Polymer Property : Cure Time = 0.00278 hour Product List

Processing Properties

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Processing Properties	Metric	English	Comments
Cure Time	0.167 min @Temperature 200 °C	0.00278 hour @Temperature 392 °F
Tra-Con Tra-Bond 77-1S One Component SMD Adhesive TRA-BOND 77-1S one component, solvent-free, insulating epoxy adhesive is designed specifically for attaching surface mounted devices (SMDs) to printed circuit boards prior to wave solder. TRA-BOND 7..