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Park Electrochemical Nelco® N4000-7 FR-4 Epoxy Laminate and Prepreg

Category Polymer , Thermoset , Epoxy
Manufacturer Park Electrochemical Corp.
Trade Name Nelco®
Port Ningbo port,China
Trade Terms FOB, CFR, CIF
Payment Terms L/C, T/T, Western Union
Download PDF Park Electrochemical Nelco® N4000-7 FR-4 Epoxy Laminate and Prepreg.pdf
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Material Notes:
The Nelco® N4000-7 low-CTE epoxy laminate and prepreg system is a cost-effective solution for use in a broad range of multilayer PCB designs requiring low Z-axis expansion, excellent thermal stability and superior hole-wall integrity.Key Features and Benefits:Outstanding Z-axis, thermal stability and hole wall integrityAutomotive TestingSI (Signal Integrity) optionCAF resistantCost-effective standard FR-4 processingApplications/Qualifications:Wireless HandsetsWireless InfrastructureDigital Broadband MultilayersAutomotiveUnderhood AutomotiveBackplanesFine-Line MultilayersFine Pitch BGA MultilayersDirect Chip AttachRoHS CompliantMeets IPC-4101/98 SpecificationsInformation provided by Park Electrochemical Corp.
Physical Properties Metric English Comments
Density 1.97 g/cc
0.0712 lb/in³
50% Resin Content; Internal Method
Water Absorption 0.070 %
0.070 %
IPC-TM-650.2.6.2.1
Mechanical Properties Metric English Comments
Modulus of Elasticity 19.3 GPa
2800 ksi
Y; ASTM D3039
24.1 GPa
3500 ksi
X; ASTM D3039
Poissons Ratio 0.11
0.11
Y; ASTM D3039
0.13
0.13
X; ASTM D3039
Peel Strength 1.31 kN/m
7.50 pli
after solder float; IPC-TM-650.2.4.8
1.42 kN/m
8.10 pli
at elevated temperature; IPC-TM-650.2.4.8.2a
1.58 kN/m
9.00 pli
after exposure to process solutions; IPC-TM-650.2.4.8
Thermal Properties Metric English Comments
CTE, linear 12.0 - 15.0 µm/m-°C

@Temperature -40.0 - 125 °C
6.67 - 8.33 µin/in-°F

@Temperature -40.0 - 257 °F
X/Y; IPC-TM-650.2.4.41
50.0 µm/m-°C

@Temperature 50.0 - 155 °C
27.8 µin/in-°F

@Temperature 122 - 311 °F
Z-Axis Alpha 1; IPC-TM-650.2.4.41
270 µm/m-°C

@Temperature 155 - 260 °C
150 µin/in-°F

@Temperature 311 - 500 °F
Z-Axis Alpha 2; IPC-TM-650.2.4.41
Specific Heat Capacity 1.21 J/g-°C
0.290 BTU/lb-°F
ASTM E1461
Thermal Conductivity 0.525 W/m-K
3.64 BTU-in/hr-ft²-°F
ASTM E1461
Glass Transition Temp, Tg 150 °C
302 °F
TMA; IPC-TM-650.2.4.24c
155 °C
311 °F
DSC; IPC-TM-650.2.4.25c
160 °C
320 °F
DMA (Tan d Peak); IPC-TM-650.2.4.24.3
Decomposition Temperature 330 °C
626 °F
5% weight loss; TGA; IPC-TM-650.2.4.24.6
Flammability, UL94 V-0
V-0
Electrical Properties Metric English Comments
Volume Resistivity 1.00e+13 ohm-cm
1.00e+13 ohm-cm
E - 24/125; IPC-TM-650.2.5.17.1
1.00e+14 ohm-cm
1.00e+14 ohm-cm
C - 96/35/90; IPC-TM-650.2.5.17.1
Surface Resistance 1.00e+13 ohm
1.00e+13 ohm
E - 24/125; IPC-TM-650.2.5.17.1
1.00e+14 ohm
1.00e+14 ohm
C - 96/35/90; IPC-TM-650.2.5.17.1
Dielectric Constant 3.9

@Frequency 2.50e+9 Hz
3.9

@Frequency 2.50e+9 Hz
Stripline; IPC-TM-650.2.5.5.5
3.9

@Frequency 1.00e+10 Hz
3.9

@Frequency 1.00e+10 Hz
Stripline; IPC-TM-650.2.5.5.5
4.0

@Frequency 1.00e+9 Hz
4.0

@Frequency 1.00e+9 Hz
RF Impedance; IPC-TM-650.2.5.5.9
4.5

@Frequency 1.00e+6 Hz
4.5

@Frequency 1.00e+6 Hz
TFC/LCR Meter; IPC-TM-650.2.5.5.3
Dielectric Strength 49.2 kV/mm
1250 kV/in
IPC-TM-650.2.5.6.2
Dielectric Breakdown >= 50000 V
>= 50000 V
IPC-TM-650.2.5.6
Dissipation Factor 0.017

@Frequency 2.50e+9 Hz
0.017

@Frequency 2.50e+9 Hz
Stripline; IPC-TM-650.2.5.5.5
0.017

@Frequency 1.00e+10 Hz
0.017

@Frequency 1.00e+10 Hz
Stripline; IPC-TM-650.2.5.5.5
0.018

@Frequency 1.00e+6 Hz
0.018

@Frequency 1.00e+6 Hz
TFC/LCR Meter; IPC-TM-650.2.5.5.3
Arc Resistance 124 sec
124 sec
IPC-TM-650.2.5.1
Descriptive Properties Value Comments
Methylene Chloride Resistance (% Weight Change) 0.31
IPC-TM-650.2.3.4.3
Pressure Cooker Pass
60 min then solder dip @288ºC until failure (max 10 min.); IPC-TM-650.2.6.16 (modified)
T260 (minutes) 16
IPC-TM-650.2.4.24.1
Z Axis Expansion (%) 3.7
50ºC to 260ºC; IPC-TM-650.2.4.41
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