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- Polymer Property : Cure Time = 240 min
Polymer Property : Cure Time = 240 min Product List
Processing PropertiesTips: 30 items are displayed at most. For the rest of the results, please contact customer service.
| Processing Properties | Metric | English | Comments |
|---|---|---|---|
| Cure Time | 120 - 240 min @Temperature 65.0 °C |
2.00 - 4.00 hour @Temperature 149 °F |
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| NextGen Adhesives P907-10 Optical Assembly Adhesive Description: NGAC P907-10 is a low viscosity and optically clear adhesive system that is specifically formulated for bonding and potting applications involving optical components and assemblies.Adva.. |
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| Cure Time | 60.0 - 240 min @Temperature 65.0 °C |
1.00 - 4.00 hour @Temperature 149 °F |
|
| Resin Technology Group TIGA 901 Room Temperature Curing Silver Conductive Epoxy 100 parts resin to 6 parts hardener. Cure 24 hours at 25°C, 1-4 hours at 65°C, 30-60 minutes at 125°C, or 30 minutes at 150°C.TIGA 901 is an electrically conductive, silver filled epoxy adhesiv.. |
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| Cure Time | 180 - 240 min @Temperature 66.0 °C |
3.00 - 4.00 hour @Temperature 151 °F |
Full |
| Lord Adhesives Thermosetâ„¢ UR-329 Two Component Urethane Potting Compound Lord UR-329 is a flexible, two-component, room temperature curing, urethane, encapsulating compound. UR-329 maintains low hardness and modulus over a wide temperature range, which imparts minimal st.. |
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| Cure Time | 180 - 240 min @Temperature 93.3 °C |
3.00 - 4.00 hour @Temperature 200 °F |
|
| Master Bond EP21TDC-4ND Two component, highly flexibilized epoxy for bonding, sealing and coating Product Description: Master Bond EP21TDC-4ND is a two component, very flexible epoxy system for high performance bonding, sealing and coating with a non-drip consistency. It has a one to four mix ra.. |
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| Cure Time | 60.0 - 240 min @Temperature 65.0 °C |
1.00 - 4.00 hour @Temperature 149 °F |
|
| Tra-Con Tra-Bond 716C01 Medium Viscosity Epoxy Adhesive TRA-BOND 716C01 is a medium viscosity epoxy resin system specifically developed for bonding and coating applications. This two-part amber adhesive is easily mixed, used and cured at room temperature.. |
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| Cure Time | 60.0 - 240 min @Temperature 65.0 °C |
1.00 - 4.00 hour @Temperature 149 °F |
|
| Tra-Con Tra-Bond FDA22BK01 Food and Drug Application Epoxy Adhesive TRA-BOND FDA-22BK01 is a high viscosity epoxy resin system specifically developed for bonding and coating applications in accordance. This two-part black adhesive is easily mixed, used and cured at .. |
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| Cure Time | 60.0 - 240 min @Temperature 65.0 °C |
1.00 - 4.00 hour @Temperature 149 °F |
|
| Tra-Con Tra-Bond FDA23 Food and Drug Application Epoxy Adhesive TRA-BOND FDA-23 is a high viscosity epoxy resin system specifically developed for bonding and coating applications in accordance with Title 21, U.S. Code of Federal Regulations, Food and Drug Admini.. |
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| Cure Time | 60.0 - 240 min @Temperature 65.0 °C |
1.00 - 4.00 hour @Temperature 149 °F |
|
| Tra-Con Tra-Bond FDA25 Food and Drug Application Epoxy Adhesive TRA-BOND FDA-25 is a medium viscosity epoxy resin system specifically developed for bonding and coating applications in accordance with Title 21, U.S. Code of Federal Regulations, Food and Drug Admi.. |
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| Cure Time | 60.0 - 240 min @Temperature 65.0 °C |
1.00 - 4.00 hour @Temperature 149 °F |
|
| Tra-Con Tra-Cast F353 Optically Opaque Casting System TRA-CAST F353 is an optically opaque, low viscosity, two-part epoxy system recommended for molding, potting, embedding, encapsulating, sealing and casting applications involving fiber optic, optical.. |
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| Cure Time | 120 - 240 min @Temperature 100 °C |
2.00 - 4.00 hour @Temperature 212 °F |
|
| Trelleborg Emerson & Cuming Eccobond® 11 Heat Cure Catalyst Emerson & Cuming 11 Eccobond® Heat Cure CatalystGeneral purpose, low viscosity, elevated temperature curing. Long working life. Yields cured coatings with excellent chemical resistance. Subject to .. |
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| Cure Time | 120 - 240 min @Temperature 65.0 °C |
2.00 - 4.00 hour @Temperature 149 °F |
|
| Trelleborg Emerson & Cuming Eccobond® 15 LV Variable Hardness Low Viscosity Catalyst Emerson & Cuming 15 LV Eccobond® Variable Hardness Low Viscosity CatalystLow viscosity. Easy-to-use, simple mix ratios. Hardness of cured castings can be controlled by the amount of hardener used. .. |
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| Cure Time | 120 - 240 min @Temperature 65.0 °C |
2.00 - 4.00 hour @Temperature 149 °F |
|
| Trelleborg Emerson & Cuming Eccobond® 15 Variable Hardness Catalyst Emerson & Cuming 15 Eccobond® Variable Hardness CatalystEasy-to-use, simple mix ratios. Hardness of cured castings can be controlled by the amount of hardener used. Long working life. Yields cured .. |
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| Cure Time | 180 - 240 min @Temperature 93.3 °C |
3.00 - 4.00 hour @Temperature 200 °F |
|
| Master Bond EP30M3LV Electrically Insulative, Low Viscosity Two Component Epoxy Master Bond Polymer System EP30M3LV is a lower viscosity, two component epoxy system for high performance bonding, sealing and encapsulation. It is formulated to cure at ambient temperatures or mor.. |
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| Cure Time | 180 - 240 min @Temperature 65.6 - 93.3 °C |
3.00 - 4.00 hour @Temperature 150 - 200 °F |
|
| Master Bond EP42HT-2FG Two Component Epoxy Adhesive for Food Applications Master Bond Polymer System EP42HT-2FG is a room temperature setting, two component epoxy adhesive, sealant and coating specially formulated for food applications. It has been independently tested an.. |
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| Cure Time | 60.0 - 240 min @Temperature 65.0 °C |
1.00 - 4.00 hour @Temperature 149 °F |
|
| Tra-Con Tra-Bond 813J01 Silicone Encapsulant TRA-BOND 813J01 is a silicone adhesive system formulated to provide excellent thermal conductivity. This unique product bonds well to difficult substrates. Typical applications include encapsulation.. |
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| Cure Time | 60.0 - 240 min @Temperature 65.0 °C |
1.00 - 4.00 hour @Temperature 149 °F |
|
| Tra-Con Tra-Duct 2902 Room Temperature Conductive Silver Epoxy Adhesive TRA-DUCT 2902 is an electrically conducting silver-filled epoxy compound recommended for electronic bonding and sealing applications that require a combination of good mechanical and electrical prop.. |
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| Cure Time | 120 - 240 min @Temperature 65.0 °C |
2.00 - 4.00 hour @Temperature 149 °F |
|
| Trelleborg Emerson & Cuming Eccobond® 15 Clear Variable Hardness Catalyst Emerson & Cuming 15 Clear Eccobond® Variable Hardness CatalystEasy-to-use, simple mix ratios. Hardness of cured castings can be controlled by the amount of hardener used. Long working life. Yields .. |
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| Cure Time | 120 - 240 min @Temperature 120 - 160 °C |
2.00 - 4.00 hour @Temperature 248 - 320 °F |
optional |
| Abatron AboCast 8103-27 High-Performance Dielectric Epoxy AboCast 8103-27 is a dielectric in/outdoor epoxy system with superior arc-track resistance, high voltage and heat resistance, low ash and ion content, and it is chlorine-free. This system has high h.. |
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| Cure Time | 60.0 - 240 min @Temperature 160 - 180 °C |
1.00 - 4.00 hour @Temperature 320 - 356 °F |
optional |
| Abatron AboCast 8103-14 One-Component Epoxy AboCast 8103-14 is the lowest-viscosity one-component epoxy system with heavy-duty structural and dielectric properties. It is clear and has maximum wetting and penetration. Suggested Uses: Casting.. |
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| Cure Time | 120 - 240 min @Temperature 120 - 160 °C |
2.00 - 4.00 hour @Temperature 248 - 320 °F |
optional |
| Abatron AboCast 8103-30 High-Performance Dielectric Epoxy AboCast 8103-30 is a dielectric in/outdoor epoxy system with superior arc-track resistance, high voltage and heat resistance, low ash and ion content, and it is chlorine-free. This system has high h.. |
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| Cure Time | 120 - 240 min @Temperature 125 °C |
2.00 - 4.00 hour @Temperature 257 °F |
optional 3rd step |
| Abatron AboCast 8502-7/AboCure 8502-7 Colorless, Low-Exotherm Epoxy Casting Compound AboCast 8502-7/AboCure 8502-7 is a rigid, heat cured, colorless, low-exotherm epoxy casting compound for larger masses. It is a 2-component structural and dielectric liquid system with extremely low.. |
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| Cure Time | 60.0 - 240 min @Temperature 65.0 °C |
1.00 - 4.00 hour @Temperature 149 °F |
|
| Atom Adhesives AA-BOND FDA26 Epoxy Adhesive AA-BOND FDA26 is Versatile adhesive guaranteed a high strength bond. AA-BOND FDA26 is two part adhesive used and cured at room temperature for bonding, repair applications by manufacturers of food p.. |
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| Cure Time | 120 - 240 min @Temperature 65.0 °C |
2.00 - 4.00 hour @Temperature 149 °F |
|
| Atom Adhesives AA-SUPERTHERM 195 Epoxy Adhesive AA-SUPERTHERM 195 is a two component, thermally conductive epoxy system recommended for staking transistors, diodes, resistors, integrated circuits and other heat sensitive components to printed cir.. |
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| Cure Time | 60.0 - 240 min @Temperature 120 - 160 °C |
1.00 - 4.00 hour @Temperature 248 - 320 °F |
optional |
| Abatron AboCast 8103-22 High-Performance Dielectric Epoxy AboCast 8103-22 is a dielectric in/outdoor epoxy system with superior arc-track resistance, high voltage and heat resistance, low ash and ion content, and it is chlorine-free. This system is used in.. |
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| Cure Time | 120 - 240 min @Temperature 45.0 °C |
2.00 - 4.00 hour @Temperature 113 °F |
|
| Resinlab® EP1285HD-14 Highly Filled, Medium Viscosity Casting Resin Resinlab™ EP1285 (Formerly Lab Product W021901 series) is a highly filled, medium viscosity black casting resin designed for applications requiring a high degree of thermal conductivity and a low C.. |
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