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Lord Adhesives Metech 1130C Platinum Silver Conductor Composition

Category Polymer , Adhesive
Manufacturer Lord Adhesives
Trade Name Metech
Port Shanghai port,China
Trade Terms FOB, CFR, CIF
Payment Terms L/C, T/T, Western Union
Download PDF Lord Adhesives Metech 1130C Platinum Silver Conductor Composition.pdf
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Material Notes:
This low cost, platinum silver conductor is designed for general hybrid applications. It employs advanced powders technology with a mix bonded frit system to yield a highly dense film that is resistant to solder leaching. It also exhibits excellent adhesion to beryllium oxide substrates.All information provided by Lord.
Physical Properties Metric English Comments
Brookfield Viscosity 160000 - 220000 cP

@Temperature 25.0 °C
160000 - 220000 cP

@Temperature 77.0 °F
HBT, Spindle #SC4-14 @ 10rpm
Thickness 11.0 - 13.0 microns
0.433 - 0.512 mil
Fired
Electrical Properties Metric English Comments
Surface Resistivity per Square <= 0.0025 ohm
<= 0.0025 ohm
Processing Properties Metric English Comments
Shelf Life 12.0 Month

@Temperature 25.0 °C
12.0 Month

@Temperature 77.0 °F
Descriptive Properties Value Comments
Adhesion 3-4
lbs; aged (500hrs. at 150ºC)
4-5
lbs; initial
Coverage (cm²/gm) 70-75
Calculated from 50 micron wet film
Line Resolution (microns) 125
Solder Leach Resistance (cycles) 5
Number of 5-second cycles required to leach 50% of a 10 mil wide conductive line using 62Sn/36Pb/2Ag at 230ºC
Solder Wetting (seconds) < 3
Time required to 100% solder wet 0.08" x 0.08" pad size using 62Sn/36Pb/2Ag at 230ºC
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