Processing Properties | Metric | English | Comments |
---|---|---|---|
Cure Time | 0.167 min @Temperature 200 °C |
0.00278 hour @Temperature 392 °F |
|
Tra-Con Tra-Bond 77-1S One Component SMD Adhesive TRA-BOND 77-1S one component, solvent-free, insulating epoxy adhesive is designed specifically for attaching surface mounted devices (SMDs) to printed circuit boards prior to wave solder. TRA-BOND 7.. |