Arlon 33N Polyimide Laminate and Prepreg

High reliability and high temperature material33N is a flame retardant polyimide laminate and prepreg system where the excellent high performance properties of polyimide need to be combined with flame retardance. High Tg results in low overall processing and minimizes risk of latent PTH defects in-service.Low Z-expansion minimizes the risk of PTH defects caused during solder reflow and device attachmentElectrical and mechanical properties meeting the requirements of IPC-4101/40 and /41Toughened. Non-MDA chemistry resists drill crackingCompatible with lead-free processingRoHS/WEEE compliantTypical Applications:PCBs that are subjected to high temperatures during processing, such as lead-free solderingApplications with significant lifetimes at high temperatures, such as aircraft engine instrumentation, down hole drilling, under-hood automotive controls, burn-in boards, or industrial sensors.This data represents typical values for the production material and should not be used as material specifications.Information provided by ARLON Silicone Technologies Division.