Cookson Group Plaskon® 3400 Epoxy Molding Compound (discontinued **)

Category	Polymer , Thermoset , Epoxy , Epoxy Molding Compound
Manufacturer
Trade Name
Port	Ningbo port,China
Trade Terms	FOB, CFR, CIF
Payment Terms	L/C, T/T, Western Union
Download PDF	Cookson Group Plaskon® 3400 Epoxy Molding Compound (discontinued **).pdf
Price	EMAIL US sales@lookpolymers.com
	Online Service lookpolymers 27660005

Material Notes:

Test specimens were transfer molded and post cured 4 hours at 175°C.A reduced-stress epoxy molding compound for the encapsulation of a variety of semiconductor devices ranging from small lead count DIPs to medium lead count PLCCs, QFPs, and SOICs. Excellent moldability (ease of filling, good release, minimal flash and bleed and good hot hardness); Superior cosmetics; Improved markability; Outstanding device reliability

Physical Properties	Metric	English	Comments
Density	1.82 g/cc	0.0658 lb/in³
Viscosity	8000 - 16000 cP @Temperature 175 °C	8000 - 16000 cP @Temperature 347 °F	Automatic orifice Viscosity
Spiral Flow	63.0 - 87.0 cm	24.8 - 34.3 in	177°C/1000 psi

Mechanical Properties	Metric	English
Hardness, Shore D	70	70
Flexural Strength	124 MPa	18000 psi
Flexural Modulus	15.0 GPa	2180 ksi

Thermal Properties	Metric	English
CTE, linear	20.0 µm/m-°C @Temperature 20.0 °C	11.1 µin/in-°F @Temperature 68.0 °F
CTE, linear, Transverse to Flow	62.0 µm/m-°C @Temperature 20.0 °C	34.4 µin/in-°F @Temperature 68.0 °F
Thermal Conductivity	0.700 W/m-K	4.86 BTU-in/hr-ft²-°F
Glass Transition Temp, Tg	155 °C	311 °F
Flammability, UL94	V-0 @Thickness 3.20 mm	V-0 @Thickness 0.126 in
	V-0 @Thickness 3.20 mm	V-0 @Thickness 0.126 in

Electrical Properties	Metric	English
Dielectric Constant	3.8 @Frequency 1000 Hz	3.8 @Frequency 1000 Hz
Dielectric Strength	16.0 kV/mm	406 kV/in
Dissipation Factor	0.0020 @Frequency 1000 Hz	0.0020 @Frequency 1000 Hz
Arc Resistance	180 sec	180 sec

Processing Properties	Metric	English	Comments
Processing Temperature	170 - 185 °C	338 - 365 °F	Molding temperature

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