Physical Properties | Metric | English | Comments |
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Thickness | 40.0 - 150 microns | 1.57 - 5.91 mil | Recommended |
Polimeri Europa Riblene® FC 39 Low Density Polyethylene - Blown Film Extrusion Riblene FC 39 is a high molecular weight low density polyethylene (LDPE) suitable for blown film extrusion. Riblene FC 39 is characterized by a high melt strength leading to a good bubble stability.. |
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Thickness | 40.0 - 150 microns | 1.57 - 5.91 mil | Recommended |
Polimeri Europa Riblene® FF 24 Low Density Polyethylene - Blown Film Extrusion Riblene FF 24 is a high molecular weight low density polyethylene (LDPE), with added slip and antiblocking agents, suitable for blown film extrusion. Riblene FF 24 is characterized by a good melt s.. |
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Thickness | 40.0 microns | 1.57 mil | ± 2.5%; ASTM-252-78 |
Kinlead PG13 Bag Grade BOPP Plain Film (thickness: 40 µm) PG13 is a printing, bag grade BOPP plain film. It is transparent and non heat sealable. It has excellent flatness and good ink adhesion. One side has corona treatment. It is widely used in gift wrap.. |
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Thickness | 40.0 microns | 1.57 mil | ± 2.5%; ASTM-252-78 |
Kinlead PG14 Bag Grade BOPP Plain Film (thickness: 40 µm) PG14 is a low static, bag grade BOPP plain film. It is transparent, low static, and non heat sealable. It has excellent flatness. One side has corona treatment. It is widely used in gift wrapping an.. |
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Thickness | 40.0 - 150 microns | 1.57 - 5.91 mil | |
Indium Corp. NanoFoil® High Temperature Nickel and Aluminum Sacrificial Heat Source As a sacrificial heat source in soldering and brazing applications, NanoFoil® is ideal for high-temperature applications. NanoFoil becomes a non-functional part of the solder or braze joint, eli.. |
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Thickness | 40.0 microns | 1.57 mil | |
Borealis Borstar® FB2230 LLDPE for Film Borstar BF2230 is a high molecular weight low density polyethylene film grade combining good and flexible extrusion behavior, excellent draw down and superior mechanical properties. Film made from .. |
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Thickness | 40.0 microns | 1.57 mil | |
Borealis Himod™ FT6273 LDPE for Film Himod FT6273 is a tubular, low-density polyethylene grade for the production of packaging films. Compared to standard LDPE grades, the Himod products provide a combination of higher stiffness and i.. |
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Thickness | 40.0 microns | 1.57 mil | |
Borealis Himod™ FT7294 LDPE for Film Himod FT7294 is a tubular, low-density polyethylene grade for the production of packaging films. Compared to standard LDPE grades, the Himod products provide a combination of higher stiffness and i.. |
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Thickness | 40.0 microns | 1.57 mil | for samples tested on this data sheet |
Total EVA 1003 VN 4 Ethylene Vinyl Acetate Copolymer - Blown Film EVA 1003 VN 4 is made by a high pressure tubular process. Grade for flexible films with very high transparency and outstanding mechanical properties. Contains an antioxidant.Application examples: .. |
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Thickness | 40.0 microns | 1.57 mil | for samples tested on this data sheet |
Total EVA 1005 VN 35 Ethylene Vinyl Acetate Copolymer - Blown Film EVA 1005 VN 35 is made by a high pressure tubular process. Grade for flexible films, with high transparency and outstanding mechanical properties. Contains NO antioxidant.Information provided by T.. |
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Thickness | 40.0 microns | 1.57 mil | for samples tested on this data sheet |
Total LDPE 1022 FH 24 Low Density Polyethylene - Blown Film LDPE 1022 FH 24 is a low density polyethylene made by a high pressure process.LDPE 1022 FH 24 is a slip and anti-block formulated grade.LDPE 1022 FH 24 is suited to many applications in the field of.. |
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Thickness | 40.0 microns | 1.57 mil | |
Total Lotrene® Q2018C Linear Low Density Polyethylene, Blown Film Lotrene® Q2018 Series are Linear Low Density Polyethylene resins produced in a gas phase reactor using butene (C4) co-monomer. They are designed for film applications and can be used in pure form .. |
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Thickness | 40.0 microns | 1.57 mil | |
Total Lotrene® Q2018H Linear Low Density Polyethylene, Blown Film Lotrene® Q2018 Series are Linear Low Density Polyethylene resins produced in a gas phase reactor using butene (C4) co-monomer. They are designed for film applications and can be used in pure form .. |
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Thickness | 40.0 microns | 1.57 mil | |
Total Lumicene® mPE M 4707 EP Metallocene Polyethylene, Blown Film This product is a Total Ecosolutions grade.Lumicene® mPE M 4707 EP is a second generation metallocene based High Density Polyethylene with hexene as comonomer.Lumicene® mPE M 4707 EP can be proces.. |
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Thickness | 40.0 microns | 1.57 mil | |
Borealis Borstar® FB4230 LLDPE for Film Borstar FB4250T is a high molecular weight linear low density polyethylene grade combining good extrusion properties, excellent draw properties and good mechanical strength. Film made from Borstar .. |
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Thickness | 40.0 microns | 1.57 mil | |
Total Lotrene® Q2018N Linear Low Density Polyethylene, Cast Film Lotrene® Q2018 Series are Linear Low Density Polyethylene resins produced in a gas phase reactor using butene (C4) co-monomer. They are designed for film applications and can be used in pure form .. |
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Thickness | 40.0 microns | 1.57 mil | |
Total Lumicene® mPE M 2704 EP S01 Metallocene Polyethylene, Blown Film This product is a Total Ecosolutions grade.Lumicene® mPE M 2704 EP S01 is a second generation metallocene based Low Density Polyethylene with hexene as comonomer.Lumicene® mPE M 2704 EP S01 can be.. |
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Thickness | 40.0 microns | 1.57 mil | |
Dow DOWLEX™ 2056 Linear Low Density Polyethylene, Heavy Duty Film Grade DOWLEX® 2056 Polyethylene resin is a premier polymer for heavy duty blown film applications. It is a low gel, high consistency polymer. It complies with U.S. FDA Regulation 21 CFR 177.1520 (c) 3.2 .. |
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Thickness | 40.0 microns | 1.57 mil | |
Dow LDPE 170A Low Density Polyethylene, Blown Film Grade DOW LDPE 170A resin is used for shrink and heavy duty blown film applications where optical clarity is desired. It contains medium level of antiblock additives. It complies with U.S. FDA regulation .. |
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Thickness | 40.0 microns | 1.57 mil | |
Dow LDPE 527A Low Density Polyethylene, Blown Film Grade DOW LDPE 527A is a general purpose blown film extrusion resin for use in medium duty liner film applications and other packaging applications. It contains high levels of antiblock additive. This mat.. |
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Thickness | 40.0 microns | 1.57 mil | |
Dow LDPE 530A Low Density Polyethylene, Blown Film Grade DOW LDPE 530A resin, is a general purpose barefoot blown film extrusion resin with excellent drawdown and processability for packaging applications. This material complies with U.S.FDA regulation 21.. |
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Thickness | 40.0 microns | 1.57 mil | |
Dow LDPE 534A Low Density Polyethylene, Blown Film Grade DOW LDPE 534A resin, is a general purpose blown film extrusion resin with excellent drawdown and processability for packaging applications. It contains medium levels of both slip additive and antibl.. |
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Thickness | 40.0 microns | 1.57 mil | |
Dow LDPE 641I Low Density Polyethylene, Liner Film Grade DOW LDPE 641I resin is a general purpose liner film resin for thin gauge applications requiring good drawdown and excellent toughness. It contains medium levels of slip additive and low levels of an.. |
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Thickness | 40.0 microns | 1.57 mil | |
Dow LDPE 681I Low Density Polyethylene, Liner Film Grade DOW LDPE 681I resin is a barefoot general purpose medium duty liner film resin for packaging applications. This material complies with U.S.FDA regulation 21 CFR 177.1520(c) 2.1 for food contact appl.. |
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Thickness | 40.0 microns | 1.57 mil | |
Dow LDPE 682I Low Density Polyethylene, Film Grade DOW LDPE 682I barefoot resin is used for shrink, frozen food, and heavy duty film applications. This material complies with U.S.FDA regulation 21 CFR 177.1520(c) 2.1 for food contact applications. T.. |
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Thickness | 40.0 microns | 1.57 mil | |
Dow LDPE 768A Low Density Polyethylene, Film Grade DOW LDPE 768A resin is a medium density film resin with additional stabilization for films requiring high modulus such as paper overwrap. It contains low levels of both slip additive and antiblock a.. |
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Thickness | 40.0 microns | 1.57 mil | Adhesive Thickness |
Caplinq LINQTAPE™ PIT2A Product Description: LINQTAPE™ PIT-Series is a high-temperature resistant polyimide tape designed for both permanent and temporary bonding in many high temperature applications. Additionally, it p.. |
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Thickness | 40.0 microns | 1.57 mil | Adhesive Thickness |
Caplinq LINQTAPE™ PIT1S Product Description: LINQTAPE™ PIT-Series is a high-temperature resistant polyimide tape designed for both permanent and temporary bonding in many high temperature applications. Additionally, it p.. |
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Thickness | 40.0 - 60.0 microns | 1.57 - 2.36 mil | PET |
CeramTec Ceramtape GC Glass Ceramic LTCC (Low Temperature Cofired Ceramic) is a new type of ceramic film developed by CeramTec AG's Electronics division. With the aid of these ceramics and their almost shrinkage-free sintering process.. |
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Thickness | 40.0 microns | 1.57 mil | |
DuPont Elvaloy® 3108 AC Ethylene and 7% Butyl Acrylate Copolymer
(discontinued **) Elvaloy® 3108 AC contains antioxidant, slip and antiblock additives.Elvaloy® 3108 AC is developed to give films with good sealing properties, impact strength at lower temperature, and low shrinkag.. |