Polymer Property : Dielectric Strength = 8380 kV/in Product List

Electrical Properties

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Electrical Properties	Metric	English	Comments
Dielectric Strength	>= 330 kV/mm	>= 8380 kV/in
Dow SiLK™ Y 120 Semiconductor Dielectric Resin SiLK™ Y 120 has an average pore size of < 2nm and a range of 1-3 nm, porous SiLK™ resins enables continuous Tantulum PVD barriers for 65 nm technology and beyond. Information provided by Dow
Dielectric Strength	>= 330 kV/mm	>= 8380 kV/in
Dow SiLK™ Y 250 Semiconductor Dielectric Resin SiLK™ Y 250 has an average pore size of < 2nm and a range of 1-3 nm, porous SiLK™ resins enables continuous Tantulum PVD barriers for 65 nm technology and beyond. Information provided by Dow
Dielectric Strength	>= 330 kV/mm	>= 8380 kV/in
Dow SiLK™ Y 80 Semiconductor Dielectric Resin SiLK™ Y 80 has an average pore size of < 2nm and a range of 1-3 nm, porous SiLK™ resins enables continuous Tantulum PVD barriers for 65 nm technology and beyond. Information provided by Dow
Dielectric Strength	330 kV/mm	8380 kV/in	JIS C-2319
DuPont Teijin Films Teonex® Q72 Polyester Film, 14 Gauge Teonex® Q72 is biaxially oriented, slightly hazy polyethylene naphthalate (PEN) film. This ultra thin film which was developed for capacitor applications. It is commercially available in nominal 14..