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Parker Chomerics CHO-BOND 4660 Conductive Caulk/Sealant

Category Polymer , Adhesive , Thermoset
Manufacturer Parker Chomerics
Trade Name CHO-BOND
Port Shanghai port,China
Trade Terms FOB, CFR, CIF
Payment Terms L/C, T/T, Western Union
Download PDF Parker Chomerics CHO-BOND 4660 Conductive Caulk/Sealant.pdf
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Material Notes:
CHO-BOND® 4660 caulking compound is a single-component, electrically conductive, paste-like material intended for EMI shielding and grounding applications. Its non-hardening characteristic makes it particularly suited for shielding joints and seams which are likely to be disassembled, or joints subject to vibrations, warping, or temperature induced displacement.Applications: This is an excellent compound for grounding building conduits and for shielding bulkhead feed-thru fittings, access panels, and temporary structures. It may also be applied to conduit threads to make them EMI tight.Information provided by Chomerics
Physical Properties Metric English Comments
Specific Gravity 1.70 - 2.30 g/cc
1.70 - 2.30 g/cc
Density 2.00 g/cc
0.0723 lb/in³
Volatile Organic Compounds (VOC) Content 323 g/l
323 g/l
Thickness >= 381 microns
>= 15.0 mil
DC
Thermal Properties Metric English Comments
Maximum Service Temperature, Air 100 °C
212 °F
Minimum Service Temperature, Air -55.0 °C
-67.0 °F
Electrical Properties Metric English Comments
Volume Resistivity <= 0.080 ohm-cm
<= 0.080 ohm-cm
Processing Properties Metric English Comments
Cure Time 10100 min

@Temperature 23.0 °C
168 hour

@Temperature 73.4 °F
Shelf Life 6.00 Month
6.00 Month
unopened tubes or cans
Descriptive Properties Value Comments
Binder Polyisobutylene
Consistency Gritty Paste
Coverage 12.8 cm2 / g
Filler Ag/Cu
Mix Ratio 1-part
Working Life 0.5 hr
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