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Polymer Property : Cure Time = 2.00 hour Product List
Processing PropertiesTips: 30 items are displayed at most. For the rest of the results, please contact customer service.
| Processing Properties | Metric | English | Comments |
|---|---|---|---|
| Cure Time | 60.0 - 120 min @Temperature 65.0 °C |
1.00 - 2.00 hour @Temperature 149 °F |
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| NextGen Adhesives G907-25 Optical Epoxy Adhesive Description: NGAC G907-25 is a low viscosity and clear adhesive system that is specifically formulated for optical and laser applications.Advantages and Applications: The NGAC G907-25 provides high .. |
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| Cure Time | 60.0 - 120 min @Temperature 25.0 °C |
1.00 - 2.00 hour @Temperature 77.0 °F |
De-mold Time |
| Northstar Polymers MPP-F07A Easy Hand-Mixable/Pourable Flexible Foam This foam formulation is designed to make molded flexible foam parts/sheets/dies/blocks by hand-mixing with very basic tools such as a cup and stir stick. The components are low-viscosity stable li.. |
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| Cure Time | 60.0 - 120 min @Temperature 177 °C |
1.00 - 2.00 hour @Temperature 351 °F |
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| Henkel Hysol PL 7000 Film Adhesive Epoxy film adhesive formulated to provide excellent performance properties in composite bonding, and has excellent results on composite surfaces that have been exposed to bond shop environments and .. |
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| Cure Time | 90.0 - 120 min @Temperature 121 °C |
1.50 - 2.00 hour @Temperature 250 °F |
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| Henkel Hysol PL 7000 Film Adhesive Epoxy film adhesive formulated to provide excellent performance properties in composite bonding, and has excellent results on composite surfaces that have been exposed to bond shop environments and .. |
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| Cure Time | 60.0 - 120 min @Temperature 93.3 - 98.9 °C |
1.00 - 2.00 hour @Temperature 200 - 210 °F |
first |
| Master Bond EP112LS Two part, heat curing epoxy for potting, encapsulation, coating, sealing and impregnation Master Bond EP112LS is a low viscosity two component epoxy resin system for potting, encapsulation, sealing, coating and impregnation. The mix ratio is an easy to use 100:80 by weight. EP112LS offer.. |
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| Cure Time | 60.0 - 120 min @Temperature 23.9 °C |
1.00 - 2.00 hour @Temperature 75.0 °F |
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| Master Bond EP21TDCF-3 Two Component, Higher Viscosity Epoxy System Product Description: Master Bond EP21TDCF-3 is a two component epoxy for high performance bonding and sealing. It is formulated to cure rapidly at room temperature or faster at elevated temperatures.. |
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| Cure Time | 60.0 - 120 min @Temperature 93.3 °C |
1.00 - 2.00 hour @Temperature 200 °F |
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| Master Bond EP21TDCS Silver Filled Electrically Conductive Epoxy Compound Master Bond Polymer System EP21TDCS is a two component, silver filled, electrically conductive adhesive for high performance bonding and sealing formulated to cure at room temperature or more rapidl.. |
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| Cure Time | 60.0 - 120 min @Temperature 93.3 °C |
1.00 - 2.00 hour @Temperature 200 °F |
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| Master Bond EP21TDCS Two Component Silver Conductive Epoxy Adhesive Master Bond Polymer System EP21TDCS is a two component, silver filled, electrically conductive adhesive for high performance bonding and sealing formulated to cure at room temperature or more rapidl.. |
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| Cure Time | 60.0 - 120 min @Temperature 93.3 °C |
1.00 - 2.00 hour @Temperature 200 °F |
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| Master Bond EP30 Optically Clear, Low Viscosity Two Component Epoxy Master Bond Polymer System EP30 is a low viscosity, two component epoxy system for high performance bonding, coating, sealing, potting and encapsulation. It readily cures at room temperature or more.. |
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| Cure Time | 60.0 - 120 min @Temperature 93.3 °C |
1.00 - 2.00 hour @Temperature 200 °F |
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| Master Bond EP30AOHT Dimensionally Stable, Two Component Epoxy Description: Master Bond Polymer System EP30AOHT is a two component epoxy resin system for high performance bonding, potting, sealing and coating, formulated to cure at room temperature or more rapi.. |
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| Cure Time | 60.0 - 120 min @Temperature 93.3 °C |
1.00 - 2.00 hour @Temperature 200 °F |
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| Master Bond EP75-1 Graphite Filled Electrically Conductive Epoxy System Master Bond Polymer System EP75-1 is a two component, graphite filled, electrically conductive epoxy for high performance bonding, sealing and coating formulated to cure at room temperature or more .. |
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| Cure Time | 60.0 - 120 min @Temperature >=79.4 °C |
1.00 - 2.00 hour @Temperature >=175 °F |
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| Master Bond MB600G Aqueous Based Electrically Conductive Sodium Silicate Coating Master Bond MB600G is an aqueous based, sodium silicate system with graphite filler. It is intended for use in applications where moderate shielding effectiveness is required and cost is a more sign.. |
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| Cure Time | 60.0 - 120 min @Temperature 93.3 °C |
1.00 - 2.00 hour @Temperature 200 °F |
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| Master Bond SteelMaster 43HT Stainless Steel Filled Two Component Epoxy System Master Bond Steelmaster 43HT is a high performance, stainless steel filled two component epoxy resin system for the cost effective repair, maintenance, rebuilding, restoring and resealing of worn or.. |
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| Cure Time | 60.0 - 120 min @Temperature 125 °C |
1.00 - 2.00 hour @Temperature 257 °F |
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| Tra-Con Tra-Bond 933-2 Moisture Resistant Chip Encapsulant TRA-BOND 933-2 one component, highly filled, electrically insulating epoxy encapsulant is designed for encapsulating microelectronic chips. This epoxy provides excellent environmental and mechanical.. |
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| Cure Time | 60.0 - 120 min @Temperature 65.0 °C |
1.00 - 2.00 hour @Temperature 149 °F |
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| Tra-Con Tra-Bond F110 Optically Transparent Low Viscosity Epoxy Adhesive TRA-BOND F110 is a rigid, optically clear adhesive with a very low viscosity. This room temperature curing system is an excellent choice for thin bond-line assembly and repair applications of prisms.. |
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| Cure Time | 60.0 - 120 min @Temperature 65.0 °C |
1.00 - 2.00 hour @Temperature 149 °F |
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| Trelleborg Emerson & Cuming Eccobond® 24 LV General Purpose Catalyst Emerson & Cuming 24 LV Eccobond® General Purpose CatalystFaster curing, shorter working life version of 23 LV. Recommended for small mass castings due to higher exotherm. Cure Type: Room Temp or He.. |
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| Cure Time | 60.0 - 120 min @Temperature 93.3 °C |
1.00 - 2.00 hour @Temperature 200 °F |
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| Master Bond EP27 Low Temperature Curing Two Component Epoxy Master Bond Polymer System EP27 is a unique two component
epoxy formulation offers relatively fast cures at temperatures as low as 40°F and below, with curing times much shorter than currently exis.. |
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| Cure Time | 60.0 - 120 min @Temperature 93.3 °C |
1.00 - 2.00 hour @Temperature 200 °F |
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| Master Bond EP30-2 Low Outgassing, Low Viscosity Two Component Epoxy Master Bond Polymer System EP30-2 is a low viscosity, two component epoxy resin compound for high performance bonding, laminating and sealing formulated to cure at room temperature or more rapidly a.. |
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| Cure Time | 60.0 - 120 min @Temperature 93.3 °C |
1.00 - 2.00 hour @Temperature 200 °F |
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| Master Bond EP33ND Epoxy Paste Resists Harsh Chemicals Description: Master Bond EP33ND is a two part, room temperature curing epoxy system used for bonding, sealing and coating featuring high temperature resistance, good dimensional stability and very g.. |
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| Cure Time | 60.0 - 120 min @Temperature 93.3 °C |
1.00 - 2.00 hour @Temperature 200 °F |
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| Master Bond Supreme 11AO Electrically Isolating Adhesive and Sealant Description: Master Bond Polymer System SURPEME 11AO is a two component epoxy resin system for high performance bonding and sealing formulated to cure at room temperature or more rapidly at elevated.. |
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| Cure Time | 60.0 - 120 min @Temperature 93.3 °C |
1.00 - 2.00 hour @Temperature 200 °F |
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| Master Bond Supreme 11HT-LO Adhesive and Sealant Serviceable to +400°F Description: Master Bond Polymer System Supreme 11HT-LO is an easy to use two part epoxy adhesive/sealant combining both high shear and high peel strengths along with a relatively fast cure at room .. |
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| Cure Time | 60.0 - 120 min @Temperature 65.0 °C |
1.00 - 2.00 hour @Temperature 149 °F |
|
| Tra-Con Tra-Bond 2115 Clear High Strength Epoxy Adhesive TRA-BOND 2115 is a clear, low viscosity epoxy formulation used in the fabrication of lasers. It is capable of withstanding 30 seconds of 60 watt direct laser energy. The low cure shrinkage (using a .. |
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| Cure Time | 60.0 - 120 min @Temperature 65.0 °C |
1.00 - 2.00 hour @Temperature 149 °F |
|
| Tra-Con Tra-Bond FDA12WH01 Food and Drug Application Epoxy Adhesive TRA-BOND FDA12 WH01 is a medium viscosity epoxy resin system specifically developed for bonding and coating applications in accordance with Title 21, U.S. Code of Federal Regulations, Food and Drug .. |
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| Cure Time | 60.0 - 120 min @Temperature 82.222 - 98.889 °C |
1.00 - 2.00 hour @Temperature 180.00 - 210.00 °F |
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| Abatron AboTar 8607-1 Solventless Tar-Epoxy Compound AboTar 8607-1 is a 2-part tar-epoxy lower cost system for filling and leveling pot holes and grossly uneven flooring. It can be used neat or with sand or aggregates. Uses: Resurfacing concrete and .. |
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| Cure Time | 60.0 - 120 min @Temperature 150 - 160 °C |
1.00 - 2.00 hour @Temperature 302 - 320 °F |
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| Abatron AboCast 8103-14 One-Component Epoxy AboCast 8103-14 is the lowest-viscosity one-component epoxy system with heavy-duty structural and dielectric properties. It is clear and has maximum wetting and penetration. Suggested Uses: Casting.. |
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| Cure Time | 60.0 - 120 min @Temperature 150 - 160 °C |
1.00 - 2.00 hour @Temperature 302 - 320 °F |
|
| Abatron AboCast 8501-6 One-Component Epoxy AboCast 8501-6 is a clear, high-temperature one-component epoxy system for very high-temperature uses. It offers the highest heat resistance of the clear resins. Suggested Uses: Casting; Potting; E.. |
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| Cure Time | 60.0 - 120 min @Temperature 150 - 160 °C |
1.00 - 2.00 hour @Temperature 302 - 320 °F |
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| Abatron AboCast 8504-1 One-Component Epoxy AboCast 8504-1 is a clear, all-purpose one-component epoxy system, with an optimum balance of properties for most casting, adhesive, impregnation, and coating applications. |
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| Cure Time | 60.0 - 120 min @Temperature 65.0 °C |
1.00 - 2.00 hour @Temperature 149 °F |
|
| Atom Adhesives AA-BOND F110 Epoxy Adhesive AA-BOND F110 is a rigid, optically clear adhesive with a very low viscosity. AA-BOND F110 is room temperature system an excellent choice for thin bond-line assembly and repair applications of prisms.. |
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| Cure Time | 60.0 - 120 min @Temperature 93.3 °C |
1.00 - 2.00 hour @Temperature 200 °F |
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| Master Bond EP33LV Epoxy Has Dimensional Stability and Machinability Description: Master Bond EP33LV is a two part, room temperature curing epoxy system used for bonding, sealing and coating featuring high temperature resistance, good dimensional stability and very g.. |
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