Songhan Plastic Technology Co.,Ltd.
 POLYMER SEARCH

Polymer Property : Thermal Conductivity = 2.30 W/m-K Product List

Thermal Properties

Tips: 30 items are displayed at most. For the rest of the results, please contact customer service.
Thermal Properties Metric English Comments
Thermal Conductivity 2.30 W/m-K
16.0 BTU-in/hr-ft²-°F
MarkeTech Zirconium Oxide Ceramic Zirconia, Tetragonal, Y2O3 Stabilized
Data provided by the supplier, MarkeTech International.Zirconium oxide is widely used and has superior high temperature properties. When combined with yttria the strength and fracture toughness is ..
Thermal Conductivity 2.30 W/m-K
16.0 BTU-in/hr-ft²-°F
JIS-R-2618; ASTM D2326
Fujipoly Industries Sarcon® GR-b Gap Filler Pad
Sarcon GR-b is a highly conformable, thermally conductive material in areas where space between surfaces is uneven and surface textures vary.Information provided by Fujipoly Industries
Thermal Conductivity 2.30 W/m-K
16.0 BTU-in/hr-ft²-°F
150°C for 1,000 hrs; JIS-R-2618
Fujipoly Industries Sarcon® GR-b Gap Filler Pad
Sarcon GR-b is a highly conformable, thermally conductive material in areas where space between surfaces is uneven and surface textures vary.Information provided by Fujipoly Industries
Thermal Conductivity 2.30 W/m-K
16.0 BTU-in/hr-ft²-°F
60°C for 1,000 hrs with 90% RH; JIS-R-2618
Fujipoly Industries Sarcon® GR-b Gap Filler Pad
Sarcon GR-b is a highly conformable, thermally conductive material in areas where space between surfaces is uneven and surface textures vary.Information provided by Fujipoly Industries
Thermal Conductivity 2.30 W/m-K
16.0 BTU-in/hr-ft²-°F
70°C for 1,000 hrs; JIS-R-2618; ASTM D2326
Fujipoly Industries Sarcon® GR-b Gap Filler Pad
Sarcon GR-b is a highly conformable, thermally conductive material in areas where space between surfaces is uneven and surface textures vary.Information provided by Fujipoly Industries
Thermal Conductivity 2.30 W/m-K
16.0 BTU-in/hr-ft²-°F
JIS-R-2618; ASTM D2326
Fujipoly Industries Sarcon® GR-Hb Gap Filler Pad
Sarcon GR-b is a highly conformable, thermally conductive material in areas where space between surfaces is uneven and surface textures vary.Information provided by Fujipoly Industries
Thermal Conductivity 2.30 W/m-K
16.0 BTU-in/hr-ft²-°F
150°C for 1,000 hrs; JIS-R-2618
Fujipoly Industries Sarcon® GR-Hb Gap Filler Pad
Sarcon GR-b is a highly conformable, thermally conductive material in areas where space between surfaces is uneven and surface textures vary.Information provided by Fujipoly Industries
Thermal Conductivity 2.30 W/m-K
16.0 BTU-in/hr-ft²-°F
60°C for 1,000 hrs with 90% RH; JIS-R-2618
Fujipoly Industries Sarcon® GR-Hb Gap Filler Pad
Sarcon GR-b is a highly conformable, thermally conductive material in areas where space between surfaces is uneven and surface textures vary.Information provided by Fujipoly Industries
Thermal Conductivity 2.30 W/m-K
16.0 BTU-in/hr-ft²-°F
70°C for 1,000 hrs; JIS-R-2618; ASTM D2326
Fujipoly Industries Sarcon® GR-Hb Gap Filler Pad
Sarcon GR-b is a highly conformable, thermally conductive material in areas where space between surfaces is uneven and surface textures vary.Information provided by Fujipoly Industries
Thermal Conductivity 2.30 W/m-K

@Temperature 1200 °C
16.0 BTU-in/hr-ft²-°F

@Temperature 2190 °F
Zircar Ceramics DAHP Dense Alumina Hearth Plate
ZIRCAR Dense Alumina Hearth Plates are used for supporting loads in high temperature furnaces and other thermal process systems. These dense plates are made of fully sintered fine grain high purity ..
Thermal Conductivity 2.30 W/m-K
16.0 BTU-in/hr-ft²-°F
ASTM E1461
Tra-Con Supertherm 826M01 High Performance Diamond Epoxy Adhesive
SUPERTHERM 826M01 is a one-part, smooth paste ULTRA HIGH THERMALLY CONDUCTIVE diamond filled epoxy adhesive recommended for semiconductor die-attach and other micro-electronic applications where the..
Thermal Conductivity 2.30 W/m-K
16.0 BTU-in/hr-ft²-°F
Epoxy Technology EPO-TEK® EE165-3 Silver Filled Epoxy
A two component, silver-filled, electrically conductive epoxy made for bonding of SMDs, and general solder replacement at the PCB level and circuit assembly. It was designed to be low modulus and f..
Thermal Conductivity 2.30 W/m-K
16.0 BTU-in/hr-ft²-°F
Product Property; ASTM E 1530
Arlon Thermabond® 99A60X008 0.008" (0.203 mm) Uncured Silicone Rubber with PTFE Coated Fiberglass Carrier
Description: Primerless Thermabond®: Electrically insulating, thermally conductive, electronic adhesive. Bonds without primer.Design/Construction: Liner: FEPProduct: Uncured Silicone Rubber Carrier..
Thermal Conductivity 2.30 W/m-K
16.0 BTU-in/hr-ft²-°F
3M W-210 Ceramic Microspheres
3M™ White Ceramic Microspheres are unique, semi-transparent, white-colored, fine particle size, high-strength microspheres. These products are typically used to reduce VOC levels; increase filler l..
Thermal Conductivity 2.30 W/m-K
16.0 BTU-in/hr-ft²-°F
3M W-410 Ceramic Microspheres
3M™ White Ceramic Microspheres are unique, semi-transparent, white-colored, fine particle size, high-strength microspheres. These products are typically used to reduce VOC levels; increase filler l..
Thermal Conductivity 2.30 W/m-K
16.0 BTU-in/hr-ft²-°F
3M W-610 Ceramic Microspheres
3M™ White Ceramic Microspheres are unique, semi-transparent, white-colored, fine particle size, high-strength microspheres. These products are typically used to reduce VOC levels; increase filler l..
Copyright © lookpolymers.com All Rights Reserved