- HOME
- POLYMER SEARCH
- Thermoset
- Epoxy
- Epoxy Encapsulant, Unreinforced
- Lord Adhesives CircuitSAFâ„¢ ME-456 Epoxy Dam Encapsulant
Lord Adhesives CircuitSAFâ„¢ ME-456 Epoxy Dam Encapsulant
| Category | Polymer , Thermoset , Epoxy , Epoxy Encapsulant, Unreinforced |
| Manufacturer | Lord Adhesives |
| Trade Name | CircuitSAF™ |
| Port | Shanghai port,China |
| Trade Terms | FOB, CFR, CIF |
| Payment Terms | L/C, T/T, Western Union |
| Download PDF | Lord Adhesives CircuitSAFâ„¢ ME-456 Epoxy Dam Encapsulant.pdf  |
| Price | EMAIL US sales@lookpolymers.com |
Material Notes:
CircuitSAFâ„¢ ME-456 is a one component, high purity, fast cure, semiconductor grade epoxy encapsulant dam material developed for use in the encapsulation of wire bonded and flip devices where a dam in needed to restrict the flow of a cavity fill encapsulant. It has a high viscosity with a high thixotropic index that can be dispensed around the perimeter of the area to be encapsulated. Once CircuitSAFâ„¢ ME-456 has been dispensed, the area inside the dam can be encapsulated with Lord's Cavity Fill Encapsulant, CircuitSAFâ„¢ ME-455, and both materials can be cured at the same time.All information provided by Lord.
| Physical Properties | Metric | English | Comments |
|---|---|---|---|
| Specific Gravity | 1.80 g/cc | 1.80 g/cc | |
| Water Absorption | 0.60 % @Temperature 100 °C, Time 86400 sec |
0.60 % @Temperature 212 °F, Time 24.0 hour |
|
| Brookfield Viscosity | 1.10e+6 cP @Temperature 25.0 °C |
1.10e+6 cP @Temperature 77.0 °F |
Spindle #7 @ 1rpm |
| Mechanical Properties | Metric | English | Comments |
|---|---|---|---|
| Modulus of Elasticity | 6.00 GPa | 870 ksi | DMA |
| Thermal Properties | Metric | English | Comments |
|---|---|---|---|
| CTE, linear | 19.0 µm/m-°C | 10.6 µin/in-°F | Alpha 1; ASTM D3386 |
| 60.0 µm/m-°C | 33.3 µin/in-°F | Alpha 2; ASTM D3386 | |
| Glass Transition Temp, Tg | 135 °C | 275 °F | DSC; ASTM D3418 |
| Component Elements Properties | Metric | English | Comments |
|---|---|---|---|
| Potassium, K | <= 0.00010 % | <= 0.00010 % | |
| Sodium, Na | <= 0.00050 % | <= 0.00050 % |
| Electrical Properties | Metric | English | Comments |
|---|---|---|---|
| Dielectric Constant | 3.6 @Frequency 1.00e+6 Hz |
3.6 @Frequency 1.00e+6 Hz |
ASTM D150-98 |
| Dissipation Factor | 0.0060 @Frequency 1.00e+6 Hz |
0.0060 @Frequency 1.00e+6 Hz |
ASTM D150-98 |
| Processing Properties | Metric | English | Comments |
|---|---|---|---|
| Cure Time | 30.0 min @Temperature 150 °C |
0.500 hour @Temperature 302 °F |
|
| Pot Life | 2160 min @Temperature 25.0 °C |
2160 min @Temperature 77.0 °F |
|
| Gel Time | 4.00 min @Temperature 150 °C |
4.00 min @Temperature 302 °F |
|
| Shelf Life | 6.00 Month @Temperature -40.0 °C |
6.00 Month @Temperature -40.0 °F |
| Descriptive Properties | Value | Comments |
|---|---|---|
| Chloride (%) | < 0.0005 | |
| Thixotropic Index | 4.7 |
Users viewing this material also viewed the following:
- MV Labs YB200 YbBr3·6H2O Ytterbium bromide hydrate
- BASF Capron® GR20 HS 20% Glass-Filled Nylon 6 (Dry) (discontinued **)
- PolyOne Nymax™ GF 1200 A 43 HS Natural Polyamide 66 (Nylon 66)
- Ineos ABS Centrex® 401 AES Extrusion (discontinued **)
- Sinotek Materials MD-8 Graphite Emulsion
- CTC X-PRO CTC PP 2015 Polypropylene Impact Copolymer
- BASF Morpholine
- Ravago Manufacturing Americas Hylac® GP30G ABS, 30% Glass Fiber Reinforced
Copyright © lookpolymers.com All Rights Reserved