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Arlon 33N Polyimide Laminate and Prepreg

Category Polymer , Thermoset , Polyimide, TS
Manufacturer Arlon
Trade Name
Port Ningbo port,China
Trade Terms FOB, CFR, CIF
Payment Terms L/C, T/T, Western Union
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Material Notes:
High reliability and high temperature material33N is a flame retardant polyimide laminate and prepreg system where the excellent high performance properties of polyimide need to be combined with flame retardance. High Tg results in low overall processing and minimizes risk of latent PTH defects in-service.Low Z-expansion minimizes the risk of PTH defects caused during solder reflow and device attachmentElectrical and mechanical properties meeting the requirements of IPC-4101/40 and /41Toughened. Non-MDA chemistry resists drill crackingCompatible with lead-free processingRoHS/WEEE compliantTypical Applications:PCBs that are subjected to high temperatures during processing, such as lead-free solderingApplications with significant lifetimes at high temperatures, such as aircraft engine instrumentation, down hole drilling, under-hood automotive controls, burn-in boards, or industrial sensors.This data represents typical values for the production material and should not be used as material specifications.Information provided by ARLON Silicone Technologies Division.
Physical Properties Metric English Comments
Density 1.60 g/cc
0.0578 lb/in³
ASTM D792 Method A
Water Absorption 0.21 %
0.21 %
IPC TM-650 2.6.2.1
Mechanical Properties Metric English Comments
Modulus of Elasticity 22.1 GPa
3200 ksi
IPC TM-650 2.4.18.3
Poissons Ratio 0.15
0.15
ASTM D3039
Peel Strength 1.26 kN/m
7.20 pli
To Copper (1 oz./35 micron); After Thermal Stress; IPC TM-650 2.4.8
1.26 kN/m
7.20 pli
To Copper (1 oz./35 micron); At Elevated Temperatures; IPC TM-650 2.4.8.2
1.31 kN/m
7.50 pli
To Copper (1 oz./35 micron); After Process Solutions; IPC TM-650 2.4.8
Thermal Properties Metric English Comments
CTE, linear 16.0 - 17.0 µm/m-°C
8.89 - 9.44 µin/in-°F
IPC TM-650 2.4.41
CTE, linear, Transverse to Flow 55.0 µm/m-°C

@Temperature <=250 °C
30.6 µin/in-°F

@Temperature <=482 °F
z (< Tg); IPC TM-650 2.4.24
164 µm/m-°C

@Temperature >=250 °C
91.1 µin/in-°F

@Temperature >=482 °F
z (> Tg); IPC TM-650 2.4.24
Thermal Conductivity 0.200 W/m-K
1.39 BTU-in/hr-ft²-°F
ASTM E1461
Glass Transition Temp, Tg 250 °C
482 °F
TMA; IPC TM-650 2.4.24
Decomposition Temperature 353 °C
667 °F
Onset; IPC TM-650 2.4.24.6
389 °C
732 °F
5 percent; IPC TM-650 2.4.24.6
Flammability, UL94 V-0
V-0
Electrical Properties Metric English Comments
Volume Resistivity 7.20e+13 ohm-cm
7.20e+13 ohm-cm
C96/35/90; IPC TM-650 2.5.17.1
4.50e+14 ohm-cm
4.50e+14 ohm-cm
E24/125; IPC TM-650 2.5.17.1
Surface Resistance 4.10e+14 ohm
4.10e+14 ohm
C96/35/90; IPC TM-650 2.5.17.1
1.60e+15 ohm
1.60e+15 ohm
E24/125; IPC TM-650 2.5.17.1
Dielectric Constant 4.0

@Frequency 1.00e+6 Hz
4.0

@Frequency 1.00e+6 Hz
IPC TM-650 2.5.5.3
Dielectric Strength 50.8 kV/mm
1290 kV/in
IPC TM-650 2.5.6.2
Dissipation Factor 0.010

@Frequency 1.00e+6 Hz
0.010

@Frequency 1.00e+6 Hz
IPC TM-650 2.5.5.3
Arc Resistance 170 sec
170 sec
IPC TM-650 2.5.1
Descriptive Properties Value Comments
IPC Delamination - T260 (minutes) > 60
IPC TM-650 2.4.24.1
IPC Delamination - T288 (minutes) 23
IPC TM-650 2.4.24.1
IPC Delamination - T300 (minutes) 8
IPC TM-650 2.4.24.1
Z-Axis Expansion (%) 1.2
IPC TM-650 2.4.24 (50-260°C)
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