Category | Polymer , Thermoset , Epoxy , Epoxy Encapsulant, Unreinforced |
Manufacturer | Master Bond Inc. |
Trade Name | |
Port | Shanghai port,China |
Trade Terms | FOB, CFR, CIF |
Payment Terms | L/C, T/T, Western Union |
Download PDF | Master Bond EP21TDC-4ND Two component, highly flexibilized epoxy for bonding, sealing and coating.pdf |
Price | EMAIL US sales@lookpolymers.com |
Mechanical Properties | Metric | English | Comments |
---|---|---|---|
Hardness, Shore D | 75 - 80 | 75 - 80 | using the optimum cure schedule |
Tensile Strength at Break | >= 20.7 MPa @Temperature 23.9 °C |
>= 3000 psi @Temperature 75.0 °F |
|
Elongation at Break | <= 200 % | <= 200 % | |
Tensile Modulus | 0.689 - 1.03 GPa @Temperature 23.9 °C |
100 - 150 ksi @Temperature 75.0 °F |
|
Shear Strength | >= 5.86 MPa @Temperature 23.9 °C |
>= 850 psi @Temperature 75.0 °F |
Al/Al, Tensile lap |
Peel Strength | >= 5.26 kN/m | >= 30.0 pli | T-peel |
Thermal Properties | Metric | English | Comments |
---|---|---|---|
CTE, linear | 110 - 130 µm/m-°C | 61.1 - 72.2 µin/in-°F | |
Maximum Service Temperature, Air | 121 °C | 250 °F | |
Minimum Service Temperature, Air | -73.3 °C | -100 °F |
Electrical Properties | Metric | English | Comments |
---|---|---|---|
Volume Resistivity | >= 1.00e+15 ohm-cm | >= 1.00e+15 ohm-cm |
Processing Properties | Metric | English | Comments |
---|---|---|---|
Cure Time | 180 - 240 min @Temperature 93.3 °C |
3.00 - 4.00 hour @Temperature 200 °F |
|
240 - 300 min @Temperature 23.9 °C |
4.00 - 5.00 hour @Temperature 75.0 °F |
||
720 min @Temperature 23.9 °C |
12.0 hour @Temperature 75.0 °F |
Followed by 2-3 hours at 150-200°F (Optimum Cure Schedule) | |
Pot Life | >= 90 min | >= 90 min | 100 gram mass |
Shelf Life | 12.0 Month @Temperature 23.9 °C |
12.0 Month @Temperature 75.0 °F |
in original unopened containers |
Descriptive Properties | Value | Comments |
---|---|---|
Mixing Ratio (A to B) | 1:4 | by weight |