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Polymer Property : Thermal Conductivity = 7.56 BTU-in/hr-ft²-°F Product List

Thermal Properties

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Thermal Properties Metric English Comments
Thermal Conductivity 1.09 W/m-K
7.56 BTU-in/hr-ft²-°F
Epoxy Technology EPO-TEK® E2001-HV Electrically Conductive, Silver-Filled Epoxy
Product Description: EPO-TEK® E2001-HV Is a snap cure, two component, silver-filled die attach adhesive for semiconductor plastic IC packaging.Advantages & Application Notes:Snap cure adhesive or f..
Thermal Conductivity 1.09 W/m-K
7.56 BTU-in/hr-ft²-°F
Epoxy Technology EPO-TEK® E3001-HV Electrically Conductive, Silver Epoxy
Product Description: EPO-TEK® E3001-HV is a snap cure, single component, silver-filled die attach adhesive for semiconductor plastic IC packaging. Also available in a frozen syringe. Advantages & ..
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