Parker Chomerics CHO-BOND 4669 Conductive Caulk/Sealant

Category	Polymer , Adhesive , Thermoset
Manufacturer	Parker Chomerics
Trade Name	CHO-BOND
Port	Shanghai port,China
Trade Terms	FOB, CFR, CIF
Payment Terms	L/C, T/T, Western Union
Download PDF	Parker Chomerics CHO-BOND 4669 Conductive Caulk/Sealant.pdf
Price	EMAIL US sales@lookpolymers.com

Material Notes:

Chomerics two-component conductive epoxy caulks provide excellent adhesion to dissimilar substrates and can be used in lap or butt joint applications. They feature large silver-plated-copper particles that make them well suited for sealing poorly toleranced surfaces.Information provided by Chomerics

Physical Properties	Metric	English
Specific Gravity	1.70 - 2.30 g/cc	1.70 - 2.30 g/cc
Volatile Organic Compounds (VOC) Content	361 g/l	361 g/l
Volatiles	10 - 20 %	10 - 20 %
Thickness	>= 381 microns	>= 15.0 mil

Thermal Properties	Metric	English
Maximum Service Temperature, Air	100 °C	212 °F
Minimum Service Temperature, Air	-55.0 °C	-67.0 °F
Flash Point	>= 28.9 °C	>= 84.0 °F

Component Elements Properties	Metric	English	Comments
Copper, Cu	<= 60 %	<= 60 %
Silver, Ag	<= 10 %	<= 10 %

Electrical Properties	Metric	English	Comments
Volume Resistivity	<= 0.080 ohm-cm	<= 0.080 ohm-cm

Processing Properties	Metric	English	Comments
Cure Time	10100 min @Temperature 23.0 °C	168 hour @Temperature 73.4 °F
Shelf Life	6.00 Month	6.00 Month

Descriptive Properties	Value	Comments
Amorphous fumed silica wt. % Max	5
Binder	Polyisobutylene
Color	Gray/silver
Consistency	Gritty Paste
Coverage (cm^2 / g)	12.8
Ethyl Benzene wt. %	4
Filler	Ag/Cu
Mix Ratio	1-part
Physical Form	Gray/silver liquid with a solvent odor
Polyisobutylene wt. % Max	20
Working Life hr.	2.5
Xylene wt. %	10-20

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