Lord Adhesives CircuitSAFâ„¢ ME-456 Epoxy Dam Encapsulant

Category	Polymer , Thermoset , Epoxy , Epoxy Encapsulant, Unreinforced
Manufacturer	Lord Adhesives
Trade Name	CircuitSAF™
Port	Shanghai port,China
Trade Terms	FOB, CFR, CIF
Payment Terms	L/C, T/T, Western Union
Download PDF	Lord Adhesives CircuitSAFâ„¢ ME-456 Epoxy Dam Encapsulant.pdf
Price	EMAIL US sales@lookpolymers.com
	Online Service lookpolymers 27660005

Material Notes:

CircuitSAFâ„¢ ME-456 is a one component, high purity, fast cure, semiconductor grade epoxy encapsulant dam material developed for use in the encapsulation of wire bonded and flip devices where a dam in needed to restrict the flow of a cavity fill encapsulant. It has a high viscosity with a high thixotropic index that can be dispensed around the perimeter of the area to be encapsulated. Once CircuitSAFâ„¢ ME-456 has been dispensed, the area inside the dam can be encapsulated with Lord's Cavity Fill Encapsulant, CircuitSAFâ„¢ ME-455, and both materials can be cured at the same time.All information provided by Lord.

Physical Properties	Metric	English	Comments
Specific Gravity	1.80 g/cc	1.80 g/cc
Water Absorption	0.60 % @Temperature 100 Â°C, Time 86400 sec	0.60 % @Temperature 212 Â°F, Time 24.0 hour
Brookfield Viscosity	1.10e+6 cP @Temperature 25.0 Â°C	1.10e+6 cP @Temperature 77.0 Â°F	Spindle #7 @ 1rpm

Mechanical Properties	Metric	English	Comments
Modulus of Elasticity	6.00 GPa	870 ksi	DMA

Thermal Properties	Metric	English	Comments
CTE, linear	19.0 Âµm/m-Â°C	10.6 Âµin/in-Â°F	Alpha 1; ASTM D3386
	60.0 Âµm/m-Â°C	33.3 Âµin/in-Â°F	Alpha 2; ASTM D3386
Glass Transition Temp, Tg	135 Â°C	275 Â°F	DSC; ASTM D3418

Component Elements Properties	Metric	English	Comments
Potassium, K	<= 0.00010 %	<= 0.00010 %
Sodium, Na	<= 0.00050 %	<= 0.00050 %

Electrical Properties	Metric	English	Comments
Dielectric Constant	3.6 @Frequency 1.00e+6 Hz	3.6 @Frequency 1.00e+6 Hz	ASTM D150-98
Dissipation Factor	0.0060 @Frequency 1.00e+6 Hz	0.0060 @Frequency 1.00e+6 Hz	ASTM D150-98

Processing Properties	Metric	English
Cure Time	30.0 min @Temperature 150 Â°C	0.500 hour @Temperature 302 Â°F
Pot Life	2160 min @Temperature 25.0 Â°C	2160 min @Temperature 77.0 Â°F
Gel Time	4.00 min @Temperature 150 Â°C	4.00 min @Temperature 302 Â°F
Shelf Life	6.00 Month @Temperature -40.0 Â°C	6.00 Month @Temperature -40.0 Â°F

Descriptive Properties	Value	Comments
Chloride (%)	< 0.0005
Thixotropic Index	4.7

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