Material Notes:
Product Description: EPO-TEK® H31 is a single component, silver-filled, electrically conductive epoxy designed for semiconductor die attach applications found in hybrids, JEDEC, and opto-electronic packaging.Advantages & Application Notes: Bright /shiny silver provides high reflectance, especially good for enhancing LED overall brightness.Creamy thixotropic paste allows for high volume dispensing and pin transfer methods of application.Available in several different viscosity versions.Suggested applications:Semiconductor: die attach chips onto lead-frames for JEDEC Level III and II packaging. Adhesion to Ag-spot lead-frame.Hybrids: GaAs and Si die attach, adhesion to Au-plated chips, general electrical contacts for ceramic circuits, substrate attach to ground package.Opto-electronic: single LED packaging in TO-cans, LED arrays on PCB or substrate, adhesion to ITO in LCDs, and sensor device/OEM instrumentation.PCB/General: EMI or Rf shielding of electronics.Passes NASA low outgassing standard ASTM E595 with proper cure Long pot-life, up to 28 days, yields low waste between manufacturing shifts and avoids higher cost dry ice shipmentsInformation Provided by Epoxy Technology