Electrical Properties | Metric | English | Comments |
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Volume Resistivity | 2.70e+13 ohm-cm | 2.70e+13 ohm-cm | |
Tra-Con Tra-Bond 2135D High Impact Epoxy Adhesive TRA-BOND 2135D is a medium viscosity epoxy adhesive recommended for bonding, laminating, sealing, and structural repair applications where easy mixing and good wetting combined with high impact stre.. |
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Volume Resistivity | 2.70e+13 ohm-cm | 2.70e+13 ohm-cm | |
Tra-Con Tra-Bond FS291 Thixotropic Room Temperature Cure Epoxy Adhesive TRA-BOND FS291 is a thixotropic room temperature cure epoxy adhesive system developed for structural bonding applications on vertical or overhead surfaces where its no-sag characteristics are critic.. |
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Volume Resistivity | 2.70e+13 ohm-cm | 2.70e+13 ohm-cm | |
Tra-Con Tra-Bond FS302 Easy-Flow No-Sag Epoxy Adhesive TRA-BOND FS-302 is a thixotropic room temperature cure epoxy adhesive system developed for structural bonding applications on vertical or overhead surfaces where its no-sag characteristics are criti.. |
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Volume Resistivity | 2.70e+13 ohm-cm | 2.70e+13 ohm-cm | |
Tra-Con Tra-Bond 2137 Easy-Flow No-Sag Epoxy Adhesive TRA-BOND 2137 epoxy adhesive is an easy-to-apply, room temperature cure epoxy adhesive system developed for structural bonding applications on vertical or overhead surfaces where its instant develop.. |
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Volume Resistivity | 2.70e+13 ohm-cm | 2.70e+13 ohm-cm | |
Atom Adhesives AA-BOND FS291 Epoxy Adhesive AA-BOND FS291 is a thixotropic room temperature cure epoxy adhesive system developed for structural bonding applications on vertical or overhead surfaces where its no-sag characteristics are critica.. |
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Volume Resistivity | 2.70e+13 ohm-cm | 2.70e+13 ohm-cm | |
Dow Corning 3120 RTV SILICONE RUBBER Two-part, red, condensation cure, moderate flow, high temperature performance, UL HB, cure speed varied by catalyst type and mix ratio.Information provided by Dow Corning |
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Volume Resistivity | 2.70e+13 ohm-cm | 2.70e+13 ohm-cm | |
Tra-Con Tra-Bond 2138 Easy-Flow No-Sag Epoxy Adhesive TRA-BOND 2138 epoxy adhesive is an easy-to-apply, room temperature cure epoxy adhesive system developed for structural bonding applications on vertical or overhead surfaces where its instant develop.. |