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Armstrong C-1/H20 Epoxy Adhesive

Category	Polymer , Adhesive , Thermoset , Epoxy , Epoxy Encapsulant, Unreinforced
Manufacturer	Armstrong Epoxy Adhesives; Resin Technology Group
Trade Name
Port	Ningbo port,China
Trade Terms	FOB, CFR, CIF
Payment Terms	L/C, T/T, Western Union
Download PDF	Armstrong C-1/H20 Epoxy Adhesive.pdf
Price	EMAIL US sales@lookpolymers.com
	Online Service lookpolymers 27660005

Material Notes:

A versatile, low viscosity, unfilled resin used for electrical potting and laminating applications. It is an excellent insulator, and provides outstanding chemical resistance to most compoundsInformation provided by Ellsworth Adhesives.

Physical Properties	Metric	English	Comments
Viscosity	2200 cP	2200 cP	Mixed

Mechanical Properties	Metric	English	Comments
Hardness, Shore D	80	80
Tensile Strength, Ultimate	53.1 MPa	7700 psi	after optimum cure
Elongation at Break	4.8 %	4.8 %
Adhesive Bond Strength	43.4 MPa	6300 psi	Steel-Steel; after optimum cure
	7.58 MPa @Temperature 82.2 °C	1100 psi @Temperature 180 °F	Aluminum-Aluminum tensile shear
	16.2 MPa @Temperature 25.0 °C	2350 psi @Temperature 77.0 °F	Aluminum-Aluminum tensile shear
	16.9 MPa @Temperature -54.4 °C	2450 psi @Temperature -66.0 °F	Aluminum-Aluminum tensile shear

Thermal Properties	Metric	English	Comments
CTE, linear	36.0 µm/m-°C @Temperature 20.0 °C	20.0 µin/in-°F @Temperature 68.0 °F
Glass Transition Temp, Tg	79.0 °C	174 °F

Processing Properties	Metric	English	Comments
Processing Temperature	22.2 °C	72.0 °F
	73.9 °C	165 °F	Optimum cure is 2 hr. @ 165°F
	149 °C	300 °F	Fast cure is 30 min. @ 300°F
Pot Life	<= 40.0 min @Temperature 25.0 °C	<= 40.0 min @Temperature 77.0 °F	100 g

Descriptive Properties	Value	Comments
Color	Amber
Mix Ratio	3/1	By Weight

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