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- Polymer Property : Viscosity = 250000 cP
Polymer Property : Viscosity = 250000 cP Product List
Physical PropertiesTips: 30 items are displayed at most. For the rest of the results, please contact customer service.
| Physical Properties | Metric | English | Comments |
|---|---|---|---|
| Viscosity | 250000 cP @Temperature 25.0 °C |
250000 cP @Temperature 77.0 °F |
Uncured |
| Permabond LH050 Anaerobic Threadsealant Permabond® LH050 pipe sealant with PTFE is a general purpose pipe sealant that provides instant air pressure seal up to 1000 psi with limited hand tightening. After cure, the sealing capability is .. |
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| Viscosity | 250000 cP | 250000 cP | Part A, Spindle TD, 2.5 rpm; Uncured |
| Resinlab® AR 4305 Metal Bonding Methacrylate Adhesive Resinlab™ AR 4305 is a 1:1 mix methacrylate-based structural adhesive designed for general purpose bonding of a wide variety of materials in industrial applications. AR 4305 forms tough, durable bo.. |
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| Viscosity | 250000 cP | 250000 cP | Part B, Spindle TD, 2.5 rpm; Uncured |
| Resinlab® AR 4305 Metal Bonding Methacrylate Adhesive Resinlab™ AR 4305 is a 1:1 mix methacrylate-based structural adhesive designed for general purpose bonding of a wide variety of materials in industrial applications. AR 4305 forms tough, durable bo.. |
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| Viscosity | 250000 cP | 250000 cP | RVT, #7, 2.5 rpm; TM R050-12 |
| Resinlab® EP1330LV Heat Cure Epoxy Polymer System Resinlab™ EP1330 and EP1330LV are one part heat cure epoxy polymer systems. They can also be used as a small mass potting or staking compounds, or a dam adhesive in and “dam and fill” application.. |
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| Viscosity | 250000 - 350000 cP @Temperature 400 - 400 °C |
250000 - 350000 cP @Temperature 752 - 752 °F |
Average value: 300000 cP Grade Count:2 |
| Overview of materials for Polyetheretherketone, PTFE Filled This property data is a summary of similar materials in the MatWeb database for the category "Polyetheretherketone, PTFE Filled". Each property range of values reported is minimum and maximum values.. |
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| Viscosity | 250000 cP @Temperature 400 °C |
250000 cP @Temperature 752 °F |
melt; ISO 11443 |
| Victrex® PEEK 90CA30 Polyetheretherketone, 30% Carbon Fibre Reinforced Product Description:High performance thermoplastic material, 30% carbon fibre reinforced Polyetheretherketone (PEEK), semi crystalline, granules for injection moulding, very easy flow, FDA food cont.. |
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| Viscosity | 250000 cP | 250000 cP | Part A, Spindle TD, 2.5 rpm; Uncured |
| Resinlab® AR 4305 HP Metal Bonding Methacrylate Adhesive Resinlab™ AR 4305 HP is a 1:1 mix methacrylate-based structural adhesive designed for general purpose bonding of a wide variety of materials in industrial applications. AR 4305 HP forms tough, dur.. |
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| Viscosity | 250000 cP | 250000 cP | Part A, Spindle TD, 2.5 rpm; Uncured |
| Resinlab® AR 4305 White Metal Bonding Methacrylate Adhesive Resinlab™ AR 4305 White is a 1:1 mix methacrylate-based structural adhesive designed for general purpose bonding of a wide variety of materials in industrial applications. AR 4305 White forms tough.. |
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| Viscosity | 250000 cP | 250000 cP | Part B, Spindle TD, 2.5 rpm; Uncured |
| Resinlab® AR 4305 White Metal Bonding Methacrylate Adhesive Resinlab™ AR 4305 White is a 1:1 mix methacrylate-based structural adhesive designed for general purpose bonding of a wide variety of materials in industrial applications. AR 4305 White forms tough.. |
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| Viscosity | 250000 cP | 250000 cP | Part A, Spindle TD, 2.5 rpm; Uncured |
| Resinlab® AR 4315 HP Metal Bonding Methacrylate Adhesive Resinlab™ AR 4315 HP is a 1:1 mix methacrylate-based structural adhesive formulated to bond almost all engineered thermoplastics, thermosets, composites, and metal structural elements together in a.. |
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| Viscosity | 250000 cP | 250000 cP | Part A, Spindle TD, 2.5 rpm; Uncured |
| Resinlab® AR 4315 Metal Bonding Methacrylate Adhesive Resinlab™ AR 4315 is a 1:1 mix methacrylate-based structural adhesive formulated to bond almost all engineered thermoplastics, thermosets, composites, and metal structural elements together in any .. |
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| Viscosity | 250000 cP | 250000 cP | Spindle TD, 2.5 rpm; Curing |
| Resinlab® AR 4315 Metal Bonding Methacrylate Adhesive Resinlab™ AR 4315 is a 1:1 mix methacrylate-based structural adhesive formulated to bond almost all engineered thermoplastics, thermosets, composites, and metal structural elements together in any .. |
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| Viscosity | 250000 cP | 250000 cP | Spindle TD, 2.5 rpm; Curing |
| Resinlab® AR 4340 HP Metal Bonding Methacrylate Adhesive Resinlab™ AR 4340 HP is a 1:1 mix methacrylate-based structural adhesive designed for general purpose bonding of a wide variety of materials in industrial applications. It is an accelerated version.. |
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| Viscosity | 250000 cP | 250000 cP | B |
| Shin-Etsu Silicones LIMSâ„¢ KE1950-30A/B Elastomer KE-1950-30 is a liquid injection molding silicone. It is supplied as two components which are mixed in a 1:1 ratio to ensure easy and accurate blending. It's viscosity is low enough to allow easy .. |
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| Viscosity | 250000 cP @Temperature 25.0 °C |
250000 cP @Temperature 77.0 °F |
Dynamic |
| Struktol POLYDIS 3615 Elastomer modified epoxy prepolymer Applications: STRUKTOL VP 3615 is used where conventional epoxy systems and prepolymers are unable to satisfy the demands of for example impact, flexural and peel strength. Contrary to PD 3614 the T.. |
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| Viscosity | >= 250000 cP @Temperature 23.0 °C |
>= 250000 cP @Temperature 73.4 °F |
|
| Master Bond Supreme 10HT One Component, Low Outgassing, Toughened Epoxy System Master Bond Supreme 10HT features a unique blend of performance properties including both high shear and peel strengths along with convenient handling. Supreme 10HT is room temperature storable and .. |
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| Viscosity | >= 250000 cP @Temperature 23.0 °C |
>= 250000 cP @Temperature 73.4 °F |
|
| Master Bond Supreme 10HTF Fast Curing Toughened One Component Epoxy Adhesive Master Bond Polymer System Supreme 10HTF is a one part, no-mix system featuring a unique combination of properties including high shear and peel strength, exceptionally wide service temperature rang.. |
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| Viscosity | 250000 cP @Temperature 180 °C |
250000 cP @Temperature 356 °F |
Melt; Flowtester (100 kgf/cm², dimension of die 1 Φ mm x 10 mm) |
| Zeon Chemicals Quintac® 3460 SIS Block Polymer Styrene Isoprene (SIS) Block Polymer. Suitable for HMAInformation provided by Zeon Chemicals L.P. |
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| Viscosity | 250000 cP | 250000 cP | Haake cone and plate rheometer @ 5/sec (35mm/2° cone) |
| Loctite® 3532 High viscosity Dam Encapsulant COB/DCA Encapsulants are essential to the reliability of flip chip assemblies because they minimize the thermal mismatch between the flip chip and substrate.Loctite® Underfills and Encapsulants imp.. |
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| Viscosity | 250000 cP @Shear Rate 1000 1/s, Temperature 260 °C |
250000 cP @Shear Rate 1000 1/s, Temperature 500 °F |
melt viscosity; b.o. ISO 11443-A |
| Covestro Bayblend® T88 GF-30 Rubber Modified PC Blend, 31% Glass Filled Main characteristics:• High toughness even at low temperatures• High dimensional accuracy and stability• Good paintability• Good flowabilityGrade characteristics:• Rubber modified PC blend.. |
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| Viscosity | 250000 cP @Shear Rate 1000 1/s, Temperature 260 °C |
250000 cP @Shear Rate 1000 1/s, Temperature 500 °F |
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| DSM Akulon® F127 PA6 Low/Medium Viscosity, Film Extrusion |
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| Viscosity | 250000 cP @Temperature 160 °C |
250000 cP @Temperature 320 °F |
2.16 kg load; ISO 1133 |
| EMS-Griltech Griltex® D 1260 A Copolyamide Hotmelt Adhesive (Apparel Interlinings) Description: GRILTEX adhesive products, either in pellet or powdered form, are used to coat apparel interlining substrates. Interlining substrates, coated with GRILTEX adhesive products, provides fo.. |
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| Viscosity | 250000 cP @Temperature 160 °C |
250000 cP @Temperature 320 °F |
2.16 kg load; ISO 1133 |
| EMS-Griltech Griltex® D 1531E Copolyester Hotmelt Adhesive (Technical Applications) Description: GRILTEX adhesive products, either in pellet or powdered form, are used to coat apparel interlining substrates. Interlining substrates, coated with GRILTEX adhesive products, provides fo.. |
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| Viscosity | 250000 - 400000 cP @Temperature 23.0 °C |
250000 - 400000 cP @Temperature 73.4 °F |
1 rpm |
| Epoxy Technology EPO-TEK® H55 Epoxy Material Description: A two component, thixotropic and high temperature epoxy designed to be used for hybrids and PCB applications.Information Provided by Epoxy Technology |
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| Viscosity | 250000 - 300000 cP @Temperature 23.0 °C |
250000 - 300000 cP @Temperature 73.4 °F |
0.5 rpm |
| Epoxy Technology EPO-TEK® H81A Epoxy Material Description: A two component, gold-filled, electrically and thermally conductive epoxy designed for hybrid microelectronic and semiconductor packaging.Information Provided by Epoxy Technolo.. |
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| Viscosity | 250000 cP @Shear Rate 1000 1/s, Temperature 240 °C |
250000 cP @Shear Rate 1000 1/s, Temperature 464 °F |
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| DSM Akulon® F128 PA6 Film Extrusion, Medium Viscosity |
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| Viscosity | 250000 cP @Shear Rate 1000 1/s, Temperature 260 °C |
250000 cP @Shear Rate 1000 1/s, Temperature 500 °F |
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| DSM Akulon® XP36-E1 PA6 Film Extrusion, Medium Viscosity, Nucleated, Lubricated |
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| Viscosity | 250000 cP | 250000 cP | |
| Armstrong A-701 Epoxy Adhesive A one-component, light gray, thixotropic, non-sag epoxy adhesive. A-701 uses an inert oxide filler that provides excellent electrical insulation properties. Features high temperature, 400°F, bond.. |
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| Viscosity | 250000 - 1.50e+6 cP | 250000 - 1.50e+6 cP | Thixotropic |
| Loctite® Quick Metal® 660 Retaining Compound RetainersLoctite Corporation, the pioneer of anaerobic adhesives, has applied this technology to create retaining compounds that increase the shear strength of cylindrical, non-threaded assemblies. .. |
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