Processing Properties | Metric | English | Comments |
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Pot Life | 50.0 min @Temperature 25.0 °C |
50.0 min @Temperature 77.0 °F |
100 grams |
Cytec (Conap) FR-1046 / EA-028 Conapoxy® Resin / Conacure® Hardener Epoxy Potting and Encapsulating Systems for Electronic ApplicationsHigh technology epoxy resin systems for potting and encapsulation, for the defense, aerospace, electronics, computer, automotive an.. |
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Pot Life | 50.0 min @Temperature 25.0 °C |
50.0 min @Temperature 77.0 °F |
100 grams |
Cytec (Conap) FR-1046 / EA-87 Conapoxy® Resin / Conacure® Hardener Epoxy Potting and Encapsulating Systems for Electronic ApplicationsHigh technology epoxy resin systems for potting and encapsulation, for the defense, aerospace, electronics, computer, automotive an.. |
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Pot Life | 50.0 min @Temperature 25.0 °C |
50.0 min @Temperature 77.0 °F |
0.5 lbm |
Cytec EN-11 (Conap) Casting, Potting, and Molding Compound High Technology Potting, Casting and Molding CompoundsTwo-component, polybutadiene-based liquid urethane casting and potting systems. When reacted these high technology systems produce tough, stable.. |
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Pot Life | 50.0 min @Temperature 23.9 °C |
50.0 min @Temperature 75.0 °F |
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Devcon Carbide Putty Epoxy Abrasion-Resistant SystemComments: PuttyData provided by Ellsworth Adhesives. |
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Pot Life | 50.0 min | 50.0 min | uncured |
Atom Adhesives AA-BOND FDA26 Epoxy Adhesive AA-BOND FDA26 is Versatile adhesive guaranteed a high strength bond. AA-BOND FDA26 is two part adhesive used and cured at room temperature for bonding, repair applications by manufacturers of food p.. |