Polymer Property : Gel Time = 5.80 min Product List

Processing Properties

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Processing Properties	Metric	English	Comments
Gel Time	3.50 - 5.80 min @Temperature 150 Â°C	3.50 - 5.80 min @Temperature 302 Â°F
Lord Adhesives Thermosetâ„¢ ME-430 Epoxy Board Level Encapsulant LORD Thermosetâ„¢ ME-430 encapsulant is a onecomponent, semiconductor grade epoxy designed for the encapsulation of Chip-on-Board (COB) devices. It is composed of 100% solids and formulated with ..