Cookson Group Plaskon® 3300SGH Mineral Filled Epoxy Molding Compound (discontinued **)

Category	Polymer , Thermoset , Epoxy , Epoxy, Molded, Mineral Filled , Filled/Reinforced Thermoset
Manufacturer
Trade Name
Port	Shanghai port,China
Trade Terms	FOB, CFR, CIF
Payment Terms	L/C, T/T, Western Union
Download PDF	Cookson Group Plaskon® 3300SGH Mineral Filled Epoxy Molding Compound (discontinued **).pdf
Price	EMAIL US sales@lookpolymers.com
	Online Service lookpolymers 27660005

Material Notes:

Test specimens were transfer molded and post cured 4 hours at 175°C.Exhibits exceptional reliability, excellent moldability, good release characteristics, low flash and rapid cure. This compound is especially formulated for automated molding equipment.

Physical Properties	Metric	English	Comments
Density	1.86 g/cc	0.0672 lb/in³
Spiral Flow	38.0 cm	15.0 in	177°C/1000 psi

Mechanical Properties	Metric	English
Hardness, Shore D	75	75
Tensile Strength, Ultimate	83.0 MPa	12000 psi
Flexural Strength	124 MPa	18000 psi

Thermal Properties	Metric	English
CTE, linear	21.0 µm/m-°C @Temperature 20.0 °C	11.7 µin/in-°F @Temperature 68.0 °F
CTE, linear, Transverse to Flow	90.0 µm/m-°C @Temperature 20.0 °C	50.0 µin/in-°F @Temperature 68.0 °F
Thermal Conductivity	0.700 W/m-K	4.86 BTU-in/hr-ft²-°F
Glass Transition Temp, Tg	155 °C	311 °F
Flammability, UL94	V-0 @Thickness 3.20 mm	V-0 @Thickness 0.126 in
	V-0 @Thickness 3.20 mm	V-0 @Thickness 0.126 in

Electrical Properties	Metric	English
Dielectric Constant	3.8 @Frequency 1000 Hz	3.8 @Frequency 1000 Hz
Dielectric Strength	16.0 kV/mm	406 kV/in
Dissipation Factor	0.0020 @Frequency 1000 Hz	0.0020 @Frequency 1000 Hz
Arc Resistance	180 sec	180 sec

Processing Properties	Metric	English	Comments
Processing Temperature	170 - 190 °C	338 - 374 °F	Molding temperature

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