trade Name EPO-TEK®
Port Ningbo port,China
Trade Terms FOB, CFR, CIF
Payment Terms L/C, T/T, Western Union
Download PDF Epoxy Technology EPO-TEK® N20E Electrically Conductive Paste.pdf
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Material Notes:
Product Description: EPO-TEK® N20E is a two component, electrically and thermally conductive, epoxy adhesive designed for semiconductor and electronics assembly. Its applications and field conditions include the optical, sensor, consumer, and industrial industries.Advantages & Application Notes: Pot life of more than one day allows for mass production and minimal waste.A convenient, simple 1:1 mix ratio allows for specialty packaging including double-barrel syringes, or BIPAX.Suggested applications:PCB / Electronics: EMI and Rf shielding of Rf and Microwave devices.Opto-electronics: IR, digital imaging, and sensor device interconnects.Versatility in cure allows for low temperature, box oven, SMT tunnel oven, hand held, or snap curing techniques to be realized.Thixotropic nature allows for deposition methods like dispensing, screen printing, stamping, or other patterning techniques.Information Provided by Epoxy Technology
Physical Properties Metric English Comments
Specific Gravity 2.86 g/cc
2.86 g/cc
Part B
2.93 g/cc
2.93 g/cc
Part A
Particle Size <= 45 µm
<= 45 µm
Viscosity 5000 - 10000 cP

@Temperature 23.0 °C
5000 - 10000 cP

@Temperature 73.4 °F
20 rpm
Mechanical Properties Metric English Comments
Hardness, Shore D 50
50
Tensile Modulus 7.874 GPa
1142 ksi
Storage
Shear Strength >= 23.4 MPa
>= 3400 psi
Die
Thermal Properties Metric English Comments
CTE, linear 27.0 µm/m-°C
15.0 µin/in-°F
Below Tg
89.0 µm/m-°C
49.4 µin/in-°F
Above Tg
Thermal Conductivity 1.19 W/m-K
8.26 BTU-in/hr-ft²-°F
Maximum Service Temperature, Air 200 °C
392 °F
Continuous
300 °C
572 °F
Intermittent
Minimum Service Temperature, Air -55.0 °C
-67.0 °F
Continuous
-55.0 °C
-67.0 °F
Intermittent
Glass Transition Temp, Tg >= 70.0 °C
>= 158 °F
Dynamic Cure 20—200°C /ISO 25 Min; Ramp -10—200°C @ 20°C/Min
Decomposition Temperature 478 °C
892 °F
Degradation Temperature
Electrical Properties Metric English Comments
Volume Resistivity <= 0.070 ohm-cm
<= 0.070 ohm-cm
Chemical Properties Metric English Comments
Ionic Impurities - Na (Sodium) 265 ppm
265 ppm
Ionic Impurities - K (Potassium) 10 ppm
10 ppm
Ionic Impurities - Cl (Chloride) 34 ppm
34 ppm
Processing Properties Metric English Comments
Cure Time 5.00 min

@Temperature 150 °C
0.0833 hour

@Temperature 302 °F
Minimum Bond Line
15.0 min

@Temperature 120 °C
0.250 hour

@Temperature 248 °F
Minimum Bond Line
Pot Life 2160 min
2160 min
Shelf Life 12.0 Month

@Temperature 25.0 °C
12.0 Month

@Temperature 77.0 °F
Descriptive Properties Value Comments
Color Dark Grey
Part A
Dark Grey
Part B
Consistency Smooth Paste
Ionic Impurities NH4 16 ppm
Mix Ratio By Weight 1:1
Number of Components Two
Thixotropic Index 1.9
Weight Loss 0.07%
200°C
0.22%
250°C
0.81%
300°C
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