Thermal Properties | Metric | English | Comments |
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CTE, linear | 16.0 µm/m-°C @Temperature 20.0 °C |
8.89 µin/in-°F @Temperature 68.0 °F |
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Pyrotek Pyrite B-3 Refractory Board Pyrotek B-3 is a highly versatile calcium silicate board for use in a variety of machined shapes and general purpose applications. Among its uses, Pyrotek B-3 is established as the industry standar.. |
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CTE, linear | 16.0 µm/m-°C | 8.89 µin/in-°F | ASTM D696 |
Solvay Specialty Polymers Torlon® 5030 Polyamide-imide (PAI)
(Unverified Data**) Torlon 5030 is a 30% glass-fiber reinforced grade of polyamide-imide (PAI) resin. It offers high strength and modulus and exceptional creep resistance. It has thermal expansion characteristics simil.. |
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CTE, linear | 16.0 µm/m-°C | 8.89 µin/in-°F | DIN 53752 |
Lehmann & Voss LUVOCOM® 7/CF/30/BK Polyamide 610, with carbon fiber Applications: Automotive industry, textile- and office machinery, apparatus- and precision engineering.High-strength and high-stiff parts; low coefficient of expansion.Especially suitable at dynamic.. |
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CTE, linear | 16.0 µm/m-°C @Temperature 20.0 °C |
8.89 µin/in-°F @Temperature 68.0 °F |
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Indium Corp. Indalloy® 182 Au-Sn Solder Alloy Eutectic die attach and package sealing.Information provided by the manufacturer, Indium Corporation. |
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CTE, linear | 16.0 µm/m-°C @Temperature 21.1 - 102 °C |
8.90 µin/in-°F @Temperature 70.0 - 215 °F |
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Materion ToughMet® T3 AT90 (OD≥4") ToughMet® is Brush Wellman's solution for severe service material problems. By applying their EquaCast® process, tailored alloying additions and spinodal hardening technology, they have e.. |
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CTE, linear | 16.0 µm/m-°C @Temperature 20.0 °C |
8.89 µin/in-°F @Temperature 68.0 °F |
x-axis |
Industrial Laminates/Norplex NP631 Paper Base Laminate Description: Hot punching grade with excellent electrical properties and low moisture absorption.Thickness Tested: 0.062", 0.125" and 0.500" |
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CTE, linear | 16.0 µm/m-°C @Thickness 1.57 mm, Temperature 20.0 °C |
8.89 µin/in-°F @Thickness 0.0620 in, Temperature 68.0 °F |
x-axis; IPC-TM 650-2.4.24 |
Industrial Laminates/Norplex NP691 Paper Base Laminate Description: Flame resistant, room temperature punching grade. NP691 is very similar to NP612 in electrical properties and mechanical strength, with improved moisture resistance.Thickness Tested: 0... |
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CTE, linear | 16.0 - 17.1 µm/m-°C @Temperature 25.0 - 300 °C |
8.89 - 9.50 µin/in-°F @Temperature 77.0 - 572 °F |
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Goodfellow Awa®, Nickeloid®, Simlet®, Spedex® Nickel Silver Good machinability, excellent cold working and welding characteristics. Poor hot forming. Uses include rivets, screws, zippers, optical parts and costume jewelry.Information provided by Goodfello.. |
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CTE, linear | 16.0 µm/m-°C | 8.89 µin/in-°F | |
Hexcel® HexPly® F263 Epoxy Resin HexPly® F263 is a structural, heat resistant epoxy resin formulated for excellent translation of high modulus carbon fiber properties in typically aerospace applications. HexPly® F263 is a high te.. |
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CTE, linear | 16.0 µm/m-°C @Temperature 20.0 °C |
8.89 µin/in-°F @Temperature 68.0 °F |
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Cosmic Plastics D72 Short Glass Fiber Filled Ortho Diallyl Phthalate Molding Compound Data provided by the manufacturer. |
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CTE, linear | 16.0 µm/m-°C @Temperature 20.0 - 649 °C |
8.90 µin/in-°F @Temperature 68.0 - 1200 °F |
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Eagle Brass 200/201 Nickel Alloy, Full Hardened Nickel 200/201 has properties that are useful in industries such as chemical processing and electronics. Nickel is resistant to various reducing chemicals and alkaline materials. Compared with nick.. |
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CTE, linear | 16.0 µm/m-°C @Temperature 0.000 - 100 °C |
8.89 µin/in-°F @Temperature 32.0 - 212 °F |
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CLAL-MSX NICLAL 1300 0 Annealed Copper Alloy, Free Cutting Nickel-Silver Main Characteristics: Good ductilityGood corrosion resistanceTypical Applications:High volume turned partsKeysInformation provided by CLAL-MSX |
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CTE, linear | 16.0 µm/m-°C @Temperature 0.000 - 100 °C |
8.89 µin/in-°F @Temperature 32.0 - 212 °F |
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CLAL-MSX NICLAL 1300 H12 1/2 Hard Copper Alloy, Free Cutting Nickel-Silver Main Characteristics: Good ductilityGood corrosion resistanceTypical Applications:High volume turned partsKeysInformation provided by CLAL-MSX |
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CTE, linear | 16.0 µm/m-°C @Temperature 0.000 - 100 °C |
8.89 µin/in-°F @Temperature 32.0 - 212 °F |
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CLAL-MSX NICLAL 1800 0 Annealed Copper Alloy, Free Cutting Nickel-Silver Main Characteristics: Good corrosion resistanceHigh mechanical propertiesTypical Applications:Parts subject to high stressHigh quality fastenersInformation provided by CLAL-MSX |
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CTE, linear | 16.0 µm/m-°C @Temperature 0.000 - 100 °C |
8.89 µin/in-°F @Temperature 32.0 - 212 °F |
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CLAL-MSX NICLAL 1300 H14 4/4 Hard Copper Alloy, Free Cutting Nickel-Silver Main Characteristics: Good ductilityGood corrosion resistanceTypical Applications:High volume turned partsKeysInformation provided by CLAL-MSX |
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CTE, linear | 16.0 µm/m-°C | 8.89 µin/in-°F | x, before Tg; IPC TM-650 2.4.24 |
Arlon 25FR Low-Cost Ceramic Hydrocarbon High Frequency, Low Loss Thermoset Laminate and Prepreg for Double-sided, Multilayer and Mixed Dielectric Printed Circuit BoardsLow loss ceramic-filled thermoset resinTight dielectric tolerance cont.. |
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CTE, linear | 16.0 µm/m-°C @Temperature 20.0 °C |
8.89 µin/in-°F @Temperature 68.0 °F |
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California Fine Wire Nickel Alloy 90 Copper Nickel Resistance Wire All values may vary dependent on specific design and usageCapabilities: WireRibbonSquareInsulatedPlatedInformation provided by California Fine Wire. |
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CTE, linear | 16.0 µm/m-°C @Temperature 20.0 °C |
8.89 µin/in-°F @Temperature 68.0 °F |
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AIM 80Au/20Sn Solder for Photonic Packaging Uses include:Fiber to Ferrule SolderingLaser Die AttachHermetic Packaging & SealingWetting & Sealing Laser OpticsThermal ManagementInformation provided by AIM Specialty Materials. |
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CTE, linear | 16.0 µm/m-°C @Temperature 50.0 - 150 °C |
8.89 µin/in-°F @Temperature 122 - 302 °F |
IPC TM-650 2.4.41 |
Arlon AD250C PTFE/Woven Fiberglass/Microdispersed Ceramic Filled Laminate for RF & Microwave PCBs For RF & Microwave Printed Circuit Boards. Very Low Loss PTFE and Ceramic Filled Composite (0.0014 Loss Tangent at 10GHz and Base Station Frequencies)Dielectric Constant (2.50) with Tight Tolerance.. |
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CTE, linear | 16.0 µm/m-°C | 8.89 µin/in-°F | y direction |
Arlon AD255A Glass, PTFE and Micro-Dispersed Ceramic Lower Loss and Improved Performance over Traditional AD Series.Information provided by Arlon Materials for Electronics (MED). |
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CTE, linear | 16.0 µm/m-°C @Temperature 50.0 - 150 °C |
8.89 µin/in-°F @Temperature 122 - 302 °F |
IPC TM-650 2.4.41 |
Arlon AD255C PTFE/Woven Fiberglass/Microdispersed Ceramic Filled Laminate for RF & Microwave PCBs For RF & Microwave Printed Circuit Boards. Very Low Loss PTFE and Ceramic Filled Composite (0.0014 Loss Tangent at 10GHz and Base Station Frequencies)Dielectric Constant (2.55) with Tighter Toleran.. |
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CTE, linear | 16.0 - 17.0 µm/m-°C | 8.89 - 9.44 µin/in-°F | IPC TM-650 2.4.41 |
Arlon 33N Polyimide Laminate and Prepreg High reliability and high temperature material33N is a flame retardant polyimide laminate and prepreg system where the excellent high performance properties of polyimide need to be combined with fla.. |
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CTE, linear | 16.0 µm/m-°C @Temperature 21.1 - 102 °C |
8.90 µin/in-°F @Temperature 70.0 - 215 °F |
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Materion ToughMet® T3 AT90 (OD ToughMet® is Brush Wellman's solution for severe service material problems. By applying their EquaCast® process, tailored alloying additions and spinodal hardening technology, they have engin.. |
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CTE, linear | 16.0 - 48.6 µm/m-°C | 8.89 - 27.0 µin/in-°F | Average value: 25.1 µm/m-°C Grade Count:4 |
Overview of materials for Polybutylene Terephthalate (PBT), Carbon Fiber Filled This property data is a summary of similar materials in the MatWeb database for the category "Polybutylene Terephthalate (PBT), Carbon Fiber Filled". Each property range of values reported is minimu.. |