Category | Polymer , Thermoset , Epoxy , Epoxy Molding Compound |
Manufacturer | |
Trade Name | |
Port | Ningbo port,China |
Trade Terms | FOB, CFR, CIF |
Payment Terms | L/C, T/T, Western Union |
Download PDF | Cookson Group Plaskon® SMT-B-1F Epoxy Molding Compound for PBGAs (discontinued **).pdf |
Price | EMAIL US sales@lookpolymers.com |
Physical Properties | Metric | English | Comments |
---|---|---|---|
Density | 1.91 g/cc | 0.0690 lb/in³ | |
Viscosity | 7000 cP @Temperature 175 °C |
7000 cP @Temperature 347 °F |
Shimadzu Viscosity, 1000 psi |
Spiral Flow | 79.0 cm | 31.1 in | 175°C/1000 psi |
Mechanical Properties | Metric | English | Comments |
---|---|---|---|
Hardness, Shore D | 82 | 82 | |
Flexural Strength | 68.0 MPa | 9860 psi | |
Flexural Modulus | 15.0 GPa | 2180 ksi |
Thermal Properties | Metric | English | Comments |
---|---|---|---|
CTE, linear | 12.0 µm/m-°C @Temperature 20.0 °C |
6.67 µin/in-°F @Temperature 68.0 °F |
|
CTE, linear, Transverse to Flow | 57.0 µm/m-°C @Temperature 20.0 °C |
31.7 µin/in-°F @Temperature 68.0 °F |
|
Thermal Conductivity | 0.700 W/m-K | 4.86 BTU-in/hr-ft²-°F | |
Glass Transition Temp, Tg | 220 °C | 428 °F | |
Flammability, UL94 | V-0 @Thickness 3.20 mm |
V-0 @Thickness 0.126 in |
|
V-0 @Thickness 3.20 mm |
V-0 @Thickness 0.126 in |
Electrical Properties | Metric | English | Comments |
---|---|---|---|
Electrical Resistivity | 3.20e+16 ohm-cm | 3.20e+16 ohm-cm | |
Dielectric Constant | 3.9 @Frequency 1000 Hz |
3.9 @Frequency 1000 Hz |
|
Dielectric Strength | 28.0 kV/mm | 711 kV/in |
Processing Properties | Metric | English | Comments |
---|---|---|---|
Processing Temperature | 170 - 185 °C | 338 - 365 °F | Molding temperature |