Cookson Group Plaskon® 2929BNSC Epoxy Molding Compound (discontinued **)

Category	Polymer , Thermoset , Epoxy , Epoxy Molding Compound
Manufacturer
Trade Name
Port	Shanghai port,China
Trade Terms	FOB, CFR, CIF
Payment Terms	L/C, T/T, Western Union
Download PDF	Cookson Group Plaskon® 2929BNSC Epoxy Molding Compound (discontinued **).pdf
Price	EMAIL US sales@lookpolymers.com

Material Notes:

Test specimens were transfer molded and post cured 4 hours at 175°C.An epoxy molding compound for the encapsulation of semiconductor devices and fiber optics. Excellent moldability (good release, minimal flash and bleed, and good hot hardness); Superior cosmetics and markability; Outstanding reliability

Physical Properties	Metric	English	Comments
Density	1.92 g/cc	0.0694 lb/in³
Spiral Flow	66.0 - 90.0 cm	26.0 - 35.4 in	177°C/1000 psi

Mechanical Properties	Metric	English
Hardness, Shore D	80	80
Flexural Strength	124 MPa	18000 psi
Flexural Modulus	14.0 GPa	2030 ksi

Thermal Properties	Metric	English
CTE, linear, Parallel to Flow	27.0 µm/m-°C @Temperature 20.0 °C	15.0 µin/in-°F @Temperature 68.0 °F
CTE, linear, Transverse to Flow	80.0 µm/m-°C @Temperature 20.0 °C	44.4 µin/in-°F @Temperature 68.0 °F
Thermal Conductivity	0.900 W/m-K	6.25 BTU-in/hr-ft²-°F
Glass Transition Temp, Tg	145 °C	293 °F
Flammability, UL94	V-0 @Thickness 1.60 mm	V-0 @Thickness 0.0630 in
	V-0 @Thickness 1.60 mm	V-0 @Thickness 0.0630 in

Electrical Properties	Metric	English
Dielectric Constant	4.2 @Frequency 1000 Hz	4.2 @Frequency 1000 Hz
Dielectric Strength	17.0 kV/mm	432 kV/in
Dissipation Factor	0.0040 @Frequency 1000 Hz	0.0040 @Frequency 1000 Hz
Arc Resistance	180 sec	180 sec

Processing Properties	Metric	English	Comments
Processing Temperature	171 - 193 °C	340 - 379 °F	Molding temperature

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