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Tra-Con Tra-Bond FS291 Thixotropic Room Temperature Cure Epoxy Adhesive

Category Polymer , Adhesive , Thermoset , Epoxy
Manufacturer Tra-Con, Inc.
Trade Name Tra-Bond
Port Ningbo port,China
Trade Terms FOB, CFR, CIF
Payment Terms L/C, T/T, Western Union
Download PDF Tra-Con Tra-Bond FS291 Thixotropic Room Temperature Cure Epoxy Adhesive.pdf
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Material Notes:
TRA-BOND FS291 is a thixotropic room temperature cure epoxy adhesive system developed for structural bonding applications on vertical or overhead surfaces where its no-sag characteristics are critical. This medium exotherming system exhibits excellent flow and wetting characteristics for precisely located dispensing from static mixing cartridges. Fully cured TRA-BOND FS291 may be employed on a wide variety of substrates including glass, most metals, and variety of plastics and provides excellent resistance to salt solutions, mild acids and alkalis, and many other chemicals including petroleum solvents, lubricating oils, and alcohol.Information provided by Tra-Con Inc.
Physical Properties Metric English Comments
Solids Content 100 %
100 %
Reactive Solids Content
Mechanical Properties Metric English Comments
Hardness, Shore D 80
80
Adhesive Bond Strength 22.8 MPa
3300 psi
Lap shear, alum to alum
Electrical Properties Metric English Comments
Volume Resistivity 2.70e+13 ohm-cm
2.70e+13 ohm-cm
Processing Properties Metric English Comments
Cure Time 60.0 min

@Temperature 65.0 °C
1.00 hour

@Temperature 149 °F
1440 min

@Temperature 25.0 °C
24.0 hour

@Temperature 77.0 °F
Descriptive Properties Value Comments
Mix Ratio, parts by weight 100/81
Resin/Hardener
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