Parker Chomerics CHO-BOND 4660 Conductive Caulk/Sealant

Category	Polymer , Adhesive , Thermoset
Manufacturer	Parker Chomerics
Trade Name	CHO-BOND
Port	Shanghai port,China
Trade Terms	FOB, CFR, CIF
Payment Terms	L/C, T/T, Western Union
Download PDF	Parker Chomerics CHO-BOND 4660 Conductive Caulk/Sealant.pdf
Price	EMAIL US sales@lookpolymers.com
	Online Service lookpolymers 27660005

Material Notes:

CHO-BOND® 4660 caulking compound is a single-component, electrically conductive, paste-like material intended for EMI shielding and grounding applications. Its non-hardening characteristic makes it particularly suited for shielding joints and seams which are likely to be disassembled, or joints subject to vibrations, warping, or temperature induced displacement.Applications: This is an excellent compound for grounding building conduits and for shielding bulkhead feed-thru fittings, access panels, and temporary structures. It may also be applied to conduit threads to make them EMI tight.Information provided by Chomerics

Physical Properties	Metric	English	Comments
Specific Gravity	1.70 - 2.30 g/cc	1.70 - 2.30 g/cc
Density	2.00 g/cc	0.0723 lb/in³
Volatile Organic Compounds (VOC) Content	323 g/l	323 g/l
Thickness	>= 381 microns	>= 15.0 mil	DC

Thermal Properties	Metric	English	Comments
Maximum Service Temperature, Air	100 °C	212 °F
Minimum Service Temperature, Air	-55.0 °C	-67.0 °F

Electrical Properties	Metric	English	Comments
Volume Resistivity	<= 0.080 ohm-cm	<= 0.080 ohm-cm

Processing Properties	Metric	English	Comments
Cure Time	10100 min @Temperature 23.0 °C	168 hour @Temperature 73.4 °F
Shelf Life	6.00 Month	6.00 Month	unopened tubes or cans

Descriptive Properties	Value	Comments
Binder	Polyisobutylene
Consistency	Gritty Paste
Coverage	12.8 cm² / g
Filler	Ag/Cu
Mix Ratio	1-part
Working Life	0.5 hr

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