Reltek BONDiT™ B-536TH Adhesive System

Category	Polymer , Adhesive
Manufacturer	Reltek LLC
Trade Name	BONDiT™
Port	Ningbo port,China
Trade Terms	FOB, CFR, CIF
Payment Terms	L/C, T/T, Western Union
Download PDF	Reltek BONDiT™ B-536TH Adhesive System.pdf
Price	EMAIL US sales@lookpolymers.com
	Online Service lookpolymers 27660005

Material Notes:

Key PropertiesVery high strength bonding of dissimilar materials. High moisture and solvent resistance. Fast ambient cure with good pot life. Ease of use. ApplicationsOutstanding adhesive for very high strength potting and assembly applications. Bonds most plastics, metals, glass and ceramics. Good for electronics applications. High moisture resistance. Full cure 60 minutes at ambient or 10 minutes at 170º F or higher temperatures for faster cure down to 15 sec.Information provided by Reltek LLC

Physical Properties	Metric	English	Comments
Specific Gravity	1.05 g/cc	1.05 g/cc	A
	1.42 g/cc	1.42 g/cc	B
Viscosity	2500 cP	2500 cP

Mechanical Properties	Metric	English
Tensile Strength at Break	51.15 MPa	7418 psi
Tensile Strength, Yield	53.04 MPa	7693 psi
Elongation at Break	9.2 %	9.2 %
Elongation at Yield	8.6 %	8.6 %

Descriptive Properties	Value	Comments
Color	Clear with slight amber
Peak Stress (psi)	7693

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