Loctite® 3533 Low viscosity fill encapsulant Fill Encapsulant

COB/DCA Encapsulants are essential to the reliability of flip chip assemblies because they minimize the thermal mismatch between the flip chip and substrate.Loctite® Underfills and Encapsulants improve assembly operations by providing superior reliability and faster throughput. Improved reliability is achieved through products that have a high Tg, low CTE, high throughput and excellent adhesion. Faster throughput and higher yields are achieved through faster flow characteristics and increased cure speeds.Loctite® 3533 Low viscosity fill encapsulant Fill EncapsulantLow CTE and high Tg specifically designed to provide the highest reliability in demanding COB, MCM, BGA, and PGA encapsulating applications.