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- Lord Adhesives Thermosetâ„¢ ME-541 Underfill Encapsulant
Lord Adhesives Thermosetâ„¢ ME-541 Underfill Encapsulant
| Category | Polymer , Thermoset , Epoxy , Epoxy Encapsulant, Unreinforced |
| Manufacturer | Lord Adhesives |
| Trade Name | Thermoset™ |
| Port | Shanghai port,China |
| Trade Terms | FOB, CFR, CIF |
| Payment Terms | L/C, T/T, Western Union |
| Download PDF | Lord Adhesives Thermosetâ„¢ ME-541 Underfill Encapsulant.pdf  |
| Price | EMAIL US sales@lookpolymers.com |
Material Notes:
LORD Thermoset™ ME-541 encapsulant is an anhydride free, high purity, semi-conductor grade epoxy underfill product developed for the encapsulation of densely populated area array flip chip devices. It is formulated with the necessary structural strength to handle overmolding processes.Thermoset ME-541 encapsulant is engineered to withstand 260°C peak reflow temperatures of lead-free solders.All information provided by Lord.
| Physical Properties | Metric | English | Comments |
|---|---|---|---|
| Specific Gravity | 1.53 g/cc | 1.53 g/cc | |
| Water Absorption | <= 0.90 % | <= 0.90 % | |
| Viscosity | 35000 cP @Temperature 25.0 °C |
35000 cP @Temperature 77.0 °F |
TA Rheometer |
| Mechanical Properties | Metric | English | Comments |
|---|---|---|---|
| Modulus of Elasticity | 5.50 GPa | 798 ksi | Storage |
| Shear Strength | 60.0 MPa | 8700 psi | Die |
| Thermal Properties | Metric | English | Comments |
|---|---|---|---|
| CTE, linear | 32.0 µm/m-°C | 17.8 µin/in-°F | Alpha 1 |
| 100 µm/m-°C | 55.6 µin/in-°F | Alpha 2 | |
| Glass Transition Temp, Tg | 145 °C | 293 °F | TMA |
| Component Elements Properties | Metric | English | Comments |
|---|---|---|---|
| Potassium, K | <= 0.00010 % | <= 0.00010 % | |
| Sodium, Na | <= 0.00010 % | <= 0.00010 % |
| Electrical Properties | Metric | English | Comments |
|---|---|---|---|
| Volume Resistivity | 5.30e+15 ohm-cm @Temperature 25.0 °C |
5.30e+15 ohm-cm @Temperature 77.0 °F |
| Processing Properties | Metric | English | Comments |
|---|---|---|---|
| Cure Time | 15.0 min @Temperature 165 °C |
0.250 hour @Temperature 329 °F |
|
| 90.0 min @Temperature 150 °C |
1.50 hour @Temperature 302 °F |
||
| Pot Life | 1440 min @Temperature 25.0 °C |
1440 min @Temperature 77.0 °F |
|
| Gel Time | 3.00 min @Temperature 150 °C |
3.00 min @Temperature 302 °F |
|
| Shelf Life | 6.00 Month @Temperature -40.0 °C |
6.00 Month @Temperature -40.0 °F |
| Descriptive Properties | Value | Comments |
|---|---|---|
| Appearance | Black | |
| Chloride (%) | < 0.0045 | |
| Consistency | Liquid |
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