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Polymer Property : Glass Transition Temp, Tg = 311 °F Product List
Thermal PropertiesTips: 30 items are displayed at most. For the rest of the results, please contact customer service.
| Thermal Properties | Metric | English | Comments |
|---|---|---|---|
| Glass Transition Temp, Tg | 155 °C | 311 °F | DSC; IPC-TM-650.2.4.25c |
| Park Electrochemical Nelco® N4000-7 SI® FR-4 Epoxy Laminate and Prepreg The Nelco® N4000-7 low-CTE epoxy laminate and prepreg system is a cost-effective solution for use in a broad range of multilayer PCB designs requiring low Z-axis expansion, excellent thermal stabil.. |
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| Glass Transition Temp, Tg | 155 °C | 311 °F | DSC |
| Performance Polymers IPS II PPL-A1050 PEKK (Polyetherketoneketone) Branched Standard Grade Amber pellets; neat resinInformation provided by Infinite Polymer System II. |
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| Glass Transition Temp, Tg | 155 °C | 311 °F | TMA; IPC-TM-650.2.4.24c |
| Park Electrochemical Nelco® N4000-7 EF® Halogen-Free Epoxy The Nelco® N4000-7 EF® series of laminates and prepregs is a total environmental solution. This advanced halogen-free resin system provides superior CAF resistance for high temperature, lead-free .. |
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| Glass Transition Temp, Tg | 155 °C | 311 °F | DSC; IPC-TM-650.2.4.25c |
| Park Electrochemical Nelco® N4000-7 FR-4 Epoxy Laminate and Prepreg The Nelco® N4000-7 low-CTE epoxy laminate and prepreg system is a cost-effective solution for use in a broad range of multilayer PCB designs requiring low Z-axis expansion, excellent thermal stabil.. |
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| Glass Transition Temp, Tg | 155 - 165 °C | 311 - 329 °F | Average value: 158 °C Grade Count:7 |
| Overview of materials for Epoxy, Molded, Mineral Filled This property data is a summary of similar materials in the MatWeb database for the category "Epoxy, Molded, Mineral Filled". Each property range of values reported is minimum and maximum values of .. |
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| Glass Transition Temp, Tg | 155 °C | 311 °F | |
| Cookson Group Plaskon® 440S Mineral Filled Novolac Epoxy Molding Compound
(discontinued **) Test specimens were transfer molded and post cured 4 hours at 175°C.Combines exceptional reliability with wide process latitude. This material is designed to encapsulate a wide range of semiconduc.. |
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| Glass Transition Temp, Tg | 155 °C | 311 °F | |
| Cookson Group Plaskon® 1031 Conventional Encapsulant
(discontinued **) Test specimens were transfer molded and post cured 4 hours at 175°C.A low cost, conventional molding compound recommended for high volume commodity-type packages that house simple linear and discre.. |
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| Glass Transition Temp, Tg | 155 °C | 311 °F | |
| Cookson Group Plaskon® 3100LS Mineral Filled Conventional Encapsulant
(discontinued **) Test specimens were transfer molded and post cured 4 hours at 175°C.A semiconductor grade encapsulant suitable for a wide range of applications ranging from small SOICs to moderate lead count DIPs... |
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| Glass Transition Temp, Tg | 155 °C | 311 °F | |
| Cookson Group Plaskon® 3200LS Mineral Filled Novolac Epoxy Molding Compound
(discontinued **) Test specimens were transfer molded and post cured 4 hours at 175°C.Exhibits exceptional reliability under very stringent testing. This material is designed to minimize stress on the encapsulated .. |
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| Glass Transition Temp, Tg | 155 °C | 311 °F | |
| Cookson Group Plaskon® 3300SGH Mineral Filled Epoxy Molding Compound
(discontinued **) Test specimens were transfer molded and post cured 4 hours at 175°C.Exhibits exceptional reliability, excellent moldability, good release characteristics, low flash and rapid cure. This compound i.. |
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| Glass Transition Temp, Tg | 155 °C | 311 °F | |
| Cookson Group Plaskon® 3300SH Mineral Filled Epoxy Molding Compound
(discontinued **) Test specimens were transfer molded and post cured 4 hours at 175°C.Exhibits exceptional reliability, excellent moldability, good release characteristics and low flash. This compound is especially.. |
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| Glass Transition Temp, Tg | 155 °C | 311 °F | |
| Cookson Group Plaskon® 3400 Epoxy Molding Compound
(discontinued **) Test specimens were transfer molded and post cured 4 hours at 175°C.A reduced-stress epoxy molding compound for the encapsulation of a variety of semiconductor devices ranging from small lead count.. |
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| Glass Transition Temp, Tg | 155 °C | 311 °F | |
| Cookson Group Plaskon® ULS-12LA Molding Compound
(discontinued **) Test specimens were transfer molded and post cured 4 hours at 175°C.An ultra low stress, low alpha emission molding compound designed for packaging stress-sensitive memory devices such as TSOPs and.. |
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| Glass Transition Temp, Tg | 155 °C | 311 °F | |
| Hybrid Plastics CO6U50.01 Nanoreinforced® Cyclic Olefin Copolymer Impact modified, UV stabilizedThe exceptional heat distortion temperature and low density of cyclic olefin copolymers (COC) makes them excellent materials for high temperature applications where low.. |
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| Glass Transition Temp, Tg | 155 °C | 311 °F | |
| Hybrid Plastics CO6U50.02 Nanoreinforced® Cyclic Olefin Copolymer Impact modified, flame retardantThe exceptional heat distortion temperature and low density of cyclic olefin copolymers (COC) makes them excellent materials for high temperature applications where l.. |
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| Glass Transition Temp, Tg | 155 °C | 311 °F | DIN EN ISO 3146 |
| GEHR Plastics PA 12 TR Transparent Nylon 12 Used for optical components that benefit from the transparency and the high dynamic strengthProperties:TransparencyExtremely high dynamic strengthHigh chemical resistanceHigh stress-cracking resista.. |
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| Glass Transition Temp, Tg | 155 °C | 311 °F | Method 1 |
| Lubrizol Telene 1610 A/B & A/BK Dicyclopentadiene (DCPD) Telene® is a two-component system based on extra-high purity dicyclopentadiene (DCPD). Telene® is processed using a standard high-pressure RIM Equipment (Reaction Injection Molding). Telene® resu.. |
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| Glass Transition Temp, Tg | 155 °C | 311 °F | Method 1 |
| Lubrizol Telene 1650 A/BK Dicyclopentadiene (DCPD) Telene® is a two-component system based on extra-high purity dicyclopentadiene (DCPD). Telene® is processed using a standard high-pressure RIM Equipment (Reaction Injection Molding). Telene® resu.. |
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| Glass Transition Temp, Tg | 155 °C | 311 °F | Ultimate Tg |
| Tra-Con Tra-Bond 2212 High Temperature Epoxy Adhesive TRA-BOND 2212 was developed for high temperature bonding, laminating, filament winding and potting applications where the combination of good physical and mechanical properties plus superior wetting.. |
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| Glass Transition Temp, Tg | 155 °C | 311 °F | After 1 hr at 140°C DSC 20°C/min |
| Hexcel® HexPly® M47 140°C Curing Epoxy Matrix HexPly® M47 is a toughened, self extinguishing 140ºC curing epoxy resin matrix that has been developed for the performance car market. It exhibits good strength retention at elevated temperature, .. |
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| Glass Transition Temp, Tg | 155 °C | 311 °F | |
| Loctite® 3533 Low viscosity fill encapsulant Fill Encapsulant COB/DCA Encapsulants are essential to the reliability of flip chip assemblies because they minimize the thermal mismatch between the flip chip and substrate.Loctite® Underfills and Encapsulants imp.. |
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| Glass Transition Temp, Tg | 155 °C | 311 °F | |
| Loctite® 3565 High performance epoxy, high Tg and low CTE High Tg Underfill COB/DCA Encapsulants are essential to the reliability of flip chip assemblies because they minimize the thermal mismatch between the flip chip and substrate.Loctite® Underfills and Encapsulants imp.. |
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| Glass Transition Temp, Tg | 155 °C | 311 °F | |
| Loctite® 3532 High viscosity Dam Encapsulant COB/DCA Encapsulants are essential to the reliability of flip chip assemblies because they minimize the thermal mismatch between the flip chip and substrate.Loctite® Underfills and Encapsulants imp.. |
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| Glass Transition Temp, Tg | 155 °C | 311 °F | |
| Loctite® 3534 Glob Top Encapsulant COB/DCA Encapsulants are essential to the reliability of flip chip assemblies because they minimize the thermal mismatch between the flip chip and substrate.Loctite® Underfills and Encapsulants imp.. |
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| Glass Transition Temp, Tg | 155 - 165 °C | 311 - 329 °F | |
| Bulk Molding Compounds BMC 850 Corrosion Resistant, Flame Retardant Molding Compound BMC 850 is a high strength, corrosion resistant and flame retardant molding compound. As with all other BMCI compounds, this Series can be supplied in logs, slugs or bulk form.Typical applications a.. |
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| Glass Transition Temp, Tg | 155 °C | 311 °F | Cured property; Perkin-Elmer TMS-2 |
| Aptek 6500-PMF Electrically conductive epoxy adhesive High purity, low outgassing, electrically conductive adhesiveAPTEK 6500-PMF is a one component, pre-mixed frozen, 100% solid, silver-filled epoxy adhesive specifically designed for microelectronic d.. |
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| Glass Transition Temp, Tg | 155 - 165 °C | 311 - 329 °F | |
| Bulk Molding Compounds BMC 851 Corrosion Resistant, Flame Retardant Molding Compound BMC 851is a high strength, corrosion resistant and flame retardant molding compound. As with all other BMCI compounds, this Series can be supplied in logs, slugs or bulk form.Typical applications ar.. |
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| Glass Transition Temp, Tg | 155 - 160 °C | 311 - 320 °F | Average value: 158 °C Grade Count:3 |
| Overview of materials for PEKK, Unreinforced This property data is a summary of similar materials in the MatWeb database for the category "PEKK, Unreinforced". Each property range of values reported is minimum and maximum values of appropriate.. |
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| Glass Transition Temp, Tg | 155 °C | 311 °F | |
| Cookson Group Plaskon® 3300S Mineral Filled Novolac Epoxy Molding Compound
(discontinued **) Test specimens were transfer molded and post cured 4 hours at 175°C.A low stress, flame retardant, novolac hardened epoxy molding compound designed to provide hermeticity protection exceeding that .. |
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