Category | Polymer , Adhesive , Thermoset , Silicone , Silicone, RTV, Adhesive/Sealant Grade |
Manufacturer | Aptek Laboratories |
Trade Name | |
Port | Shanghai port,China |
Trade Terms | FOB, CFR, CIF |
Payment Terms | L/C, T/T, Western Union |
Download PDF | Aptek 2712-A/B Very low stress silicone adhesive.pdf |
Price | EMAIL US sales@lookpolymers.com |
Physical Properties | Metric | English | Comments |
---|---|---|---|
Density | 1.15 g/cc | 0.0415 lb/in³ | A Component; ASTM D1475 |
1.15 g/cc | 0.0415 lb/in³ | B Component; ASTM D1475 | |
Outgassing - Total Mass Loss | 0.55 % | 0.55 % | at 10E-6 torr; ASTM E595 |
Collected Volatile Condensable Material | 0.050 % | 0.050 % | at 10E-6 torr; ASTM E595 |
Mechanical Properties | Metric | English | Comments |
---|---|---|---|
Hardness, Shore A | 16 | 16 | Cured property; ASTM D2240 |
Tensile Strength, Ultimate | 4.14 MPa @Thickness 1.47 mm |
600 psi @Thickness 0.0580 in |
Cured; ASTM D638 |
Elongation at Break | 700 % | 700 % | Cured property; ASTM D638 |
Adhesive Bond Strength | 2.76 MPa | 400 psi | Al-to-Al Lap Shear; Cured property;5 mil bondline thickness on primed aluminum panels; ASTM D1002 |
Tear Strength | 23.7 kN/m | 135 pli | ASTM D624 |
Thermal Properties | Metric | English | Comments |
---|---|---|---|
CTE, linear | 54.0 µm/m-°C @Temperature 20.0 °C |
30.0 µin/in-°F @Temperature 68.0 °F |
Cured property; alpha 1 |
235 µm/m-°C @Temperature 20.0 °C |
131 µin/in-°F @Temperature 68.0 °F |
Cured property; alpha 2 | |
Maximum Service Temperature, Air | 260 °C | 500 °F | |
Minimum Service Temperature, Air | -110 °C | -166 °F | |
Glass Transition Temp, Tg | -110 °C | -166 °F | Cured property; Perkin Elmer TMS-2 |
Flash Point | >= 150 °C | >= 302 °F | A Component; ASTM D92 |
>= 150 °C | >= 302 °F | B Component; ASTM D92 |
Electrical Properties | Metric | English | Comments |
---|---|---|---|
Volume Resistivity | 1.00e+15 ohm-cm | 1.00e+15 ohm-cm | Cured property; ASTM D257 |
Dielectric Strength | 13.8 kV/mm @Thickness 6.35 mm |
350 kV/in @Thickness 0.250 in |
Cured; ASTM D149 |
Processing Properties | Metric | English | Comments |
---|---|---|---|
Processing Temperature | 25.0 °C | 77.0 °F | Cure Time not defined |
65.0 °C | 149 °F | Cure 1 hrs | |
100 °C | 212 °F | Cure 0.5 hrs. |