Thermal Properties | Metric | English | Comments |
---|---|---|---|
Thermal Conductivity | 1.09 W/m-K | 7.56 BTU-in/hr-ft²-°F | |
Epoxy Technology EPO-TEK® E2001-HV Electrically Conductive, Silver-Filled Epoxy Product Description: EPO-TEK® E2001-HV Is a snap cure, two component, silver-filled die attach adhesive for semiconductor plastic IC packaging.Advantages & Application Notes:Snap cure adhesive or f.. |
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Thermal Conductivity | 1.09 W/m-K | 7.56 BTU-in/hr-ft²-°F | |
Epoxy Technology EPO-TEK® E3001-HV Electrically Conductive, Silver Epoxy Product Description: EPO-TEK® E3001-HV is a snap cure, single component, silver-filled die attach adhesive for semiconductor plastic IC packaging. Also available in a frozen syringe. Advantages & .. |