Lord Adhesives Thermosetâ„¢ UR-329 Two Component Urethane Potting Compound

Category	Polymer , Adhesive , Thermoset , Polyurethane, TS , Thermoset Polyurethane, Adhesive
Manufacturer	Lord Adhesives
Trade Name	Thermoset™
Port	Shanghai port,China
Trade Terms	FOB, CFR, CIF
Payment Terms	L/C, T/T, Western Union
Download PDF	Lord Adhesives Thermosetâ„¢ UR-329 Two Component Urethane Potting Compound.pdf
Price	EMAIL US sales@lookpolymers.com
	Online Service lookpolymers 27660005

Material Notes:

Lord UR-329 is a flexible, two-component, room temperature curing, urethane, encapsulating compound. UR-329 maintains low hardness and modulus over a wide temperature range, which imparts minimal stress on delicate electronic components. UR-329 is a filled system, which enhances its ability to dissipate heat. It is often suitable in applications operating up to 130Â°C. UR-329 also exhibits excellent thermal shock resistance, very good electrical properties and good adhesion to a variety of materials.All information provided by Lord.

Physical Properties	Metric	English	Comments
Water Absorption	0.16 % @Temperature 25.0 Â°C, Time 86400 sec	0.16 % @Temperature 77.0 Â°F, Time 24.0 hour	ASTM D570
Loss On Ignition	<= 0.10 % @Temperature 125 Â°C, Time 605000 sec	<= 0.10 % @Temperature 257 Â°F, Time 168 hour
Viscosity	60 cP @Temperature 25.0 Â°C	60 cP @Temperature 77.0 Â°F	Hardener; STM 1
	4400 cP @Temperature 25.0 Â°C	4400 cP @Temperature 77.0 Â°F	Mixed; STM 1
	11000 cP @Temperature 25.0 Â°C	11000 cP @Temperature 77.0 Â°F	Resin; STM 1

Mechanical Properties	Metric	English	Comments
Hardness, Shore A	25 - 30	25 - 30	ASTM D2240

Thermal Properties	Metric	English	Comments
CTE, linear	191.7 Âµm/m-Â°C	106.5 Âµin/in-Â°F	ASTM D3386
Thermal Conductivity	0.300 W/m-K	2.08 BTU-in/hr-ftÂ²-Â°F
Maximum Service Temperature, Air	130 Â°C	266 Â°F
Glass Transition Temp, Tg	-68.0 Â°C	-90.4 Â°F	ASTM D3386

Electrical Properties	Metric	English	Comments
Volume Resistivity	1.06e+15 ohm-cm	1.06e+15 ohm-cm	ASTM D257
Dielectric Constant	4.4 @Frequency 1.00e+6 Hz, Temperature 25.0 Â°C	4.4 @Frequency 1.00e+6 Hz, Temperature 77.0 Â°F	ASTM D150
Dielectric Strength	>= 19.7 kV/mm	>= 500 kV/in	ASTM D149
Dissipation Factor	0.0448 @Frequency 1.00e+6 Hz, Temperature 25.0 Â°C	0.0448 @Frequency 1.00e+6 Hz, Temperature 77.0 Â°F	ASTM D150

Processing Properties	Metric	English	Comments
Cure Time	180 - 240 min @Temperature 66.0 Â°C	3.00 - 4.00 hour @Temperature 151 Â°F	Full
	1440 min @Temperature 25.0 Â°C	24.0 hour @Temperature 77.0 Â°F	Initial
	4320 - 5760 min @Temperature 25.0 Â°C	72.0 - 96.0 hour @Temperature 77.0 Â°F	Full
Pot Life	60 - 90 min @Temperature 25.0 Â°C	60 - 90 min @Temperature 77.0 Â°F
Gel Time	60.0 min @Temperature 66.0 Â°C	60.0 min @Temperature 151 Â°F
Shelf Life	6.00 Month @Temperature 25.0 Â°C	6.00 Month @Temperature 77.0 Â°F

Descriptive Properties	Value	Comments
Appearance	Amber (w/fluorescent yellow die)	Hardener
	Black	Mixed
	Black	Resin
Mix Ratio	100:15	by weight
	5:1	by volume

Users viewing this material also viewed the following: