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Dow SiLK™ Y 250 Semiconductor Dielectric Resin

Category Polymer
Manufacturer Dow Chemical
Trade Name SiLK™
Port Shanghai port,China
Trade Terms FOB, CFR, CIF
Payment Terms L/C, T/T, Western Union
Download PDF Dow SiLK™ Y 250 Semiconductor Dielectric Resin.pdf
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Material Notes:
SiLK™ Y 250 has an average pore size of < 2nm and a range of 1-3 nm, porous SiLK™ resins enables continuous Tantulum PVD barriers for 65 nm technology and beyond. Information provided by Dow
Physical Properties Metric English Comments
Density 0.930 g/cc
0.0336 lb/in³
Thickness 0.220 - 0.310 microns
0.00866 - 0.0122 mil
Thermal Properties Metric English Comments
CTE, linear 49.0 µm/m-°C

@Temperature 50.0 - 410 °C
27.2 µin/in-°F

@Temperature 122 - 770 °F
Decomposition Temperature >= 500 °C
>= 932 °F
Optical Properties Metric English Comments
Refractive Index 1.53
1.53
Electrical Properties Metric English Comments
Dielectric Constant 2.2

@Frequency 100000 Hz
2.2

@Frequency 100000 Hz
Dielectric Strength >= 330 kV/mm
>= 8380 kV/in
Descriptive Properties Value Comments
Leakage Current A/cm², max 0.00000002
0.5 MV/cm
Leakage Current A/cm², max 0.00000004
1.0 MV/cm
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