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- Cookson Group Plaskon® 3400 Epoxy Molding Compound (discontinued **)
Cookson Group Plaskon® 3400 Epoxy Molding Compound (discontinued **)
| Category | Polymer , Thermoset , Epoxy , Epoxy Molding Compound |
| Manufacturer | |
| Trade Name | |
| Port | Ningbo port,China |
| Trade Terms | FOB, CFR, CIF |
| Payment Terms | L/C, T/T, Western Union |
| Download PDF | Cookson Group Plaskon® 3400 Epoxy Molding Compound
(discontinued **).pdf  |
| Price | EMAIL US sales@lookpolymers.com |
Material Notes:
Test specimens were transfer molded and post cured 4 hours at 175°C.A reduced-stress epoxy molding compound for the encapsulation of a variety of semiconductor devices ranging from small lead count DIPs to medium lead count PLCCs, QFPs, and SOICs. Excellent moldability (ease of filling, good release, minimal flash and bleed and good hot hardness); Superior cosmetics; Improved markability; Outstanding device reliability
| Physical Properties | Metric | English | Comments |
|---|---|---|---|
| Density | 1.82 g/cc | 0.0658 lb/in³ | |
| Viscosity | 8000 - 16000 cP @Temperature 175 °C |
8000 - 16000 cP @Temperature 347 °F |
Automatic orifice Viscosity |
| Spiral Flow | 63.0 - 87.0 cm | 24.8 - 34.3 in | 177°C/1000 psi |
| Mechanical Properties | Metric | English | Comments |
|---|---|---|---|
| Hardness, Shore D | 70 | 70 | |
| Flexural Strength | 124 MPa | 18000 psi | |
| Flexural Modulus | 15.0 GPa | 2180 ksi |
| Thermal Properties | Metric | English | Comments |
|---|---|---|---|
| CTE, linear | 20.0 µm/m-°C @Temperature 20.0 °C |
11.1 µin/in-°F @Temperature 68.0 °F |
|
| CTE, linear, Transverse to Flow | 62.0 µm/m-°C @Temperature 20.0 °C |
34.4 µin/in-°F @Temperature 68.0 °F |
|
| Thermal Conductivity | 0.700 W/m-K | 4.86 BTU-in/hr-ft²-°F | |
| Glass Transition Temp, Tg | 155 °C | 311 °F | |
| Flammability, UL94 | V-0 @Thickness 3.20 mm |
V-0 @Thickness 0.126 in |
|
| V-0 @Thickness 3.20 mm |
V-0 @Thickness 0.126 in |
| Electrical Properties | Metric | English | Comments |
|---|---|---|---|
| Dielectric Constant | 3.8 @Frequency 1000 Hz |
3.8 @Frequency 1000 Hz |
|
| Dielectric Strength | 16.0 kV/mm | 406 kV/in | |
| Dissipation Factor | 0.0020 @Frequency 1000 Hz |
0.0020 @Frequency 1000 Hz |
|
| Arc Resistance | 180 sec | 180 sec |
| Processing Properties | Metric | English | Comments |
|---|---|---|---|
| Processing Temperature | 170 - 185 °C | 338 - 365 °F | Molding temperature |
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