- HOME
- POLYMER SEARCH
- Polymer Property : Minimum Service Temperature, Air = -55.0 °C
Polymer Property : Minimum Service Temperature, Air = -55.0 °C Product List
Thermal PropertiesTips: 30 items are displayed at most. For the rest of the results, please contact customer service.
| Thermal Properties | Metric | English | Comments |
|---|---|---|---|
| Minimum Service Temperature, Air | -55.0 °C | -67.0 °F | |
| P & P Technology Conductive Elastomer Nickel Graphite particlesInformation provided by P & P Technology |
|||
| Minimum Service Temperature, Air | -55.0 °C | -67.0 °F | |
| Parker Chomerics CHO-BOND 4669 Conductive Caulk/Sealant Chomerics two-component conductive epoxy caulks provide excellent adhesion to dissimilar substrates and can be used in lap or butt joint applications. They feature large silver-plated-copper particl.. |
|||
| Minimum Service Temperature, Air | -55.0 °C | -67.0 °F | |
| Parker Chomerics CHO-SEAL 1240 Conductive Elastomer Conductive Elastomer EMI/EMP GasketsInformation provided by Chomerics |
|||
| Minimum Service Temperature, Air | -55.0 °C | -67.0 °F | Flex TR10; ASTM D1329 |
| Parker Chomerics CHO-SEAL 1350 Conductive Elastomer Standard material for high volume injection and compression molding and small extrusions; high performance in non-corrosive environments; used in grounding applications with little or no vibration.R.. |
|||
| Minimum Service Temperature, Air | -55.0 °C | -67.0 °F | |
| Parker Chomerics THERM-A-GAP™ GEL 30 High Performance Fully Cured Dispensable Gel Description: Parker Chomerics fully cured dispensable GELs eliminate time consuming hand assembly, decreasing installation costs and reducing customer manufacturing and purchasing (logistical) compl.. |
|||
| Minimum Service Temperature, Air | -55.0 °C | -67.0 °F | |
| Parker Chomerics Tecknit Teckfip™ FIP-N Formed in Place Conductive Elastomer Description: FIP-N is similar in performance to FIP-A elastomer and hence offers a good non-corrosive EMI shield in harsh conditions. This material is one of our more cost effective FIP compoundsInf.. |
|||
| Minimum Service Temperature, Air | -55.0 °C | -67.0 °F | |
| Parker Chomerics METALKLIP® Clip-On EMI Gasket Description: Chomerics’ METALKLIP® gasketing is a simple, quick means of mounting on EMI gasket onto 15-20 gauge sheet metal enclosure doors or frames. EMI shielding is provided by either a carbon.. |
|||
| Minimum Service Temperature, Air | -55.0 °C | -67.0 °F | |
| Polyphosphazene Rubber (PZ, FZ) FZ refers to the fluorinated (55 wt%) polymer. |
|||
| Minimum Service Temperature, Air | -55.0 °C | -67.0 °F | Intermittent |
| Epoxy Technology EPO-TEK® 509FM-1 General Purpose Epoxy Product Description: EPO-TEK® 509FM-1 is a two component, optically opaque epoxy designed for potting of semiconductors, PCB and systems-level electronics. It can be used in many electronic indust.. |
|||
| Minimum Service Temperature, Air | -55.0 °C | -67.0 °F | Intermittent |
| Epoxy Technology EPO-TEK® E2101 Electrically Conductive, Silver Epoxy Product Description: EPO-TEK® E2101 is a two component, thixotropic, electrically conductive adhesive. It may be used for circuit assembly and semiconductor applications. Advantages & Application .. |
|||
| Minimum Service Temperature, Air | -55.0 °C | -67.0 °F | Intermittent |
| Epoxy Technology EPO-TEK® E3001 Electrically Conductive, Silver Epoxy Product Description: EPO-TEK® E3001-HV is a snap cure, single component, silver-filled die attach adhesive for semiconductor plastic IC packaging. Also available in a frozen syringe. Advantages & .. |
|||
| Minimum Service Temperature, Air | -55.0 °C | -67.0 °F | Continuous |
| Epoxy Technology EPO-TEK® E4110-PFC Electrically Conductive Epoxy Product Description: EPO-TEK®E4110-PFC is a two-component, silver filled, electrically conductive adhesive designed for semiconductor IC packaging and general electronic assembly. It is a thixotr.. |
|||
| Minimum Service Temperature, Air | -55.0 °C | -67.0 °F | Intermittent |
| Epoxy Technology EPO-TEK® EE149-6 Epoxy Material Description: A single component, silver-filled, B-stageable epoxy designed for semiconductor flip chip packaging or hybrid micro-electronic substrate attach or lid-sealing.Information Provi.. |
|||
| Minimum Service Temperature, Air | -55.0 °C | -67.0 °F | Continuous |
| Epoxy Technology EPO-TEK® H20-LC Electrically Conductive, Silver Epoxy Product Description: EPO TEK® H20E-LC is a two component, silver-filled epoxy system designed specifically for chip bonding in microelectronic and optoelectronic applications. It is also used exte.. |
|||
| Minimum Service Temperature, Air | -55.0 °C | -67.0 °F | Intermittent |
| Epoxy Technology EPO-TEK® H61 Unfilled Epoxy Adhesive Material Description: A single component, high Tg, electrically insulating epoxy adhesive for semiconductor, microelectronic, and opto-electronic packaging applications. It is a liquid version of E.. |
|||
| Minimum Service Temperature, Air | -55.0 °C | -67.0 °F | Intermittent |
| Epoxy Technology EPO-TEK® OM125 Optical Epoxy Product Description: EPO-TEK® OM125 is two component, high Tg, optical epoxy designed for bonding multi-mode fiber optic connectors. Advantages & Application Notes: Color coded blue for easy operat.. |
|||
| Minimum Service Temperature, Air | -55.0 °C | -67.0 °F | Intermittent |
| Epoxy Technology EPO-TEK® T7139 Glob Top Epoxy Product Description: EPO-TEK® T7139 is a two component, electrically insulating, encapsulating epoxy designed for semiconductor glob top applications and package assembly.Advantages & Application N.. |
|||
| Minimum Service Temperature, Air | -55.0 °C | -67.0 °F | Continuous |
| Epoxy Technology EPO-TEK® TV1002 Polyimide Adhesive Material Description: A single component, screen printable polyimide adhesive designed for semiconductor wafer passivation applications. It is a high temperature chemistry capable of resisting >400.. |
|||
| Minimum Service Temperature, Air | -55.0 °C | -67.0 °F | Continuous |
| Epoxy Technology EPO-TEK® U300-2 Two Component Epoxy Material Description: A two component epoxy designed for capillary underfill of semiconductor chips and SMDs. Long potlife, high Tg, and optical clarity are a few of its traits. NASA approved lo.. |
|||
| Minimum Service Temperature, Air | -55.0 °C | -67.0 °F | |
| ACC QSil 550 QSI Quantum Silicones Silicone Potting Material QSil 550 is a 100% silicone solids elastomer designed for electrical potting applications. The two-component system offers a hard, thermally conductive, low modulus material that is readily repairab.. |
|||
| Minimum Service Temperature, Air | -55.0 °C | -67.0 °F | |
| Aremco Aremco-Bond™ 2335 Ultra High Temperature Epoxy Ceramic-Filled, Low Expansion, High Lap-Shear Strength & Chemical Resistance, Low Outgassing. |
|||
Copyright © lookpolymers.com All Rights Reserved