Songhan Plastic Technology Co.,Ltd.

Lord Adhesives Metech 3505 Palladium Silver Conductor Composition

Category Polymer , Adhesive
Manufacturer Lord Adhesives
Trade Name Metech
Port Ningbo port,China
Trade Terms FOB, CFR, CIF
Payment Terms L/C, T/T, Western Union
Download PDF Lord Adhesives Metech 3505 Palladium Silver Conductor Composition.pdf
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Material Notes:
Designed for use in the manufacture of hybrid circuitry, resistor networks, potentiometers as well as general purpose microcircuitry. It employs a conventional glass bonding mechanism, has wide processing parameters and is optimized for use with high speed printing equipment. Fired conductor exhibits high initial and aged adhesion values and readily accepts tin lead and tin lead silver solders.All information provided by Lord.
Physical Properties Metric English Comments
Viscosity 200000 - 260000 cP
200000 - 260000 cP
Thickness 12.0 microns
0.472 mil
Electrical Properties Metric English Comments
Surface Resistivity per Square 0.020 ohm
0.020 ohm
Processing Properties Metric English Comments
Shelf Life 12.0 Month

@Temperature 25.0 °C
12.0 Month

@Temperature 77.0 °F
Descriptive Properties Value Comments
Adhesion 4-5
lbs; aged (100 hrs. at 150ºC)
lbs; initial
Coverage (cm²/gm) 70-75
Calculated from 50 micron wet film
Line Resolution (microns) 150
Silver to Palladium Ratio 4:1
Solder Leach Resistance (cycles) 5
Number of 5-second cycles required to leach 50% of a 10 mil wide conductive line using 62Sn/36Pb/2Ag at 230ºC
Solder Wetting (seconds) < 3
Time required to 100% solder wet 0.08" x 0.08" pad size using 62Sn/36Pb/2Ag at 230ºC
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