Cookson Group Plaskon® 3100LS Mineral Filled Conventional Encapsulant (discontinued **)

Category	Polymer , Thermoset , Epoxy , Epoxy, Encapsulating, Glass or Mineral Filled , Filled/Reinforced Thermoset
Manufacturer
Trade Name
Port	Ningbo port,China
Trade Terms	FOB, CFR, CIF
Payment Terms	L/C, T/T, Western Union
Download PDF	Cookson Group Plaskon® 3100LS Mineral Filled Conventional Encapsulant (discontinued **).pdf
Price	EMAIL US sales@lookpolymers.com

Material Notes:

Test specimens were transfer molded and post cured 4 hours at 175°C.A semiconductor grade encapsulant suitable for a wide range of applications ranging from small SOICs to moderate lead count DIPs.

Physical Properties	Metric	English	Comments
Density	1.85 g/cc	0.0668 lb/in³
Spiral Flow	64.0 - 88.0 cm	25.2 - 34.6 in	177°C/1000 psi

Mechanical Properties	Metric	English
Hardness, Shore D	73	73
Tensile Strength, Ultimate	107 MPa	15500 psi
Flexural Strength	139 MPa	20200 psi

Thermal Properties	Metric	English
CTE, linear	21.0 µm/m-°C @Temperature 20.0 °C	11.7 µin/in-°F @Temperature 68.0 °F
CTE, linear, Transverse to Flow	69.0 µm/m-°C @Temperature 20.0 °C	38.3 µin/in-°F @Temperature 68.0 °F
Thermal Conductivity	0.700 W/m-K	4.86 BTU-in/hr-ft²-°F
Glass Transition Temp, Tg	155 °C	311 °F
Flammability, UL94	V-0 @Thickness 3.20 mm	V-0 @Thickness 0.126 in
	V-0 @Thickness 3.20 mm	V-0 @Thickness 0.126 in

Electrical Properties	Metric	English
Dielectric Constant	4.0 @Frequency 1000 Hz	4.0 @Frequency 1000 Hz
Dielectric Strength	17.0 kV/mm	432 kV/in
Dissipation Factor	0.0040 @Frequency 1000 Hz	0.0040 @Frequency 1000 Hz
Arc Resistance	180 sec	180 sec

Processing Properties	Metric	English	Comments
Processing Temperature	171 - 193 °C	340 - 379 °F	Molding temperature

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