Polymer Property : Cure Time = 45.0 min Product List

Processing Properties

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Processing Properties	Metric	English
Cure Time	30.0 - 45.0 min @Temperature 93.3 °C	0.500 - 0.750 hour @Temperature 200 °F
Master Bond EP24 Fast Curing Two Component Epoxy System Master Bond Polymer Adhesive EP24 is a fast curing two component epoxy adhesive for general purpose bonding, sealing, and coating formulated to cure at room temperature with a one-to-one mix ratio, ..
Cure Time	30.0 - 45.0 min @Temperature 93.3 °C	0.500 - 0.750 hour @Temperature 200 °F
Master Bond Supreme 11 High Peel and Shear Strength Epoxy Adhesive Master Bond Polymer System Supreme 11 features a unique balance of performance properties including both high shear and high peel strengths. This two component adhesive system is formulated to cure ..
Cure Time	30.0 - 45.0 min @Temperature 93.3 °C	0.500 - 0.750 hour @Temperature 200 °F
Master Bond Supreme 11HT High Temperature Resistant Two Component Epoxy System Master Bond Polymer System Supreme 11HT is an easy to use two part epoxy adhesive/sealant combining both high shear and high peel strengths along with a relatively fast cure at room temperature. Sup..
Cure Time	35.000 - 45.0 min @Temperature 149 °C	0.58333 - 0.750 hour @Temperature 300 °F
Master Bond Supreme 10HTND-3 Non-Drip Epoxy Resists High Temperatures Description: Master Bond Supreme 10HTND-3 features a blend of performance properties including both high shear and peel strengths along with a totally non-drip application feature. This one componen..