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Cytec (Conap) FR-1046 / EA-028 Conapoxy® Resin / Conacure® Hardener

Category Polymer , Adhesive , Thermoset , Epoxy , Epoxy Encapsulant, Unreinforced
Manufacturer Cytec
Trade Name
Port Shanghai port,China
Trade Terms FOB, CFR, CIF
Payment Terms L/C, T/T, Western Union
Download PDF Cytec (Conap) FR-1046 / EA-028 Conapoxy® Resin / Conacure® Hardener.pdf
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Material Notes:
Epoxy Potting and Encapsulating Systems for Electronic ApplicationsHigh technology epoxy resin systems for potting and encapsulation, for the defense, aerospace, electronics, computer, automotive and related industries.Cytec (Conap) FR-1046 / EA-028 Conapoxy® Resin / Conacure® HardenerA filled, non-abrasive, low viscosity, low shrinkage, low exotherm system with excellent resistance to thermal shock and very good electrical insulation properties. Low cost.Mix Ratio, Resin/Hardener (by weight): 100/14 Cure Type: Room Temperature
Physical Properties Metric English Comments
Viscosity 3600 cP

@Temperature 25.0 °C
3600 cP

@Temperature 77.0 °F
Mechanical Properties Metric English Comments
Hardness, Shore D 85
85
Thermal Properties Metric English Comments
Maximum Service Temperature, Air 130 °C
266 °F
Electrical Properties Metric English Comments
Volume Resistivity <= 1.00e+15 ohm-cm
<= 1.00e+15 ohm-cm
Dielectric Constant 5.7

@Frequency 1000 Hz
5.7

@Frequency 1000 Hz
Dielectric Strength 14.8 kV/mm
375 kV/in
Dissipation Factor 0.0050

@Frequency 1000 Hz
0.0050

@Frequency 1000 Hz
Processing Properties Metric English Comments
Cure Time 1440 min

@Temperature 25.0 °C
24.0 hour

@Temperature 77.0 °F
Pot Life 50.0 min

@Temperature 25.0 °C
50.0 min

@Temperature 77.0 °F
100 grams
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