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Polymer Property : Cure Time = 0.250 hour Product List
Processing PropertiesTips: 30 items are displayed at most. For the rest of the results, please contact customer service.
| Processing Properties | Metric | English | Comments |
|---|---|---|---|
| Cure Time | 15.0 min @Temperature 23.0 °C |
0.250 hour @Temperature 73.4 °F |
M10 steel, handling strength |
| Permabond HL126 Anaerobic Threadlocker PERMABOND® HL126 Threadlocker is a water thin product for locking pre-assembled parts through wicking action. PERMABOND® HL126 Threadlocker prevents vibration loosening. Because of the low viscosi.. |
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| Cure Time | 15.0 min @Temperature 23.0 °C |
0.250 hour @Temperature 73.4 °F |
Aluminum, handling strength |
| Permabond HL138 Anaerobic Retaining Compound Permabond® HL138 is a single component liquid that cures only when in contact with metal parts and oxygen is excluded. The liquid adhesive fills the “air space” between parts and upon cure which .. |
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| Cure Time | 15.0 min @Temperature 23.0 °C |
0.250 hour @Temperature 73.4 °F |
M10 steel, handling strength |
| Permabond LM113 Anaerobic Threadlocker Permabond® LM113 Threadlocker is a medium viscosity product for locking small threaded fasteners, such as screws and bolts or hydraulic fittings that might require disassembly. Due to its thixotrop.. |
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| Cure Time | 15.0 min @Temperature 165 °C |
0.250 hour @Temperature 329 °F |
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| Lord Adhesives Thermosetâ„¢ ME-531 Underfill Encapsulant LORD Thermosetâ„¢ ME-531 encapsulant is a high purity, semiconductor grade epoxy underfill product developed for the encapsulation of flip chip devices. It is formulated to reduce warpage and wit.. |
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| Cure Time | 15.0 min @Temperature 100 °C |
0.250 hour @Temperature 212 °F |
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| Gwent Electronic Materials C2000904P3 Platinum Ink It can be used on partially stabilized zirconia and tape cast Materials. The Platinum powder contained within this paste has low shrinkage and high adhesion to ceramic substrates. Screen Printing E.. |
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| Cure Time | 15.0 min @Temperature 80.0 °C |
0.250 hour @Temperature 176 °F |
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| Gwent Electronic Materials C2030408P3 Carbon Graphite Ink This product is designed to be used for screen printing working electrodes. This is a carbon/graphite ink which has been optimized to give superior electrochemical performance and contains Cobalt Ph.. |
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| Cure Time | 15.0 min @Temperature 130 °C |
0.250 hour @Temperature 266 °F |
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| Gwent Electronic Materials D2070412D3 Polymer Dielectric Green colored screen printable polymer dielectric, suitable for defining electrode areas and forms a protective layer over the electrode tracking during immersion of the electrode. The formulation .. |
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| Cure Time | 15.0 min @Temperature 130 °C |
0.250 hour @Temperature 266 °F |
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| Gwent Electronic Materials D2081009D6 Polymer Dielectric Transparent green colored screen printable polymer dielectric, suitable for defining electrode areas and forms a protective layer over the electrode tracking during immersion of the electrode. The .. |
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| Cure Time | 15.0 min @Temperature 150 °C |
0.250 hour @Temperature 302 °F |
|
| Momentive Performance Materials LVG342A Low Volatile Silicone Adhesive Component, White LVG342 low volatile silicone adhesive is a two component, thixotropic silicone adhesive that cures very quickly at elevated temperatures to a durable elastomer. LV342 was specifically developed for.. |
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| Cure Time | 15.0 min @Temperature 90.0 °C |
0.250 hour @Temperature 194 °F |
1 drop applications |
| Tra-Con Tra-Bond F113SC High Tg Fiber Optic Epoxy Adhesive TRA-BOND F113SC is a room temperature curing, high Tg and low viscosity adhesive formulated for terminating ALL TYPES of fiber optic connectors. It has also been used for bonding LED displays, lense.. |
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| Cure Time | 15.0 min @Temperature 90.0 °C |
0.250 hour @Temperature 194 °F |
1 drop applications |
| Tra-Con Tra-Bond F118 Fiber Optic Epoxy Adhesive TRA-BOND F118 is an impact resistant, fiber-optic adhesive designed for use in any optical connector. This two-part epoxy remains at a constant viscosity for a minimum of 30 minutes. This allows mor.. |
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| Cure Time | 15.0 min @Temperature 90.0 °C |
0.250 hour @Temperature 194 °F |
1 drop applications |
| Tra-Con Tra-Bond F118CLR Fiber Optic Epoxy Adhesive TRA-BOND F118CLR is an impact resistant, fiber-optic adhesive designed for use in any optical connector. This two-part epoxy remains at a constant viscosity for a minimum of 30 minutes. This allows .. |
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| Cure Time | 15.0 min @Temperature 150 °C |
0.250 hour @Temperature 302 °F |
Bond Line |
| Epoxy Technology EPO-TEK® E2001 Electrically Conductive, Silver-Filled Epoxy Product Description: EPO-TEK® E2001 is a two component, silver-filled, electrically conductive epoxy designed for semiconductor die attach applications using a snap-cure profile. Advantages & Appl.. |
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| Cure Time | 15.0 min @Temperature 150 °C |
0.250 hour @Temperature 302 °F |
Minimum Bond Line |
| Epoxy Technology EPO-TEK® E3001 Electrically Conductive, Silver Epoxy Product Description: EPO-TEK® E3001-HV is a snap cure, single component, silver-filled die attach adhesive for semiconductor plastic IC packaging. Also available in a frozen syringe. Advantages & .. |
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| Cure Time | 15.0 min @Temperature 120 °C |
0.250 hour @Temperature 248 °F |
Minimum Bond Line |
| Epoxy Technology EPO-TEK® H20E-LV Electrically Conductive, Silver Epoxy Product Description: EPO-TEK® H20E-LV is a two component, 100% solids silver-filled epoxy system designed specifically for chip bonding in microelectronic and optoelectronic applications. It is a .. |
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| Cure Time | 15.0 - 30.0 min @Temperature 22.0 °C |
0.250 - 0.500 hour @Temperature 71.6 °F |
|
| Dow Corning 3-4680 SILICONE GEL KIT Two-part, transparent blue, fast RT or heat cure, low viscosity.Information provided by Dow Corning |
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| Cure Time | 15.0 min @Temperature 177 °C |
0.250 hour @Temperature 350 °F |
Recommended Cure Cycle |
| Arlon 30560R015 0.015" (0.381 mm) Uncured/Unsupported Silicone Rubber on a Release Carrier Design/Construction:Side 1: Uncured/Unsupported Silicone Rubber on a Release Carrier Appearance: Red silicone gum on polymer linerThis data represents typical values for the production material. The.. |
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| Cure Time | 15.0 min @Temperature 177 °C |
0.250 hour @Temperature 350 °F |
Recommended Cure Cycle |
| Arlon 55579R043 0.043" (1.09 mm) Uncured/Cured Silicone Rubber with Fiberglass Substrate Design/Construction:Side 1: Uncured layer on top of a cured layer on one side Appearance: Red silicone gum and rubber on fiberglass clothThis data Represents typical values for the production materi.. |
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| Cure Time | 15.0 min @Temperature 177 °C |
0.250 hour @Temperature 350 °F |
Recommended Cure Cycle |
| Arlon 55579R043W 0.043" (1.09 mm) Uncured/Cured Silicone Rubber with Fiberglass Substrate Design/Construction:Side 1: Uncured layer on top of a cured layer on one side This data Represents typical values for the production material. The data should not be used to write, or in place of, m.. |
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| Cure Time | 15.0 min @Temperature 177 °C |
0.250 hour @Temperature 350 °F |
Recommended Cure Cycle |
| Arlon 56596R065 0.065" (1.65 mm) Uncured/Cured Silicone Rubber with Fiberglass Substrate Design/Construction:Side 1: Cured Silicone Rubber Side 2: Uncured Silicone Rubber Product Use: Flexible heater insulationAppearance: Red silicone gum and rubber on fiberglass with polymer release li.. |
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| Cure Time | 15.0 min @Temperature 177 °C |
0.250 hour @Temperature 351 °F |
|
| 3M Scotchcast™ 5230N Electrical Epoxy Powder Resin 3M Scotchcast Electrical Resin 5230N is a widely used, general purpose epoxy powder resin. A one-part, blue pigmented, rapid heat-curing product, it is designed to provide a continuous, tough moistu.. |
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| Cure Time | 15.0 min @Temperature 177 °C |
0.250 hour @Temperature 350 °F |
Recommended Cure Cycle |
| Arlon 47576R009 0.0095" (0.241 mm) Cured/Uncured Silicone Rubber with Fiberglass Substrate Design/Construction:Side 1: Cured RubberSide 2: Uncured RubberAppearance: Red silicone gum and rubber on fiberglass clothThis data represents typical values for the production material. The data sho.. |
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| Cure Time | 15.0 min @Temperature 177 °C |
0.250 hour @Temperature 350 °F |
Recommended Cure Cycle |
| Arlon 51344R020 0.020" (0.508 mm) Semi-Cured Silicone Rubber with Fiberglass Substrate Design/Construction:Side 1: Semi-Cured Silicone Rubber Appearance: Red silicone gum on fiberglass clothThis data Represents typical values for the production material. The data should not be used to.. |
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| Cure Time | 15.0 - 20.0 min @Temperature 121 - 177 °C |
0.250 - 0.333 hour @Temperature 250 - 350 °F |
Recommended Cure Cycle |
| Arlon CP-339R Bulk Compound This data represents typical values for the production material. The data should not be used to write, or in place of, material specifications.Information provided by Arlon, Silicone Technologies Di.. |
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| Cure Time | 15.0 min @Temperature 177 °C |
0.250 hour @Temperature 350 °F |
Recommended Cure Cycle |
| Arlon R32861R006 0.0055" (0.140 mm) Uncured Rubber with Fiberglass Substrate Design/Construction:Side 1: Uncured Rubber Side 2: Uncured Rubber This data Represents typical values for the production material. The data should not be used to write, or in place of, material spec.. |
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| Cure Time | 15.0 min @Temperature 23.0 °C |
0.250 hour @Temperature 73.4 °F |
Brass, working strength |
| Permabond A1042 Anaerobic Threadlocker Permabond® A1042 is a rapid curing adhesive designed to lock and seal metal parts that subsequently may need to be dismantled for maintenance. The high vibration resistance makes Permabond A1042 pa.. |
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| Cure Time | 15.0 min @Temperature 23.0 °C |
0.250 hour @Temperature 73.4 °F |
Brass, working strength |
| Permabond HM135 Anaerobic Retainer Permabond® HM135 is a fast curing, medium viscosity anaerobic adhesive for locking and sealing threads and retaining cylindrical components. It gives maximum torque strength on brass or plated bras.. |
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| Cure Time | 15.0 min @Temperature 177 °C |
0.250 hour @Temperature 350 °F |
Recommended Cure Cycle |
| Arlon 45541R012 0.012" (0.305 mm) Uncured Rubber with Fiberglass Substrate Design/Construction:Side 1: Uncured RubberSide 2: Uncured Rubber Appearance: Red silicone gumThis data represents typical values for the production material. The data should not be used to write, or.. |
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| Cure Time | 15.0 min @Temperature 177 °C |
0.250 hour @Temperature 350 °F |
Recommended Cure Cycle |
| Arlon 45561R007 0.007"(0.178 mm) Uncured Rubber with Fiberglass Substrate Design/Construction:Side 1: Uncured RubberSide 2: Uncured RubberAppearance: Red silicone gum on fiberglass fabricThis data represents typical values for the production material. The data should not .. |
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