Polymer Property : Viscosity = 2500 cP Product List

Physical Properties

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Physical Properties	Metric	English	Comments
Viscosity	2500 cP	2500 cP	Thrixotropic
Reltek BONDiT™ B-521 Adhesive, Sealant & Potting System Key Properties: Outstanding for bonding dissimilar materials with high thermal expansion differential applications.Fast thermal cure, long pot life.Ease of use.Applications: Excellent for fast assem..
Viscosity	2500 cP	2500 cP
Reltek BONDiT™ B-536 Adhesive System Key Properties: Very high strength bonding of dissimilar materials.High moisture and solvent resistance.Fast ambient cure with good pot life.Ease of use.Applications: Outstanding adhesive for very h..
Viscosity	2500 cP	2500 cP
Reltek BONDiT™ B-536TH Adhesive System Key PropertiesVery high strength bonding of dissimilar materials. High moisture and solvent resistance. Fast ambient cure with good pot life. Ease of use. ApplicationsOutstanding adhesive for very h..
Viscosity	2500 cP	2500 cP
Resin Technology Group 1109-DP Oxy-Bond™ Two-Component Epoxy Adhesive Oxy-Bond and Millenium Adhesive SystemsEngineered for strength, durability, lightness, and formability, our Oxy-Bond and Millenium lines offer adhesives with physical and electrical properties to ma..
Viscosity	2500 cP @Temperature 25.0 °C	2500 cP @Temperature 77.0 °F	Uncured
Resin Technology Group UV-S-2051 High Impact, UV Curable Plastic Bonder UV S-2051 is a general purpose, fast cure response, high thermal-shock resistant, UV curing adhesive designed for use in a variety of applications including chip bonding, laminating, tacking, and se..
Viscosity	2500 cP	2500 cP	Mixed; TM R050-12
Resinlab® EP965LVLX Black Unfilled Electronic Grade Epoxy Encapsulant Resinlab™ EP965LVLX Black is a two part unfilled electronic grade epoxy encapsulant designed for small to medium sized castings. It cures at room temperature to a tough, semi-rigid polymer. It has ..
Viscosity	2500 cP	2500 cP
Reltek BONDiT™ B-481 Adhesive, Sealant & Coating System Key Properties: High strength and toughness with excellent thermal stability to 400°F.Outstanding chemical resistance.Excellent electrical, and mechanical properties.Ease of use.Applications: Encap..
Viscosity	2500 cP @Temperature 25.0 °C	2500 cP @Temperature 77.0 °F	Mixed
Resin Technology Group TIGA 110-EXDP Low Viscosity, Optically Clear Glass Bonder Mix ratio 100/50 by volume.TIGA 110EX-DP is a transparent, low viscosity epoxy resin formulation recommended for industrial adhesive, small potting and laminating applications where sparkling clarit..
Viscosity	2500 - 6000 cP	2500 - 6000 cP
Huntsman Araldite GZ 571 KX-75 Bisphenol A Epoxy Solution Weight per Epoxide (EEW, g/eq) 450 to 530. Max color is 3.Comments/Applications: GT 7071 - 75% solids in MIBK (16%) and xylene (9%). High performance 2-package system for coatings, flooring and ge..
Viscosity	2500 - 5000 cP @Temperature 25.0 Â°C	2500 - 5000 cP @Temperature 77.0 Â°F
Lucite International Colacryl Â® TS1778 Acrylic Solution Resin Colacryl TS 1778 is a self cross-linking acrylic copolymer designed for adhesive applications. Once dried, a film cast from this product remains permanently tacky.Suggested Uses: Pressure-sensitiv..
Viscosity	2500 - 3000 cP	2500 - 3000 cP	As Supplied
Heraeus Cleviosâ„¢ S V3 Antistatic/Conductive Polymer Coating for Screen Printing Poly(3,4-ethylenedioxythiophene)poly(styrenesulfonate), provided as a paste designed for application by silk screen printing to be used for transparent conductive devices. Cleviosâ„¢ S V3 grade ..
Viscosity	2500 cP	2500 cP
Shin-Etsu Silicones KE-3475TUV Silicone, RTV Conformal Coating Information Provided by Shin-Etsu Silicones of America, Inc.
Viscosity	2500 cP	2500 cP	Mixed
Tra-Con Tra-Duct 925M01 Low Ion Snap Cure Silver-Filled Epoxy TRA-DUCT 925M01 is a low ion snap cure silver-filled epoxy. TRA-DUCT 925M01 develops strong, durable, void free electrically and thermally conducting bonds. The product can be screen printed, stenci..
Viscosity	2500 - 5000 cP	2500 - 5000 cP	Part B
Master Bond Supreme 33CLV Two Component, Room Temperature Curing Toughened Epoxy Master Bond Polymer System Supreme 33CLV is a special, room temperature curing, toughened epoxy adhesive/sealant, featuring exceptionally high temperature resistance. This innovative system has outs..
Viscosity	2500 cP	2500 cP
Loctite® 638 Maximum Strength Retaining Compound RetainersLoctite Corporation, the pioneer of anaerobic adhesives, has applied this technology to create retaining compounds that increase the shear strength of cylindrical, non-threaded assemblies. ..
Viscosity	2500 cP	2500 cP	dynamic
Dow Corning Y-30 ANTIFOAM EMULSION Dow Corning Antifoam Y-30 Emulsion is a water-dilutable, 30 percent active silicone emulsion designed to control foam in aqueous systems.Information provided by Dow Corning
Viscosity	2500 - 3300 cP @Temperature 23.0 °C	2500 - 3300 cP @Temperature 73.4 °F	100 rpm
Epoxy Technology EPO-TEK® EM127 Electrically Conductive Epoxy Product Description: EPO-TEK® EM127 is a single component, heat curable, electrically conductive epoxy adhesive for semiconductor IC and LED die attach applications.Advantages & Application Notes: ..
Viscosity	2500 cP	2500 cP	STD
Dymax 628 Structural Adhesive Structural Adhesives for Rugged Bonding, Sealing, Tacking and Potting in SecondsMulti-Cure® 600 Series products are rapid setting adhesives that cure by UV light, activator or heat. These products ..
Viscosity	2500 - 4500 cP	2500 - 4500 cP
3M Scotch-Weld™ CA100 Instant Adhesive 3M™ Scotch-Weld™ Instant Adhesives are single component, high strength cyanoacrylate adhesives. High-peel and impact strength and high thermal shock and heat resistance.Information provided by 3M..
Viscosity	2500 cP	2500 cP
3M Scotch-Weld™ EC2500 General Purpose Instant Adhesive 3M™ Scotch-Weld™ General Purpose Instant Adhesives are single component, high strength ethyl cyanoacrylate adhesive designed to bond to a variety of substances including most plastics, rubbers, me..
Viscosity	2500 - 5000 cP	2500 - 5000 cP
Aremco Ceramabond™ 670 High Temperature Ceramic Adhesive/Paste, Alumina Filled Aremco's ceramic adhesives are easy to use, one- and two-component systems which air dry in 1-2 hrs and are ready for use following a 200 to 700 °F cure. These materials are mostly water-based and..
Viscosity	2500 cP	2500 cP	uncured
Atom Adhesives AA-DUCT 2924 Epoxy Adhesive AA-DUCT 2924 is a two part electrically conductive composition developed for low shrinkage; low resistivity bonding applications where good electrical and physical properties over a wide temperature..
Viscosity	<= 2500 cP	<= 2500 cP
Beijing Ranger Chem WSR618 Liquid Epoxy Resin Information provided by Beijing Ranger Chemical Co.
Viscosity	2500 - 4500 cP	2500 - 4500 cP
3M Pronto™ CA-100 Instant Adhesive One-part, room-temperature curing adhesive that is ready-to-use without metering or mixing. Bonded parts reach handling strength in 5-10 seconds on many applications.Toughened material that provide..
Viscosity	2500 cP	2500 cP
Abatron AboCast 50-3/AboCure 50-3 Clear Epoxy Adhesive and Casting Compound AboCast 50-3 is a medium viscosity, clear Epoxy Resin. AboCure 50-3 is clear-amber in color, room-temperature-cure, and slow. It has variable ratios and low viscosity. AboCast 50-3/AboCure 50-3 is u..
Viscosity	2500 cP	2500 cP	Mixed; TM R050-12
Resinlab® EP965LVLX Clear Unfilled Electronic Grade Epoxy Encapsulant Resinlab™ EP965LVLX Clear is a two part unfilled electronic grade epoxy encapsulant designed for small to medium sized castings. It cures at room temperature to a tough, semi-rigid polymer. It has ..