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Polymer Property : Cure Time = 0.250 hour Product List
Processing PropertiesTips: 30 items are displayed at most. For the rest of the results, please contact customer service.
| Processing Properties | Metric | English | Comments |
|---|---|---|---|
| Cure Time | 15.0 min @Temperature 113 °C |
0.250 hour @Temperature 235 °F |
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| Parker Chomerics CHO-BOND 584-29 Conductive Adhesive Two-component, highly conductive adhesive system that combines the good adhesive characteristics of epoxy with the superior conductivity of silver. In addition to being available in bulk form, the m.. |
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| Cure Time | 15.0 min @Temperature 23.0 °C |
0.250 hour @Temperature 73.4 °F |
Aluminum, handling strength |
| Permabond HL138 Anaerobic Retaining Compound Permabond® HL138 is a single component liquid that cures only when in contact with metal parts and oxygen is excluded. The liquid adhesive fills the “air space” between parts and upon cure which .. |
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| Cure Time | 15.0 min @Temperature 23.0 °C |
0.250 hour @Temperature 73.4 °F |
M10 steel, handling strength |
| Permabond LM113 Anaerobic Threadlocker Permabond® LM113 Threadlocker is a medium viscosity product for locking small threaded fasteners, such as screws and bolts or hydraulic fittings that might require disassembly. Due to its thixotrop.. |
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| Cure Time | 15.0 min @Temperature 150 °C |
0.250 hour @Temperature 302 °F |
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| Lord Adhesives Thermosetâ„¢ MD-110 Conductive Adhesive LORD Thermosetâ„¢ MD-110 silver-filled conductive adhesive offers excellent electrical conductivity and room temperature stability. It is designed for use with automated dispensing, stamping and.. |
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| Cure Time | 15.0 min @Temperature 130 °C |
0.250 hour @Temperature 266 °F |
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| Gwent Electronic Materials C2050804D9 Platinum Polymer Ink Platinum Ink is a screen printable ink designed for printing working electrodes in electrochemical sensor applications. The ink is designed for curing on polymer substrates. Screen Printing Equipme.. |
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| Cure Time | 15.0 min @Temperature 130 °C |
0.250 hour @Temperature 266 °F |
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| Gwent Electronic Materials D2070423D5 Polymer Dielectric Grey colored screen printable polymer dielectric, suitable for defining electrode areas and forms a protective layer over the electrode tracking during immersion of the electrode. The formulation i.. |
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| Cure Time | 15.0 min @Temperature 100 °C |
0.250 hour @Temperature 212 °F |
|
| Tra-Con Tra-Bond F230 Color Keyed High Temperature Epoxy Adhesive TRA-BOND F230 is a clear, low viscosity, high temperature, two-part epoxy adhesive that changes colors during the curing process to indicate cure status. The unmixed components are light yellow; the.. |
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| Cure Time | 15.0 min @Temperature 100 °C |
0.250 hour @Temperature 212 °F |
|
| Tra-Con Tra-Bond JL01 High Viscosity High Temperature Fiber Optic Adhesive TRA-BOND JL01 is a high viscosity, two-component epoxy formulation that is suggested for bonding fiber optic bundles, potting glass fibers, and terminating single or multi-channel fiber optic connec.. |
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| Cure Time | 15.0 min @Temperature 100 °C |
0.250 hour @Temperature 212 °F |
|
| Tra-Con Tra-Duct 2958 Snap Cure Conductive Silver Epoxy Adhesive TRA-DUCT 2958 is a two-part, smooth paste of specially refined and processed epoxy and silver components, recommended for electronic, microelectronic and die-attach bonding and sealing applications .. |
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| Cure Time | 15.0 min @Temperature 100 °C |
0.250 hour @Temperature 212 °F |
|
| Trelleborg Emerson & Cuming Eccobond® 927-10 E Needle Bonding Epoxy Adhesive Emerson & Cuming 927-10 E Eccobond® Needle Bonding Epoxy AdhesiveOne component, fast curing, epoxy adhesive for needle bonding with polypropylene hubs. Also recommended for bonding sealing or insul.. |
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| Cure Time | 15.0 min @Temperature 25.0 °C |
0.250 hour @Temperature 77.0 °F |
Tack Free |
| Chesterton ARC MX5 Rapid Curing Fine Particle Wear Compound Description: An advanced ceramic reinforced composite for the emergency repair and protection of all metal surfaces subjected to severe erosion, corrosion, and chemical attack. It is applied at a th.. |
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| Cure Time | 15.0 min @Temperature 177 °C |
0.250 hour @Temperature 350 °F |
Recommended Cure Cycle |
| Arlon 30570R015 0.015" Uncured, Unsupported Silicone Rubber on Release Carrier Design/Construction:Side 1: Uncured, Unsupported Silicone RubberSubstrate: Kodacel CarrierInterleave: 0.003" PolyethyleneThis data represents typical values for the production material and should.. |
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| Cure Time | 15.0 min @Temperature 177 °C |
0.250 hour @Temperature 350 °F |
Recommended Cure Cycle |
| Arlon 55579R028M 0.029" (0.737 mm) Uncured/Cured Silicone Rubber with Fiberglass Substrate Design/Construction:Side 1: Uncured layer on top of a cured layer on one side This data Represents typical values for the production material. The data should not be used to write, or in place of, m.. |
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| Cure Time | 15.0 min @Temperature 177 °C |
0.250 hour @Temperature 350 °F |
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| Arlon CP-375CR Silicone Rubber bulk compound |
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| Cure Time | 15.0 - 20.0 min @Temperature 121 - 177 °C |
0.250 - 0.333 hour @Temperature 250 - 350 °F |
Recommended Cure Cycle |
| Arlon CP-493C Bulk Compound This data represents typical values for the production material. The data should not be used to write, or in place of, material specifications.Information provided by Arlon, Silicone Technologies Di.. |
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| Cure Time | 15.0 - 20.0 min @Temperature 121 - 177 °C |
0.250 - 0.333 hour @Temperature 250 - 350 °F |
Recommended Cure Cycle |
| Arlon CP-494 Bulk Compound This data represents typical values for the production material. The data should not be used to write, or in place of, material specifications.Information provided by Arlon, Silicone Technologies Di.. |
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| Cure Time | 15.0 min @Temperature 177 °C |
0.250 hour @Temperature 350 °F |
Recommended Cure Cycle |
| Arlon R33920W028 0.028" (0.711 mm) Uncured Silicone Rubber with Fiberglass Substrate Design/Construction:Side 1: Uncured Silicone Rubber Appearance: White gum on glass fiber fabricThis data Represents typical values for the production material. The data should not be used to write, .. |
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| Cure Time | 15.0 min @Temperature 100 °C |
0.250 hour @Temperature 212 °F |
|
| Atom Adhesives AA-CARB 61 Epoxy Adhesive AA-CARB 61 is an epoxy adhesive and coating formulation based on conductive carbon. AA-CARB 61 is recommended for electronic bonding and sealing applications that require both fine electrical and me.. |
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| Cure Time | 15.0 min @Temperature 177 °C |
0.250 hour @Temperature 350 °F |
Recommended Cure Cycle |
| Arlon 51268R015P 0.015" (0.381 mm) Uncured/Cured Silicone Rubber with Fiberglass Substrate Design/Construction: Interleave: Polyethylene Side 2, Layer 2: Uncured Silicone Rubber Side 2, Layer 1: Cured Silicone Rubber Substrate: Style 7628 FiberglassSide 1: Cured Silicone RubberThis data r.. |
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| Cure Time | 15.0 - 20.0 min @Temperature 121 - 177 °C |
0.250 - 0.333 hour @Temperature 250 - 350 °F |
Recommended Cure Cycle |
| Arlon CP-339R Bulk Compound This data represents typical values for the production material. The data should not be used to write, or in place of, material specifications.Information provided by Arlon, Silicone Technologies Di.. |
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| Cure Time | 15.0 min @Temperature 65.0 °C |
0.250 hour @Temperature 149 °F |
|
| Tra-Con Tra-Bond 224-8 Room Temperature Cure Epoxy Adhesive TRA-BOND 224-8 room temperature cure epoxy adhesive is a thermally conductive version of 224-1. This adhesive develops structural strength rapidly. When cured at room temperature, this adhesive prov.. |
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| Cure Time | 15.0 min @Temperature 23.0 °C |
0.250 hour @Temperature 73.4 °F |
Brass, working strength |
| Permabond HM135 Anaerobic Retainer Permabond® HM135 is a fast curing, medium viscosity anaerobic adhesive for locking and sealing threads and retaining cylindrical components. It gives maximum torque strength on brass or plated bras.. |
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| Cure Time | 15.0 min @Temperature 23.0 °C |
0.250 hour @Temperature 73.4 °F |
Zinc, handling strength |
| Permabond MH052 Anaerobic Threadsealant Permabond® MH052 is ideal for the sealing of threaded joints. It is approved for use with natural gas and LPG for working pressure up to 20 bar (290 psi) and also for gaseous oxygen up to 10 bar (1.. |
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| Cure Time | 15.0 min @Temperature 23.0 °C |
0.250 hour @Temperature 73.4 °F |
M10 steel, handling strength |
| Permabond MH052 Anaerobic Threadsealant Permabond® MH052 is ideal for the sealing of threaded joints. It is approved for use with natural gas and LPG for working pressure up to 20 bar (290 psi) and also for gaseous oxygen up to 10 bar (1.. |
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| Cure Time | 15.0 min @Temperature 177 °C |
0.250 hour @Temperature 350 °F |
Recommended Cure Cycle |
| Arlon 45561R007 0.007"(0.178 mm) Uncured Rubber with Fiberglass Substrate Design/Construction:Side 1: Uncured RubberSide 2: Uncured RubberAppearance: Red silicone gum on fiberglass fabricThis data represents typical values for the production material. The data should not .. |
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| Cure Time | 15.0 min @Temperature 177 °C |
0.250 hour @Temperature 350 °F |
Recommended Cure Cycle |
| Arlon 32300R062 0.062" (1.57 mm) Uncured Silicone Rubber on PET Carrier Design/Construction: Interleave: PolyethyleneSide 1: Uncured Silicone RubberCarrier: PETAppearance: Red silicone gum on polymer release linerThis data represents typical values for the production ma.. |
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| Cure Time | 15.0 min @Temperature 80.0 °C |
0.250 hour @Temperature 176 °F |
|
| Gwent Electronic Materials C2000802P2 Carbon Graphite Ink This product is designed to be used for screen-printing working electrodes. This ink has been optimized to give superior electrochemical performance. It combines good line definition and good electr.. |
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