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- Lord Adhesives Thermosetâ„¢ ME-430 Epoxy Board Level Encapsulant
Lord Adhesives Thermosetâ„¢ ME-430 Epoxy Board Level Encapsulant
| Category | Polymer , Thermoset , Epoxy , Epoxy Encapsulant, Unreinforced |
| Manufacturer | Lord Adhesives |
| Trade Name | Thermoset™ |
| Port | Shanghai port,China |
| Trade Terms | FOB, CFR, CIF |
| Payment Terms | L/C, T/T, Western Union |
| Download PDF | Lord Adhesives Thermosetâ„¢ ME-430 Epoxy Board Level Encapsulant.pdf  |
| Price | EMAIL US sales@lookpolymers.com |
Material Notes:
LORD Thermosetâ„¢ ME-430 encapsulant is a onecomponent, semiconductor grade epoxy designed for the encapsulation of Chip-on-Board (COB) devices. It is composed of 100% solids and formulated with high purity resins, fillers and additives to provide the ionic purity levels required for use in high-end microelectronic applications.Thermoset ME-430 encapsulant offers good adhesion to both laminate and ceramic substrates, and can be used in demanding high-end, consumer printed circuit board and semiconductor applications.All information provided by Lord.
| Physical Properties | Metric | English | Comments |
|---|---|---|---|
| Specific Gravity | 1.80 g/cc | 1.80 g/cc | |
| Brookfield Viscosity | 255000 - 380000 cP @Temperature 25.0 °C |
255000 - 380000 cP @Temperature 77.0 °F |
Spindle 14 @ 1rpm |
| Mechanical Properties | Metric | English | Comments |
|---|---|---|---|
| Hardness, Shore D | 91 - 98 | 91 - 98 | |
| Modulus of Elasticity | 6.00 GPa | 870 ksi | DMA |
| Thermal Properties | Metric | English | Comments |
|---|---|---|---|
| CTE, linear | 19.0 µm/m-°C | 10.6 µin/in-°F | Below Tg; TMA |
| Glass Transition Temp, Tg | 135 °C | 275 °F | TMA |
| Component Elements Properties | Metric | English | Comments |
|---|---|---|---|
| Potassium, K | 0.00010 % | 0.00010 % | |
| Sodium, Na | 0.00050 % | 0.00050 % |
| Electrical Properties | Metric | English | Comments |
|---|---|---|---|
| Volume Resistivity | 1.00e+15 ohm-cm @Temperature 25.0 °C |
1.00e+15 ohm-cm @Temperature 77.0 °F |
|
| Dielectric Constant | 3.7 @Frequency 1.00e+6 Hz |
3.7 @Frequency 1.00e+6 Hz |
|
| Dissipation Factor | 0.0060 @Frequency 1.00e+6 Hz |
0.0060 @Frequency 1.00e+6 Hz |
| Processing Properties | Metric | English | Comments |
|---|---|---|---|
| Cure Time | 30.0 min @Temperature 150 °C |
0.500 hour @Temperature 302 °F |
|
| Pot Life | 1440 min @Temperature 25.0 °C |
1440 min @Temperature 77.0 °F |
|
| Gel Time | 3.50 - 5.80 min @Temperature 150 °C |
3.50 - 5.80 min @Temperature 302 °F |
|
| Shelf Life | 6.00 Month @Temperature -40.0 °C |
6.00 Month @Temperature -40.0 °F |
| Descriptive Properties | Value | Comments |
|---|---|---|
| Appearance | Black | |
| Chloride (%) | 0.0005 | |
| Consistency | Paste |
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