Thermal Properties | Metric | English | Comments |
---|---|---|---|
Thermal Conductivity | 0.261 W/m-K @Temperature 100 °C |
1.81 BTU-in/hr-ft²-°F @Temperature 212 °F |
ASTM E1225 |
Arlon CuClad 217 PTFE/Woven Fiberglass Laminate Microwave Printed Circuit Board Substrate CuClad 217 uses a low fiberglass/PTFE ratio to provide the lowest dielectric constant and dissipation factor available in fiberglass reinforced PTFE based laminates. Together, these properties offe.. |
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Thermal Conductivity | 0.261 W/m-K @Temperature 100 °C |
1.81 BTU-in/hr-ft²-°F @Temperature 212 °F |
ASTM E1225 |
Arlon DiClad 880 PTFE/Woven Fiberglass Laminate Extremely Low Loss TangentExcellent Dimensional StabilityProduct Performance UniformityBenefits:Electrical Properties are highly uniform across frequencyConsistent Mechanical PerformanceExcellent Ch.. |